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公开(公告)号：US20140264395A1
公开(公告)日：2014-09-18
申请号：US14205833
申请日：2014-03-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Gun Kyo LEE , In Yong PARK , Jong Woo LEE , Ju Young LEE , Yun Min CHO
IPC: H01L27/15
CPC classification number: H01L27/156 , F21S41/143 , F21S41/155 , F21S41/19 , F21S41/663 , F21Y2105/10 , F21Y2105/12 , H01L25/0753 , H01L27/15 , H01L33/20 , H01L2924/0002 , H01L2924/00
Abstract: Disclosed is a light emitting module. The light emitting module includes a substrate and a plurality of light emitting devices disposed on the substrate, at least one of the plurality of light emitting devices includes a plurality of light emitting cells which are individually driven, and the plurality of light emitting cells include a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer, and has a light emitting surface emitting light.
Abstract translation: 公开了一种发光模块。 发光模块包括衬底和设置在衬底上的多个发光器件，多个发光器件中的至少一个发光器件包括单独驱动的多个发光单元，并且多个发光单元包括一个 发光结构包括第一半导体层，有源层和第二半导体层，并且具有发光面发光。
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公开(公告)号：US20180226552A1
公开(公告)日：2018-08-09
申请号：US15506203
申请日：2015-08-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Gun Kyo LEE , Kwang Hee LEE
IPC: H01L33/62 , H01L33/50 , H01L25/075 , H01L33/56 , H01L23/00
CPC classification number: H01L33/62 , H01L24/48 , H01L24/85 , H01L25/0753 , H01L33/06 , H01L33/30 , H01L33/32 , H01L33/50 , H01L33/502 , H01L33/505 , H01L33/52 , H01L33/56 , H01L33/647 , H01L2224/48091 , H01L2224/48106 , H01L2224/48229 , H01L2224/48247 , H01L2224/8592 , H01L2924/12041 , H01L2924/181 , H01L2924/19107 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2924/00014 , H01L2924/00012
Abstract: A light-emitting element package according to an embodiment comprises: a substrate; a conductive layer arranged on the substrate; at least one light-emitting chip arranged on the substrate; a wire for electrically connecting the conductive layer and the at least one light-emitting chip; a wavelength conversion unit arranged on the light-emitting chip; and a molding unit arranged on the substrate so as to enclose the light-emitting chip and the wire and to expose the upper surface of the wavelength conversion unit, wherein the distance from the upper surface of the light-emitting chip to the upper surface of the wavelength conversion unit is larger than a value obtained by adding 37 μm to the distance from the upper surface of the light-emitting chip to the highest point of the wire.
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公开(公告)号：US20160056345A1
公开(公告)日：2016-02-25
申请号：US14779896
申请日：2014-03-25
Applicant: LG INNOTEK CO., LTD.
Inventor： In Yong PARK , Gun Kyo LEE , Jong Woo LEE , Ju Young LEE , Yun Min CHO
CPC classification number: H01L33/50 , F21S43/14 , F21S43/195 , H01L25/0753 , H01L25/0756 , H01L33/62 , H01L33/642 , H01L2224/45139 , H01L2224/48091 , H01L2924/00014 , H01L2924/00011 , H01L2224/45099
Abstract: A light-emitting element package, according to one embodiment of the present invention, comprises: a circuit board including first and second regions having different heights; light-emitting elements respectively disposed in the first and second regions; and phosphor layers respectively disposed on the light-emitting elements, wherein the light-emitting elements are disposed within a 100-μm distance in the horizontal direction.
Abstract translation: 根据本发明的一个实施例的发光元件封装包括：包括具有不同高度的第一和第二区域的电路板; 分别设置在第一和第二区域中的发光元件; 以及分别设置在发光元件上的荧光体层，其中发光元件设置在水平方向上的100μm距离内。
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公开(公告)号：US20150028368A1
公开(公告)日：2015-01-29
申请号：US14512257
申请日：2014-10-10
Applicant: LG INNOTEK CO., LTD.
Inventor： Gun Kyo LEE , Jong Woo LEE , Yun Min CHO
IPC: H01L25/075 , H01L33/62 , H01L33/64
CPC classification number: H01L25/0753 , F21S41/141 , F21S43/14 , F21S45/47 , F21S45/49 , H01L33/62 , H01L33/64 , H01L33/644 , H01L2224/48091 , H01L2224/48227 , H01L2224/4911 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed herein is a light emitting module. The light emitting module according to an exemplary embodiment includes a circuit board having a cavity and including a circuit pattern at a region which does not have the cavity, an insulation substrate disposed in the cavity while being formed, at an upper portion thereof, with at least one pad, and at least one light emitting device disposed on the pad, wherein a joining structure is disposed between a bottom surface of the cavity and a bottom surface of the insulation substrate.
Abstract translation: 这里公开了一种发光模块。 根据示例性实施例的发光模块包括具有空腔并且在不具有空腔的区域处包括电路图案的电路板，在其上部处形成有位于空腔中的绝缘基板，其上部具有 至少一个焊盘和设置在焊盘上的至少一个发光器件，其中，接合结构设置在空腔的底表面和绝缘基板的底表面之间。
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Patent Agency Ranking
公开(公告)号：US20130328094A1
公开(公告)日：2013-12-12
申请号：US13969296
申请日：2013-08-16
Applicant: LG INNOTEK CO., LTD.
