公开(公告)号：US08610006B2

公开(公告)日：2013-12-17

申请号：US12604907

申请日：2009-10-23

Applicant: Shih-Ping Hsu ,  Kun-Chen Tsai ,  Micallaef Ivan

Inventor： Shih-Ping Hsu ,  Kun-Chen Tsai ,  Micallaef Ivan

IPC: H01L23/28

CPC classification number: H05K9/0084 ,  B81B7/0061 ,  B81B7/0064 ,  B81B2201/0257 ,  H04R19/005

Abstract: A lid for a micro-electro-mechanical device and a method for fabricating the same are provided. The lid includes a board with opposite first and second surfaces and a first conductor layer. The first surface has a first metal layer thereon. The first metal layer and the board have a recess formed therein. The recess has a bottom surface and a side surface adjacent thereto. The first conductor layer is formed on the first metal layer and the bottom and side surfaces of the recess. The shielding effect of the side surface of the board is enhanced because of the recess integral to the board, the homogeneous bottom and side surfaces of the recess, and the first conductor layer covering the first metal layer, the bottom and side surfaces of the recess.

Abstract translation: 提供了一种微机电装置用盖及其制造方法。 盖子包括具有相对的第一和第二表面的板和第一导体层。 第一表面上具有第一金属层。 第一金属层和板具有形成在其中的凹部。 凹部具有底表面和与其相邻的侧表面。 第一导体层形成在第一金属层和凹部的底部和侧表面上。 板的侧面的屏蔽效果由于与板的整体凹部，凹部的均匀的底部和侧表面以及覆盖第一金属层的第一导体层，凹部的底部和侧表面而增强 。

公开(公告)号：US08302297B2

公开(公告)日：2012-11-06

申请号：US12649501

申请日：2009-12-30

Applicant: Kun-Chen Tsai

Inventor： Kun-Chen Tsai

IPC: H01K3/10

CPC classification number: H05K3/205 ,  H01L2924/0002 ,  H05K3/423 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/09563 ,  H05K2201/09881 ,  Y10T29/49128 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Provided are a circuit board structure and a fabrication method thereof, including the steps of: forming a first circuit layer in a first dielectric layer and exposing the first circuit layer therefrom; forming a second dielectric layer on the first dielectric layer and the first circuit layer, and forming a second circuit layer on the second dielectric layer; forming a plurality of first conductive vias in the second dielectric layer for electrically connecting to the first circuit layer to thereby dispense with a core board and electroplated holes and thus facilitate miniaturization. Further, the first dielectric layer is liquid before being hardened and is formed on the first dielectric layer that enhances the bonding between layers of the circuit board and the structure.

Abstract translation: 提供一种电路板结构及其制造方法，包括以下步骤：在第一电介质层中形成第一电路层，并从其露出第一电路层; 在所述第一电介质层和所述第一电路层上形成第二电介质层，以及在所述第二电介质层上形成第二电路层; 在第二电介质层中形成多个第一导电通孔，用于电连接到第一电路层，从而省去芯板和电镀孔，从而便于小型化。 此外，第一电介质层在硬化之前是液体，并且形成在增强电路板的层之间的结合的第一电介质层和结构之间。

公开(公告)号：US06615630B2

公开(公告)日：2003-09-09

申请号：US09730093

申请日：2000-12-05

Applicant: Rong-Faa Wu ,  Kun-Chen Tsai ,  Po-Yang Chen

Inventor： Rong-Faa Wu ,  Kun-Chen Tsai ,  Po-Yang Chen

IPC: E05B1310

CPC classification number: E05B13/005 ,  E05B13/108 ,  E05B55/005 ,  Y10T70/5416 ,  Y10T70/5496 ,  Y10T70/5827 ,  Y10T70/5832 ,  Y10T292/57

Abstract: A door lock includes an outside spindle tube, an insert tube which is disposed inside the outside spindle tube and which has a latch operating tab, and a clutch member disposed inside the insert tube and having first and second axial grooves. The clutch member is movable axially between a first position, in which the first axial groove engages a first engaging member projecting inwardly from the outside spindle tube, and a second position, in which the first axial groove disengages from the first engaging member. The insert tube does not engage the first engaging member of the outside spindle tube, but has a second engaging member in engagement with the second axial groove of the clutch member. When the door lock is placed in a locking position by pressing an inside press button of the door lock, the spindle shaft connected with the press button moves the clutch member to the second position, thereby permitting the outside spindle tube to turn independently of the insert tube. As such, possible damage due to the forced turning of the outside handle during the locking state of the door lock can be avoided.

