公开(公告)号：US5329240A

公开(公告)日：1994-07-12

申请号：US64948

申请日：1993-05-20

Applicant: Katsuhisa Kubota ,  Kunitoshi Yamamoto ,  Kazuharu Nakano

Inventor： Katsuhisa Kubota ,  Kunitoshi Yamamoto ,  Kazuharu Nakano

IPC: G01R31/28 ,  G06F1/10 ,  G06F11/24 ,  H03L7/00 ,  H03K5/13

CPC classification number: G06F11/24

Abstract: A clock adjustment system for economically adjusting the output phases of a printed circuit board and an IC comprises a gate circuit for connecting an input of a measured circuit to an output. By turning the gate circuit on and by observing the oscillation of a measured circuit, the phase of the measured circuit is adjusted.

Abstract translation: 用于经济地调节印刷电路板和IC的输出相位的时钟调节系统包括用于将测量电路的输入连接到输出的门电路。 通过打开门电路，并通过观察测量电路的振荡，调节测量电路的相位。

公开(公告)号：US5363294A

公开(公告)日：1994-11-08

申请号：US858949

申请日：1992-03-27

Applicant: Kunitoshi Yamamoto ,  Hiroshi Fukushima

Inventor： Kunitoshi Yamamoto ,  Hiroshi Fukushima

IPC: F21V7/00 ,  F21V8/00 ,  G02F1/13357 ,  F21V7/04

CPC classification number: F21V7/00 ,  G02B6/0001 ,  G02F1/133615

Abstract: A surface light source device includes a light guiding plate which is transparent, a line light source provided on one end edge of the light guiding plate, an end edge reflection layer provided on the other end edge of the light guiding plate, and a light diffusion/transmission section provided on a back face of the light guiding plate. A ratio of an area of the light diffusion/transmission section to a whole area of the back face of the light guiding plate gradually increases with an increase in distance from the light source end edge in a region from the end edge on the light source end of the light guiding plate to a position at which a surface emission luminance of the light guiding plate is lowest, and is constant in a region from the position to the other end edge on the end edge reflection layer end of the light guiding plate. A back face reflection layer which is white is provided on the back face of the light guiding plate.

Abstract translation: 表面光源装置包括透明的导光板，设置在导光板的一端边缘上的线光源，设置在导光板的另一端缘上的端边反射层，以及光扩散 传递部分设置在导光板的背面上。 光扩散/透射部分的面积与导光板的背面的整个面积的比率随着在光源端的端边缘的区域中距光源端边缘的距离的增加而逐渐增加 导光板的表面发射亮度最低的位置，并且在从导光板的端边缘反射层端部的位置到另一端边缘的区域中是恒定的。 在导光板的背面设置有白色的背面反射层。

公开(公告)号：US06733954B2

公开(公告)日：2004-05-11

申请号：US10396419

申请日：2003-03-26

Applicant: Kunitoshi Yamamoto ,  Koichiro Tsuji

Inventor： Kunitoshi Yamamoto ,  Koichiro Tsuji

IPC: G03C556

CPC classification number: H01L23/13 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49805 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0206 ,  H05K1/141 ,  H05K3/0052 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/108 ,  H05K3/184 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/049 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2203/1407 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Through holes are formed at four peripheral edges of a plurality of semiconductor chip placement regions of an insulating substrate, except for coupling portions partially arranged thereat. A substrate sheet for semiconductor module is used in which connecting portions between inner lead portions and outer lead portions arranged on both surfaces of the substrate are formed in pattern on the side wall surface of the through hole. The semiconductor chip is mounted on each region, electrode terminals thereof and the inner lead portions are electrically connected to each other, the chip is sealed, and then the coupling portions are cut.

Abstract translation: 绝缘基板的多个半导体芯片配置区域的四个周缘形成通孔，除了部分地布置在其上的耦合部分之外。 使用半导体模块用基板，其中，设置在基板的两面的内引线部和外引线部之间的连接部形成为贯通孔的侧壁面。 半导体芯片安装在每个区域上，其电极端子和内引线部分彼此电连接，芯片被密封，然后切断连接部分。

公开(公告)号：US06573028B1

公开(公告)日：2003-06-03

申请号：US09601766

申请日：2000-08-08

Applicant: Kunitoshi Yamamoto ,  Koichiro Tsuji

Inventor： Kunitoshi Yamamoto ,  Koichiro Tsuji

IPC: G03C556

CPC classification number: H01L23/13 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49805 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0206 ,  H05K1/141 ,  H05K3/0052 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/108 ,  H05K3/184 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/049 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2203/1407 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Through holes are formed at four peripheral edges of a plurality of semiconductor chip placement regions of an insulating substrate, except for coupling portions partially arranged thereat. A substrate sheet for semiconductor module is used in which connecting portions between inner lead portions and outer lead portions arranged on both surfaces of the substrate are formed in pattern on the side wall surface of the through hole. The semiconductor chip is mounted on each region, electrode terminals thereof and the inner lead portions are electrically connected to each other, the chip is sealed, and then the coupling portions are cut.

