公开(公告)号：US20160073498A1

公开(公告)日：2016-03-10

申请号：US14846234

申请日：2015-09-04

Applicant: LG Display Co., Ltd.

Inventor： InHo YEO ,  KyongShik JEON

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0218 ,  H05K1/0219 ,  H05K1/0296 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K2201/04 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/10128

Abstract: An electronic device connection unit includes a substrate and a plurality of signal pads on the substrate configured to send signals from an electronic device to a driving printed circuit board (PCB). One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device. One or more dummy ground pads on the substrate are configured to connect to the reference voltage of the electronic device without extending onto the driving PCB. One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.

Abstract translation: 电子设备连接单元包括基板和被配置为将信号从电子设备发送到驱动印刷电路板（PCB）的基板上的多个信号焊盘。 衬底上的一个或多个有源接地焊盘构造成将至少驱动PCB连接到电子设备的参考电压。 衬底上的一个或多个虚拟接地焊盘被配置成连接到电子设备的参考电压而不延伸到驱动PCB上。 一个或多个连接器连接到一个或多个虚拟接地焊盘，其中一个或多个连接器中的每一个被配置为将一个或多个虚拟接地焊盘的至少一个子集电耦合到一个或多个有源接地焊盘。

公开(公告)号：US20170135201A1

公开(公告)日：2017-05-11

申请号：US15410485

申请日：2017-01-19

Applicant: LG Display Co., Ltd.

Inventor： InHo YEO ,  KyongShik JEON

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K1/0218 ,  H05K1/0219 ,  H05K1/0296 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K2201/04 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/10128

Abstract: An electronic device connection unit includes a substrate and a plurality of signal pads on the substrate configured to send signals from an electronic device to a driving printed circuit board (PCB). One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device. One or more dummy ground pads on the substrate are configured to connect to the reference voltage of the electronic device without extending onto the driving PCB. One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.