公开(公告)号：US08786108B2

公开(公告)日：2014-07-22

申请号：US13161685

申请日：2011-06-16

Applicant: Kun-Chen Tsai

Inventor： Kun-Chen Tsai

IPC: H01L23/488

CPC classification number: H01L24/85 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85411 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A package structure is provided, which includes a dielectric layer having opposing first and second surfaces, and through holes penetrating the surfaces; a strengthening layer formed on the first surface; a circuit layer formed on the second surface, and having wire bonding pads formed thereon and exposed from the through holes, and ball pads electrically connected to the wire bonding pads; a first solder mask layer formed on the first surface and the strengthening layer, and having first apertures formed therethrough for exposing the wire bonding pads; a second solder mask layer formed on the second surface and the circuit layer, and having second apertures formed therethrough for exposing the ball pads; and a semiconductor chip disposed on the first solder mask layer and electrically connected via conductive wires to the wire bonding pads exposed from the through holes. The strengthening layer ensures the steadiness of the chip to be mounted thereon without position shifting.

Abstract translation: 提供一种封装结构，其包括具有相对的第一和第二表面的电介质层和穿透表面的通孔; 形成在所述第一表面上的强化层; 形成在第二表面上并具有形成在其上并从通孔暴露的引线接合焊盘的电路层，以及电连接到引线接合焊盘的焊盘; 形成在所述第一表面和所述强化层上的第一焊料掩模层，并且具有穿过其形成的用于暴露所述引线接合焊盘的第一孔; 形成在所述第二表面和所述电路层上的第二焊料掩模层，并且具有穿过其形成的用于暴露所述球垫的第二孔; 以及设置在第一焊料掩模层上并通过导线电连接到从通孔露出的引线接合焊盘的半导体芯片。 加强层确保了在没有位置偏移的情况下安装在其上的芯片的稳定性。

公开(公告)号：US20110259059A1

公开(公告)日：2011-10-27

申请号：US13091295

申请日：2011-04-21

Applicant: Rong-Faa WU ,  Tong-Yi Ho ,  Kun-Chen Tsai ,  Chen-Ming Lin ,  Ching-Chuan Kuo

Inventor： Rong-Faa WU ,  Tong-Yi Ho ,  Kun-Chen Tsai ,  Chen-Ming Lin ,  Ching-Chuan Kuo

IPC: E05B47/00 ,  E05B65/00

CPC classification number: E05B47/0012 ,  E05B9/00 ,  E05B47/026 ,  E05B63/0017 ,  E05B63/04 ,  E05B2047/002 ,  E05B2047/0026 ,  E05B2047/0067 ,  E05B2047/0085 ,  Y10T70/5155 ,  Y10T70/5827 ,  Y10T70/7102 ,  Y10T70/7107 ,  Y10T70/7113 ,  Y10T70/8027 ,  Y10T292/1018 ,  Y10T292/1021

Abstract: An electric door lock including: a lock housing; an operating member having a holding part and a shaft part, the shaft part able to be placed in the lock housing, the shaft part connected to the holding part, the holding part defined as a long axis; a cog wheel able to be placed in the lock housing, the cog wheel having at least one bump; a coupling plate installed on the shaft part of the operating member, the coupling plate having at least one bulge and one protruding part, with the protruding part and the long axis of the holding part designed to move in alignment with each other; a motor placed in the lock housing; three sensor switches set separately in the lock housing; operating the motor causing the bump of the cog wheel to rotate and push the bulge of the coupling plate, so that the protruding part of the coupling plate of the electric door lock installed in the required position on a left-hand door or right-hand door, selectively touches the two sensor switches adjacent to each other, so as to reach the correct unlocked position or locked position.

Abstract translation: 一种电动门锁，包括：锁壳; 具有保持部和轴部的操作构件，所述轴部能够被放置在所述锁定壳体中，所述轴部连接到所述保持部，所述保持部被限定为长轴; 能够放置在所述锁壳体中的齿轮，所述齿轮具有至少一个凸块; 安装在所述操作构件的所述轴部上的联接板，所述联接板具有至少一个凸起和一个突出部分，所述保持部件的突出部分和长轴线被设计成彼此对准地移动; 放置在锁壳内的电机; 三个传感器开关分别设在锁壳内; 操作电动机使得齿轮的凸起旋转并推动联接板的凸起，使得电动门锁的联接板的突出部分安装在左侧门或右手的所需位置 门，有选择地接触彼此相邻的两个传感器开关，以便达到正确的解锁位置或锁定位置。

