公开(公告)号：US10403586B2

公开(公告)日：2019-09-03

申请号：US15888632

申请日：2018-02-05

Applicant: Keyssa Systems, Inc.

Inventor： Mostafa Naguib Abdulla ,  Mohamed Sameh Mahmoud ,  Alan Besel ,  Eric Sweetman ,  Bojana Zivanoic ,  Giriraj Mantrawadi

IPC: H01L23/64 ,  H05K1/18 ,  H04B15/00 ,  H05K9/00 ,  H05K1/02

Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.

公开(公告)号：US10454526B1

公开(公告)日：2019-10-22

申请号：US15398588

申请日：2017-01-04

Applicant: Keyssa Systems, Inc.

Inventor： Ahmed Khidre ,  Mohamed Sameh Mahmoud ,  Eric Sweetman

IPC: H04M1/00 ,  H04B3/32 ,  H05K9/00 ,  H04M1/02

Abstract: Systems and apparatuses for electromagnetic communications are provided. One of the apparatuses includes a housing portion for an electronic device, wherein the housing portion comprises: a first region formed from a first material; and a second region comprising an arrangement of structures formed from the first material and a second material, wherein the arrangement of structures reduce propagation of electromagnetic radiation propagating through the second region.

公开(公告)号：US20180182723A1

公开(公告)日：2018-06-28

申请号：US15888632

申请日：2018-02-05

Applicant: Keyssa Systems, Inc.

Inventor： Mostafa Naguib Abdulla ,  Mohamed Sameh Mahmoud ,  Alan Besel ,  Eric Sweetman ,  Bojana Zivanoic ,  Giriraj Mantrawadi

IPC: H01L23/64 ,  H05K1/18 ,  H04B15/00

CPC classification number: H01L23/64 ,  H01L24/00 ,  H01L2224/48091 ,  H01L2924/181 ,  H04B15/00 ,  H05K1/0216 ,  H05K1/181 ,  H05K9/006 ,  H05K2201/10371 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.

公开(公告)号：US20170263576A1

公开(公告)日：2017-09-14

申请号：US15068417

申请日：2016-03-11

Applicant: Keyssa Systems, Inc.

Inventor： Mostafa Naguib Abdulla ,  Mohamed Sameh Mahmoud ,  Alan Besel ,  Eric Sweetman ,  Bojana Zivanoic ,  Giriraj Mantrawadi

IPC: H01L23/64 ,  H05K1/18

CPC classification number: H01L23/64 ,  H01L2224/48091 ,  H01L2924/181 ,  H04B15/00 ,  H05K1/0216 ,  H05K1/181 ,  H05K9/006 ,  H05K2201/10371 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.

公开(公告)号：US10651892B1

公开(公告)日：2020-05-12

申请号：US16560524

申请日：2019-09-04

Applicant: Keyssa Systems, Inc.

Inventor： Ahmed Khidre ,  Mohamed Sameh Mahmoud ,  Eric Sweetman

IPC: H04M1/00 ,  H04B3/32 ,  H04M1/02 ,  H05K9/00

Abstract: Systems and apparatuses for electromagnetic communications are provided. One of the apparatuses includes a housing portion for an electronic device, wherein the housing portion comprises: a first region formed from a first material; and a second region comprising an arrangement of structures formed from the first material and a second material, wherein the arrangement of structures reduce propagation of electromagnetic radiation propagating through the second region.

公开(公告)号：US09887169B2

公开(公告)日：2018-02-06

申请号：US15068417

申请日：2016-03-11

Applicant: Keyssa Systems, Inc.

Inventor： Mostafa Naguib Abdulla ,  Mohamed Sameh Mahmoud ,  Alan Besel ,  Eric Sweetman ,  Bojana Zivanoic ,  Giriraj Mantrawadi

IPC: H01Q19/00 ,  H01B5/00 ,  H01L23/64 ,  H05K1/18 ,  H04B15/00

CPC classification number: H01L23/64 ,  H01L2224/48091 ,  H01L2924/181 ,  H04B15/00 ,  H05K1/0216 ,  H05K1/181 ,  H05K9/006 ,  H05K2201/10371 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.