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    Video transcoding card with two transcoding assemblies stacked on one another
    1.
    发明授权
    Video transcoding card with two transcoding assemblies stacked on one another 有权

    公开(公告)号：US12016122B2

    公开(公告)日：2024-06-18

    申请号：US17693498

    申请日：2022-03-14

    Applicant: Inventec (Pudong) Technology Corporation ,  INVENTEC CORPORATION

    Inventor： Xun Wang ,  Sheng Guo

    IPC: H05K1/14 ,  H05K1/11 ,  H05K5/03

    CPC classification number: H05K1/14 ,  H05K1/11 ,  H05K5/03 ,  H05K2201/04 ,  H05K2201/10409

    Abstract: A video transcoding card includes a first transcoding assembly and a second transcoding assembly. The first transcoding assembly includes a first circuit board, first transcoding boards, and a first main electrical connector. The first transcoding boards and the first main electrical connector are disposed on the first circuit board and are electrically connected to the first circuit board. The second transcoding assembly includes a second circuit board, second transcoding boards and a second main electrical connector. The second transcoding boards and the second main electrical connector are disposed on the second circuit board and are electrically connected to the second circuit board. The first main electrical connector and the second main electrical connector are connected to each other, and the second transcoding boards are electrically connected to the first circuit board via the second circuit board, the second main electrical connector, and the first main electrical connector.

    MOTHER CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, MOTHER MODULE COMPONENT, MODULE COMPONENT, AND METHOD OF MANUFACTURING MOTHER CERAMIC SUBSTRATE
    2.
    发明申请
    MOTHER CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, MOTHER MODULE COMPONENT, MODULE COMPONENT, AND METHOD OF MANUFACTURING MOTHER CERAMIC SUBSTRATE 审中-公开
    主体陶瓷基板，陶瓷基板，主体模块部件，模块部件和制造母体基板的方法

    公开(公告)号：US20170079137A1

    公开(公告)日：2017-03-16

    申请号：US15358241

    申请日：2016-11-22

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Yukio MAEDA ,  Masashi MATSUBARA ,  Daigo MATSUBARA ,  Masatoshi KARIYA

    IPC: H05K1/03 ,  H05K1/14 ,  H05K3/00 ,  H05K1/18 ,  H05K3/22

    CPC classification number: H05K1/0306 ,  H05K1/14 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/22 ,  H05K3/4629 ,  H05K2201/04 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/1126

    Abstract: Provided is a mother ceramic substrate that, when divided into individual substrates (ceramic substrates), can be divided to cause divided end surfaces to be perpendicular to principal surfaces of the individual substrates, and that can provide ceramic substrates with high form accuracy; an individual ceramic substrate obtained from the mother ceramic substrate; a module component including the ceramic substrate; and a method of manufacturing a mother ceramic substrate. In a mother ceramic substrate that can be divided at a predetermined position and separated into a plurality of individual substrates, a dividing groove that defines a division position is formed in a principal surface on one side, and a protruding thread is formed on a principal surface on another side at a position corresponding to a position of the dividing groove formed in the principal surface on the one side in view in a thickness direction of the mother ceramic substrate.

    Abstract translation: 提供了一种母体陶瓷基板，当分割成单独的基板（陶瓷基板）时，可以分割成分开的端面垂直于各个基板的主表面，并且可以提供高形状精度的陶瓷基板; 从母体陶瓷基板获得的单个陶瓷基板; 包括陶瓷基板的模块部件; 以及母体陶瓷基板的制造方法。 在可以在预定位置分割并分离成多个单独基板的母陶瓷基板中，在一侧的主表面上形成限定分割位置的分隔槽，并且在主表面上形成突出螺纹 在与母陶瓷基板的厚度方向一侧的主面的形成的分隔槽的位置对应的位置的另一侧。

    Driving printed circuit board for display device and display device having the same
    3.
    发明授权
    Driving printed circuit board for display device and display device having the same 有权
    驱动用于显示装置的印刷电路板和具有其的显示装置

    公开(公告)号：US09585252B2

    公开(公告)日：2017-02-28

    申请号：US14846234

    申请日：2015-09-04

    Applicant: LG Display Co., Ltd.

    Inventor： InHo Yeo ,  KyongShik Jeon

    IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H05K1/11 ,  H05K1/02

    CPC classification number: H05K1/0218 ,  H05K1/0219 ,  H05K1/0296 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K2201/04 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/10128

    Abstract: An electronic device connection unit includes a substrate and a plurality of signal pads on the substrate configured to send signals from an electronic device to a driving printed circuit board (PCB). One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device. One or more dummy ground pads on the substrate are configured to connect to the reference voltage of the electronic device without extending onto the driving PCB. One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.