公开(公告)号：US20100108345A1

公开(公告)日：2010-05-06

申请号：US12604907

申请日：2009-10-23

Applicant: Shih-Ping Hsu ,  Kun-Chen Tsai ,  Micallaef Ivan

Inventor： Shih-Ping Hsu ,  Kun-Chen Tsai ,  Micallaef Ivan

IPC: H05K5/00 ,  H05K13/00 ,  B05D5/12

CPC classification number: H05K9/0084 ,  B81B7/0061 ,  B81B7/0064 ,  B81B2201/0257 ,  H04R19/005

Abstract: A lid for a micro-electro-mechanical device and a method for fabricating the same are provided. The lid includes a board with opposite first and second surfaces and a first conductor layer. The first surface has a first metal layer thereon. The first metal layer and the board have a recess formed therein. The recess has a bottom surface and a side surface adjacent thereto. The first conductor layer is formed on the first metal layer and the bottom and side surfaces of the recess. The shielding effect of the side surface of the board is enhanced because of the recess integral to the board, the homogeneous bottom and side surfaces of the recess, and the first conductor layer covering the first metal layer, the bottom and side surfaces of the recess. Hence, the shielding effect upon the micro-electro-mechanical device is enhanced.

Abstract translation: 提供了一种微机电装置用盖及其制造方法。 盖子包括具有相对的第一和第二表面的板和第一导体层。 第一表面上具有第一金属层。 第一金属层和板具有形成在其中的凹部。 凹部具有底表面和与其相邻的侧表面。 第一导体层形成在第一金属层和凹部的底部和侧表面上。 板的侧面的屏蔽效果由于与板的整体凹部，凹部的均匀的底部和侧表面以及覆盖第一金属层的第一导体层，凹部的底部和侧表面而增强 。 因此，增强了对微机电装置的屏蔽效果。

公开(公告)号：US07485970B2

公开(公告)日：2009-02-03

申请号：US11448420

申请日：2006-06-06

Applicant: Shih-Ping Hsu ,  Kun-Chen Tsai

Inventor： Shih-Ping Hsu ,  Kun-Chen Tsai

IPC: H01L23/48

CPC classification number: H01L24/02 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K1/113 ,  H05K3/108 ,  H05K3/243 ,  H05K3/28 ,  H05K3/423 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0574 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00

Abstract: A semiconductor package substrate and a method for fabricating the same are proposed. An insulating layer has a plurality of blind vias to expose inner traces underneath the insulating layer. A conductive film is formed on the insulating layer and over the bind vias. A first resist is formed on the conductive film, having openings to expose parts of the conductive film. A patterned trace layer including a plurality of contact pads is formed in the openings and the blind vias to form conductive vias, with at least one contact pad electrically connected to one conductive via. A second resist is formed on the patterned trace layer without covering the contact pads. A metal barrier layer is formed on the contact pads. Finally, the first and second resists and parts of the conductive film covered the first resist are removed.

Abstract translation: 提出了半导体封装基板及其制造方法。 绝缘层具有多个盲孔以暴露绝缘层下方的内部迹线。 在绝缘层上和结合通孔上形成导电膜。 第一抗蚀剂形成在导电膜上，具有露出导电膜部分的开口。 在开口和盲孔中形成包括多个接触焊盘的图案化迹线层，以形成导电通路，其中至少一个接触焊盘电连接到一个导电通孔。 在图案化的迹线层上形成第二抗蚀剂而不覆盖接触焊盘。 在接触焊盘上形成金属阻挡层。 最后，去除覆盖第一抗蚀剂的导电膜的第一和第二抗蚀剂和部分。

公开(公告)号：US20050082672A1

公开(公告)日：2005-04-21

申请号：US10876475

申请日：2004-06-28

Applicant: Shih-Ping Hsu ,  Kun-Chen Tsai

Inventor： Shih-Ping Hsu ,  Kun-Chen Tsai

IPC: H01L21/48 ,  H01L23/498 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/28 ,  H05K3/38 ,  H01L23/48

CPC classification number: H01L23/49866 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K3/062 ,  H05K3/108 ,  H05K3/244 ,  H05K3/28 ,  H05K3/388 ,  H05K2203/054 ,  H05K2203/0597 ,  H01L2924/00

Abstract: A circuit barrier structure of a semiconductor packaging substrate and a method for fabricating the same, forming a metal conductive layer on an insulating layer of the substrate and a patterned resist layer on the metal conductive layer. The patterned resist layer has a plurality of holes to expose predetermined parts of the metal conductive layer. A metal barrier layer is formed on the resist layer and in the holes. A patterned circuit layer is electroplated in the holes of the resist layer after removing the metal barrier layer on the resist layer. The resist layer and the metal conductive layer underneath the resist layer are removed. Another metal barrier layer can be formed on the circuit layer. The patterned circuit layer is covered by the metal barrier layers to prevent damage from etching to the circuit layer and inhibit migration of metal particles in the circuit layer.

