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公开(公告)号：US20140264395A1
公开(公告)日：2014-09-18
申请号：US14205833
申请日：2014-03-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Gun Kyo LEE , In Yong PARK , Jong Woo LEE , Ju Young LEE , Yun Min CHO
IPC: H01L27/15
CPC classification number: H01L27/156 , F21S41/143 , F21S41/155 , F21S41/19 , F21S41/663 , F21Y2105/10 , F21Y2105/12 , H01L25/0753 , H01L27/15 , H01L33/20 , H01L2924/0002 , H01L2924/00
Abstract: Disclosed is a light emitting module. The light emitting module includes a substrate and a plurality of light emitting devices disposed on the substrate, at least one of the plurality of light emitting devices includes a plurality of light emitting cells which are individually driven, and the plurality of light emitting cells include a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer, and has a light emitting surface emitting light.
Abstract translation: 公开了一种发光模块。 发光模块包括衬底和设置在衬底上的多个发光器件，多个发光器件中的至少一个发光器件包括单独驱动的多个发光单元，并且多个发光单元包括一个 发光结构包括第一半导体层，有源层和第二半导体层，并且具有发光面发光。
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公开(公告)号：US20160056345A1
公开(公告)日：2016-02-25
申请号：US14779896
申请日：2014-03-25
Applicant: LG INNOTEK CO., LTD.
Inventor： In Yong PARK , Gun Kyo LEE , Jong Woo LEE , Ju Young LEE , Yun Min CHO
CPC classification number: H01L33/50 , F21S43/14 , F21S43/195 , H01L25/0753 , H01L25/0756 , H01L33/62 , H01L33/642 , H01L2224/45139 , H01L2224/48091 , H01L2924/00014 , H01L2924/00011 , H01L2224/45099
Abstract: A light-emitting element package, according to one embodiment of the present invention, comprises: a circuit board including first and second regions having different heights; light-emitting elements respectively disposed in the first and second regions; and phosphor layers respectively disposed on the light-emitting elements, wherein the light-emitting elements are disposed within a 100-μm distance in the horizontal direction.
Abstract translation: 根据本发明的一个实施例的发光元件封装包括：包括具有不同高度的第一和第二区域的电路板; 分别设置在第一和第二区域中的发光元件; 以及分别设置在发光元件上的荧光体层，其中发光元件设置在水平方向上的100μm距离内。
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