Abstract translation: 绝缘基板的多个半导体芯片配置区域的四个周缘形成通孔，除了部分地布置在其上的耦合部分之外。 使用半导体模块用基板，其中，设置在基板的两面的内引线部和外引线部之间的连接部形成为贯通孔的侧壁面。 半导体芯片安装在每个区域上，其电极端子和内引线部分彼此电连接，芯片被密封，然后切断连接部分。

公开(公告)号：US5612962A

公开(公告)日：1997-03-18

申请号：US70412

申请日：1993-06-04

Applicant: Toshiro Sato ,  Kunitoshi Yamamoto ,  Hiroyuki Adachi

Inventor： Toshiro Sato ,  Kunitoshi Yamamoto ,  Hiroyuki Adachi

IPC: G01R31/317 ,  G01R31/3185 ,  G01R31/28

CPC classification number: G01R31/31855 ,  G01R31/317 ,  G01R31/318558 ,  G01R31/318577

Abstract: A pin-scan-in system driving circuit drives a pin-scan-in circuit to test short-circuit of the wirings or breaking of the wirings in the circuit-mounting substrate, and this circuit is driven using a reduced number of gates. The pin-scan-in system driving circuit drives the pin-scan-in circuit provided in an LSI logic circuit, and the LSI logic circuit is provided with a pin-scan-in circuit selector which selects the pin-scan-in circuit and a selected condition-holding circuit which holds the condition selected by the pin-scan-in circuit selector.

Abstract translation: PCT No.PCT / JP92 / 01289。 371日期：1993年6月4日 102（e）日期1993年6月4日PCT提交于1992年10月5日PCT公布。 公开号WO93 / 07502 日期：1993年04月15日引脚扫描系统驱动电路驱动引脚扫描电路以测试布线的短路或电路安装基板中的布线断线，并且该电路使用减少的 门数。 引脚扫描系统驱动电路驱动LSI逻辑电路中提供的引脚扫描电路，并且LSI逻辑电路设置有引脚扫描输入电路选择器，其选择引脚扫描输入电路和 选择状态保持电路，其保持由引脚扫描电路选择器选择的状态。

公开(公告)号：US06686824B1

公开(公告)日：2004-02-03

申请号：US09463630

申请日：2000-01-28

Applicant: Kunitoshi Yamamoto

Inventor： Kunitoshi Yamamoto

IPC: H01F706

CPC classification number: H05K1/165 ,  H01F17/0006 ,  H01F17/0033 ,  H02K3/26 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/403 ,  H05K2201/09063 ,  H05K2201/097 ,  Y10T29/49018 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A toroidal printed coil includes a plurality of annular holes (2) and a plurality of center holes (3) surrounded by the annular holes (2) in an insulating substrate (1). A plurality of annular juts (4), each comprising a portion surrounded by the annular hole (2) and the center hole (3), are formed. A printed coil sheet having a plurality of toroidal printed coils, in which a conductor film (6) is spirally formed at front-and-rear surfaces and side surfaces of annular portions (5) of the annular juts (4) with each annular portion taken as an axis, is obtained. With this printed coil sheet, a plurality of toroidal printed coils (P) are obtained by cutting the insulating substrate (1) off from the individual annular juts (4).

Abstract translation: 环形印刷线圈包括多个环形孔（2）和由绝缘基板（1）中的环形孔（2）围绕的多个中心孔（3）。 形成多个环状突起（4），每个环形突起（4）包括由环形孔（2）和中心孔（3）围绕的部分。 一种具有多个环形印刷线圈的印刷线圈片，其中导体膜（6）在环形突起（4）的环形部分（5）的前后表面和侧表面上螺旋形成，每个环形部分 取为轴。 利用该印刷线圈片，通过将绝缘基板（1）从单独的环形突起（4）切断而获得多个环形印刷线圈（P）。

公开(公告)号：US4728390A

公开(公告)日：1988-03-01

申请号：US832719

申请日：1986-02-13

Applicant: Kunitoshi Yamamoto ,  Yasuji Mori ,  Torayoshi Iwata

Inventor： Kunitoshi Yamamoto ,  Yasuji Mori ,  Torayoshi Iwata

IPC: B32B3/14 ,  B32B15/08 ,  H01F5/00 ,  H01F41/04 ,  C23F1/02 ,  B44C1/22 ,  C03C15/00 ,  C03C25/06

CPC classification number: H01F41/042 ,  H01F5/003 ,  Y10T29/4902 ,  Y10T29/49155

Abstract: A filmy coil comprising a metal conductive layer of the thin-line type having a spiral pattern on one side or both sides of an optional insulating substrate film or sheet, characterized in that the interval between each adjacent metal conductive line is smaller than the thickness of the metal conductive layer, and a manufacturing method for such a filmy coil characterized in that a photoresist layer, the patterns of both sides thereof being mirror images, is made up on both sides of the metal conductive foil or sheet, then both sides of the photoresist layer are etched to the depth of 30 to 40% of the thickness of the metal conductive foil or sheet by means of chemical etching, one side of the metal conductive foil or sheet is coated by an isolated resin coat or laminated with an isolated substrate film or sheet layer, the other side of said photoresist layer is etched also by means of chemical etching until the etching grooves on both sides pass through to be connected with each other, to produce a filmy coil in the form of a metal conductive layer on a thin-line type, and if desired, two filmy coils can be attached with each other at their undersides.

Abstract translation: PCT No.PCT / JP85 / 00334 Sec。 371日期1986年2月13日 102（e）日期1986年2月13日PCT归档1985年6月13日PCT公布。 出版物WO86 / 日期：1986年1月3日。一种薄膜线圈，其包括细线型金属导电层，其具有在任选的绝缘衬底膜或片的一侧或两侧上的螺旋图案，其特征在于，每个相邻金属导电 线小于金属导电层的厚度，以及这种膜状线圈的制造方法，其特征在于，在金属导电箔的两面上形成其两侧的图案为镜像的光致抗蚀剂层，或者 通过化学蚀刻将光致抗蚀剂层的两侧蚀刻到金属导电箔或片的厚度的30至40％的深度，金属导电箔或片的一面被分离的树脂涂覆 涂覆或层压有隔离的基材膜或片层，所述光致抗蚀剂层的另一侧也通过化学蚀刻蚀刻直到两侧的蚀刻槽通过以连接 以薄线形式制造呈金属导电层形式的薄膜线圈，并且如果需要，两片薄膜线圈可以在其下侧彼此连接。