Abstract translation: 半导体封装基板的电路阻挡结构及其制造方法，在基板的绝缘层上形成金属导电层，在金属导电层上形成图案化的抗蚀剂层。 图案化的抗蚀剂层具有多个孔以暴露金属导电层的预定部分。 在抗蚀剂层和孔中形成金属阻挡层。 在除去抗蚀剂层上的金属阻挡层之后，在抗蚀剂层的孔中电镀图案化的电路层。 去除抗蚀剂层下面的抗蚀剂层和金属导电层。 可以在电路层上形成另一金属阻挡层。 图案化电路层被金属阻挡层覆盖，以防止腐蚀到电路层的损伤并且抑制金属颗粒在电路层中的迁移。

公开(公告)号：US20120049363A1

公开(公告)日：2012-03-01

申请号：US13161685

申请日：2011-06-16

Applicant: Kun-Chen Tsai

Inventor： Kun-Chen Tsai

IPC: H01L23/488

CPC classification number: H01L24/85 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85411 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A package structure is provided, which includes a dielectric layer having opposing first and second surfaces, and through holes penetrating the surfaces; a strengthening layer formed on the first surface; a circuit layer formed on the second surface, and having wire bonding pads formed thereon and exposed from the through holes, and ball pads electrically connected to the wire bonding pads; a first solder mask layer formed on the first surface and the strengthening layer, and having first apertures formed therethrough for exposing the wire bonding pads; a second solder mask layer formed on the second surface and the circuit layer, and having second apertures formed therethrough for exposing the ball pads; and a semiconductor chip disposed on the first solder mask layer and electrically connected via conductive wires to the wire bonding pads exposed from the through holes. The strengthening layer ensures the steadiness of the chip to be mounted thereon without position shifting.

Abstract translation: 提供一种封装结构，其包括具有相对的第一和第二表面的电介质层和穿透表面的通孔; 形成在所述第一表面上的强化层; 形成在第二表面上并具有形成在其上并从通孔暴露的引线接合焊盘的电路层，以及电连接到引线接合焊盘的焊盘; 形成在所述第一表面和所述强化层上的第一焊料掩模层，并且具有穿过其形成的用于暴露所述引线接合焊盘的第一孔; 形成在所述第二表面和所述电路层上的第二焊料掩模层，并且具有穿过其形成的用于暴露所述球垫的第二孔; 以及设置在第一焊料掩模层上并通过导电线电连接到从通孔露出的引线接合焊盘的半导体芯片。 加强层确保了在没有位置偏移的情况下安装在其上的芯片的稳定性。

公开(公告)号：US20120032282A1

公开(公告)日：2012-02-09

申请号：US13198029

申请日：2011-08-04

Applicant: Kun-Chen Tsai

Inventor： Kun-Chen Tsai

IPC: H01L29/84 ,  H01L21/02

CPC classification number: B81B7/0064 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An MEMS carrier is provided that includes a core board having a first surface and an opposite second surface, a circuit layer formed on the first surface and having a plurality of conductive pads, and a through hole formed through the first and the second surfaces; a carrier layer formed on the second surface of the core board and covering an end of the through hole; a patterned metal layer formed on a portion of the carrier layer that covers the end of the through hole; a solder mask layer formed on the first surface of the core board and the circuit layer, wherein the solder mask layer has a plurality of openings for exposing the conductive pads; and a shielding metal layer disposed on a sidewall of the through hole, the patterned metal layer, and the portion of the carrier layer that covers the end of the through hole. Without the use of a circuit board, the MEMS carrier has reduced height and size.

Abstract translation: 提供了一种MEMS载体，其包括具有第一表面和相对的第二表面的芯板，形成在第一表面上并具有多个导电焊盘的电路层，以及通过第一和第二表面形成的通孔; 形成在所述芯板的第二表面上并覆盖所述通孔的端部的载体层; 形成在载体层的覆盖通孔的端部的部分上的图案化金属层; 形成在所述芯板的第一表面和所述电路层上的焊料掩模层，其中所述焊接掩模层具有用于暴露所述导电焊盘的多个开口; 以及设置在通孔的侧壁，图案化金属层和覆盖通孔的端部的载体层的部分的屏蔽金属层。 在不使用电路板的情况下，MEMS载体具有减小的高度和尺寸。