公开(公告)号：US20170303386A1

公开(公告)日：2017-10-19

申请号：US15098533

申请日：2016-04-14

Applicant: L-3 Communications Corporation

Inventor： Gerald COLES

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40

CPC classification number: H05K1/0216 ,  H05K2201/0187 ,  H05K2201/0723 ,  H05K2201/09063 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: A printed circuit board (PCB), electronic assembly, and method are provided. A PCB adapted to receive a radio frequency (RF) chip includes one or more features that extend through at least a portion of the depth of the PCB. The features are filled with an RF absorber composite comprising a binder and an RF absorber material. The features are positioned in the PCB to reduce RF signal coupling between the RF chip and one or more metal surfaces of the PCB.