Inventor： Gun Kyo LEE
IPC: H01L33/60
CPC classification number: H01L33/60 , H01L33/486 , H01L33/505 , H01L33/507 , H01L33/58 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/16245 , H01L2933/0033 , H01L2933/0091 , H01L2224/48091 , H01L2924/00014
Abstract: Provided is a light emitting device. The light emitting device includes a plurality of metal layers spaced from each other, a first insulation film having an opened area in which a portion of the plurality of metal layers is opened, the first insulation film being disposed around top surfaces of the plurality of metal layers, a light emitting chip disposed on at least one of the plurality of metal layers, the light emitting chip being electrically connected to the other metal layer, a resin layer disposed on the plurality of metal layers and the light emitting chip, and a first guide member formed of a non-metallic material, the first guide member being disposed on the first insulation film.
Abstract translation: 提供了一种发光装置。 发光器件包括彼此间隔开的多个金属层，具有开放区域的第一绝缘膜，多个金属层的一部分被打开，第一绝缘膜设置在多个金属的顶表面周围 层，设置在所述多个金属层中的至少一个上的发光芯片，所述发光芯片电连接到所述另一金属层，设置在所述多个金属层上的树脂层和所述发光芯片，以及第一 引导构件由非金属材料形成，第一引导构件设置在第一绝缘膜上。
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公开(公告)号：US20190067544A1
公开(公告)日：2019-02-28
申请号：US16176316
申请日：2018-10-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Su Jung JUNG , Yu Dong KIM , Gun Kyo LEE
Abstract: Provided is a light emitting device package. The light emitting device package comprises a body, a heat diffusing member, a light emitting diode (LED), and a buffer layer. A cavity with an opened topside is formed in the body. The heat dissipation member is disposed between a bottom surface of the cavity and a lower surface of the body. The LED is disposed on one of an electrode disposed on the bottom surface of the cavity. The buffer layer is disposed between the heat dissipation member and a pad and has a thickness thinner than a thickness of the heat dissipation member.
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7.发明申请LIGHT EMITTING DEVICE PACKAGE AND LIGHTING DEVICE FOR VEHICLE INCLUDING THE SAME 有权用于车辆的发光装置包装和照明装置公开(公告)号：US20150062949A1
公开(公告)日：2015-03-05
申请号：US14472514
申请日：2014-08-29
Applicant: LG INNOTEK CO., LTD.
Inventor： Gun Kyo LEE , In Yong PARK , Dae Hee LEE , Yun Min CHO
CPC classification number: H01L33/08 , F21K9/60 , F21S43/26 , F21V23/005 , H01L25/0753 , H01L27/156 , H01L33/20 , H01L33/50 , H01L33/504 , H01L33/508 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014
Abstract: Embodiments relate to a light emitting device package including a package body, a light emitting structure disposed on the package body, the light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, the light emitting structure being divided into at least two light emitting cells, a support substrate located between the package body and the light emitting structure, a first electrode and a second electrode connected to each of the light emitting cells and fluorescent substances disposed respectively on the light emitting cells. At least two layers among the first conductive semiconductor layer, the active layer and the second conductive semiconductor layer included in each of the light emitting cells next to each other are electrically separated from each other.
Abstract translation: 实施例涉及包括封装主体，设置在封装主体上的发光结构的发光器件封装，发光结构包括第一导电半导体层，有源层和第二导电半导体层，发光结构被分割 至少两个发光单元，位于封装体和发光结构之间的支撑基板，连接到分别设置在发光单元上的每个发光单元和荧光物质的第一电极和第二电极。 在彼此相邻的每个发光单元中包括的第一导电半导体层，有源层和第二导电半导体层中的至少两层彼此电分离。
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公开(公告)号：US20140117389A1
公开(公告)日：2014-05-01
申请号：US13841271
申请日：2013-03-15
Applicant: LG INNOTEK CO., LTD.
Inventor： Gun Kyo LEE
IPC: H01L33/44
CPC classification number: H01L33/44 , F21K9/23 , F21V29/77 , F21V29/83 , F21Y2101/00 , F21Y2115/10 , H01L33/38 , H01L33/505 , H01L33/507 , H01L33/62 , H01L2224/48091 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed is a light emitting device including a light emitting structure comprising a first semiconductor layer, an active layer and a second semiconductor layer, a phosphor plate disposed on the second semiconductor layer, a first electrode portion disposed on the phosphor plate, and a plurality of bonding portions disposed between the light emitting structure and the phosphor plate, the bonding portions bonding the phosphor plate to the light emitting structure, wherein each bonding portion includes at least one first bonding portion electrically connected to the first electrode portion.
Abstract translation: 公开了一种发光器件，其包括发光结构，该发光结构包括第一半导体层，有源层和第二半导体层，设置在第二半导体层上的荧光体板，设置在荧光体板上的第一电极部分， 所述接合部分配置在所述发光结构和所述荧光体板之间，所述接合部将所述荧光体板接合到所述发光结构，其中，每个接合部分包括至少一个电连接到所述第一电极部分的第一接合部分。
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公开(公告)号：US20140077242A1
公开(公告)日：2014-03-20
申请号：US13830105
申请日：2013-03-14
Applicant: LG INNOTEK CO., LTD.
Inventor： Gun Kyo LEE
IPC: H01L33/60
CPC classification number: H01L33/505 , H01L33/38 , H01L33/405 , H01L33/42 , H01L33/507 , H01L33/60 , H01L2224/48091 , H01L2924/12032 , H01L2933/0041 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed is a light emitting device including a light emitting structure comprising a first semiconductor layer, an active layer and a second semiconductor layer, a phosphor plate disposed on the second semiconductor layer, and a bonding portion disposed between the light emitting structure and the phosphor plate, the bonding portion bonding the phosphor plate to the light emitting structure.
Abstract translation: 公开了一种发光器件，其包括发光结构，包括第一半导体层，有源层和第二半导体层，设置在第二半导体层上的荧光体板，以及配置在发光结构和荧光体板之间的接合部 ，所述接合部将所述荧光体板接合到所述发光结构。
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