    Abstract translation: 电子设备连接单元包括基板和被配置为将信号从电子设备发送到驱动印刷电路板（PCB）的基板上的多个信号焊盘。 衬底上的一个或多个有源接地焊盘构造成将至少驱动PCB连接到电子设备的参考电压。 衬底上的一个或多个虚拟接地焊盘被配置成连接到电子设备的参考电压而不延伸到驱动PCB上。 一个或多个连接器连接到一个或多个虚拟接地焊盘，其中一个或多个连接器中的每一个被配置为将一个或多个虚拟接地焊盘的至少一个子集电耦合到一个或多个有源接地焊盘。

    METHOD AND ARRANGEMENT FOR BOARD-TO-BOARD INTERCONNECTION
    5.
    发明申请
    METHOD AND ARRANGEMENT FOR BOARD-TO-BOARD INTERCONNECTION 有权
    板对板互连的方法和布置

    公开(公告)号：US20160249447A1

    公开(公告)日：2016-08-25

    申请号：US15031369

    申请日：2013-11-01

    Applicant: TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)

    Inventor： Bo ZHOU ,  Junyou CHEN ,  Kun LIU

    IPC: H05K1/02 ,  H05K1/14 ,  H05K3/46 ,  H01P3/08 ,  H05K3/10

    CPC classification number: H05K1/0237 ,  H01L2924/19107 ,  H01P3/081 ,  H01P5/028 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/48 ,  H05K1/0213 ,  H05K1/025 ,  H05K1/117 ,  H05K1/14 ,  H05K1/142 ,  H05K3/10 ,  H05K3/4644 ,  H05K2201/04 ,  H05K2201/0979 ,  H05K2203/049

    Abstract: A wide bandwidth circuit board arrangement includes two coplanar substrates separated by a predetermined gap, and at least one bond wire arranged across the gap and interconnecting a respective conducting microstrip line on a first side of each respective substrate. Further, the arrangement includes at least one open stub arrangement configured on the first side of each respective substrate, each open stub arrangement comprising a microstrip extending at an angle from an end of each conducting strip on each respective substrate. Finally, the arrangement includes a ground layer on a second side of each respective substrate, and a defected ground structure arranged on the second side of each respective substrate and laterally overlapping each respective open stub arrangement arranged on the first side.

    Abstract translation: 宽带电路板布置包括由预定间隙隔开的两个共面基板和跨过间隙布置的至少一个接合线，并将相应的导电微带线互连在每个相应基板的第一侧上。 此外，该布置包括配置在每个相应基板的第一侧上的至少一个开放短截线布置，每个开放的短截线布置包括从每个相应基板上的每个导电带的端部以一定角度延伸的微带。 最后，该布置包括在每个相应基板的第二侧上的接地层和布置在每个相应基板的第二侧上并且横向重叠设置在第一侧上的每个相应的开放短截线布置的缺陷接地结构。

    Power Semiconductor Module Arrangement
    6.
    发明申请
    Power Semiconductor Module Arrangement 有权
    功率半导体模块布置

    公开(公告)号：US20160219705A1

    公开(公告)日：2016-07-28

    申请号：US15005345

    申请日：2016-01-25

    Applicant: Infineon Technologies AG

    Inventor： Reinhold Bayerer

    IPC: H05K1/14 ,  H05K1/18

    CPC classification number: H05K1/142 ,  H01L25/162 ,  H01L2924/0002 ,  H05K1/0262 ,  H05K1/144 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/04 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/1059 ,  H01L2924/00

    Abstract: A power semiconductor module arrangement includes a semiconductor module having a controllable power semiconductor component, a first printed circuit board (PCB) arranged outside the semiconductor module, and a control unit arranged outside the semiconductor module and having a second PCB. The control unit is configured to control the controllable power semiconductor component. The controllable power semiconductor component has a first load terminal and a second load terminal between which a load path of the power semiconductor component is formed, and also a control terminal for controlling the load path. The first PCB has a conductor track connected in series with the load path. The first and second PCBs are spaced apart from one another and electrically connected to one another by a pin.

    Abstract translation: 功率半导体模块装置包括具有可控功率半导体部件的半导体模块，布置在半导体模块外部的第一印刷电路板（PCB），以及布置在半导体模块外部并具有第二PCB的控制单元。 控制单元被配置为控制可控功率半导体部件。 可控功率半导体部件具有形成功率半导体部件的负载路径的第一负载端子和第二负载端子，以及用于控制负载路径的控制端子。 第一个PCB具有与负载路径串联连接的导体轨道。 第一和第二PCB彼此间隔开并且通过销彼此电连接。

    Display device
    7.
    发明授权
    Display device 有权

    公开(公告)号：US11665939B2

    公开(公告)日：2023-05-30

    申请号：US17124131

    申请日：2020-12-16

    Applicant: LG Display Co., Ltd.

    Inventor： Mookyoung Hong ,  Hyerim Kim ,  Juwon Kim

    IPC: H01L27/32 ,  H05K1/18

    CPC classification number: H01L27/3276 ,  H01L27/326 ,  H05K1/18 ,  H05K2201/04 ,  H05K2201/10128

    Abstract: The present disclosure relates to a display device capable of preventing light-emitting elements in a display panel from being deteriorated. A power supply circuit includes a plurality of first power supply lines each of which extends in a first direction and a plurality of second power supply lines each of which extends in a second direction intersecting the first direction, in which the second power supply lines are electrically connected with the first power supply lines.

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