公开(公告)号：US20040154162A1

公开(公告)日：2004-08-12

申请号：US10769885

申请日：2004-02-03

Applicant: LG Electronics Inc.

Inventor： Sung-Gue Lee ,  Jung-Ho Hwang ,  Joon-Wook Han ,  Sang-Min Lee ,  Tae-Sik Eo ,  Yu-Seock Yang

IPC: H05K003/36 ,  H05K003/20

CPC classification number: H05K3/423 ,  H05K3/0023 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0346 ,  H05K2203/0577 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer, forming a plated layer at the surface of the first metal layer exposed by the plating groove through a plating process to form connection protrusion, removing the etching resist layer, forming an insulation layer at the first metal layer and positioning a second metal layer at the surface of the insulation layer coupled to an end portion of the connection protrusion. By forming the connection protrusion through the plating process, a loss of material can be reduced and a strength of the connection protrusion can be increased. Further, a complexity of the fabrication process is reduced to reduce costs and increase productivity.

Abstract translation: 制造多层印刷电路板的方法可以包括在具有选择性地暴露第一金属层的镀槽的第一金属层上形成抗蚀剂层，在由电镀暴露的第一金属层的表面形成镀层 通过电镀工艺形成连接突起，去除抗蚀剂层，在第一金属层处形成绝缘层，并将第二金属层定位在连接到连接突起的端部的绝缘层的表面处。 通过通过电镀工艺形成连接突起，可以减少材料的损失，并且可以提高连接突起的强度。 此外，减少制造过程的复杂性以降低成本并提高生产率。

公开(公告)号：US20040050708A1

公开(公告)日：2004-03-18

申请号：US10644036

申请日：2003-08-20

Applicant: LG ELECTRONICS INC.

Inventor： Yu-Seock Yang ,  Sung-Gue Lee ,  Yong-Soon Jang ,  Hyung-Kun Kim

IPC: C25D005/02

CPC classification number: C25D5/022 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/427 ,  H05K2201/0959 ,  H05K2203/054 ,  H05K2203/1572

Abstract: A plating method for a printed circuit board includes: a first step of providing a substrate having a plurality of connection pads and circuit patterns connected to the connection pads; a second step of using some of the circuit patterns provided on a surface of the substrate as a power connection portion and connecting the power connection portion to an external power source; a third step of covering a surface of the substrate excepting the connection pads with a plating resistance resist to shield it; a fourth step of supplying power to the connection pad through the power connection portion and forming a gold-plated layer on the connection pad; and a fifth step of making the power connection portion and the external power source to be electrically short. With this method, a printed circuit board without a power supply line for gold-plating can be obtained.

Abstract translation: 印刷电路板的电镀方法包括：第一步骤，提供具有连接到连接焊盘的多个连接焊盘和电路图案的衬底; 使用设置在基板的表面上的一些电路图案作为电源连接部分并将电源连接部分连接到外部电源的第二步骤; 第三步骤，用电镀抗蚀剂覆盖除了连接焊盘之外的基板的表面以对其进行屏蔽; 通过电源连接部分向​​连接焊盘供电并在连接焊盘上形成镀金层的第四步骤; 以及使电力连接部分和外部电源电气短路的第五步骤。 通过这种方法，可以获得没有用于镀金的电源线的印刷电路板。