公开(公告)号：US20140264395A1

公开(公告)日：2014-09-18

申请号：US14205833

申请日：2014-03-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Gun Kyo LEE ,  In Yong PARK ,  Jong Woo LEE ,  Ju Young LEE ,  Yun Min CHO

IPC: H01L27/15

CPC classification number: H01L27/156 ,  F21S41/143 ,  F21S41/155 ,  F21S41/19 ,  F21S41/663 ,  F21Y2105/10 ,  F21Y2105/12 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Disclosed is a light emitting module. The light emitting module includes a substrate and a plurality of light emitting devices disposed on the substrate, at least one of the plurality of light emitting devices includes a plurality of light emitting cells which are individually driven, and the plurality of light emitting cells include a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer, and has a light emitting surface emitting light.

Abstract translation: 公开了一种发光模块。 发光模块包括衬底和设置在衬底上的多个发光器件，多个发光器件中的至少一个发光器件包括单独驱动的多个发光单元，并且多个发光单元包括一个 发光结构包括第一半导体层，有源层和第二半导体层，并且具有发光面发光。

公开(公告)号：US20150062949A1

公开(公告)日：2015-03-05

申请号：US14472514

申请日：2014-08-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Gun Kyo LEE ,  In Yong PARK ,  Dae Hee LEE ,  Yun Min CHO

IPC: H01L33/08 ,  H01L33/50 ,  F21K99/00 ,  F21V23/00 ,  F21S8/10

CPC classification number: H01L33/08 ,  F21K9/60 ,  F21S43/26 ,  F21V23/005 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/20 ,  H01L33/50 ,  H01L33/504 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: Embodiments relate to a light emitting device package including a package body, a light emitting structure disposed on the package body, the light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, the light emitting structure being divided into at least two light emitting cells, a support substrate located between the package body and the light emitting structure, a first electrode and a second electrode connected to each of the light emitting cells and fluorescent substances disposed respectively on the light emitting cells. At least two layers among the first conductive semiconductor layer, the active layer and the second conductive semiconductor layer included in each of the light emitting cells next to each other are electrically separated from each other.

Abstract translation: 实施例涉及包括封装主体，设置在封装主体上的发光结构的发光器件封装，发光结构包括第一导电半导体层，有源层和第二导电半导体层，发光结构被分割 至少两个发光单元，位于封装体和发光结构之间的支撑基板，连接到分别设置在发光单元上的每个发光单元和荧光物质的第一电极和第二电极。 在彼此相邻的每个发光单元中包括的第一导电半导体层，有源层和第二导电半导体层中的至少两层彼此电分离。

公开(公告)号：US20160056345A1

公开(公告)日：2016-02-25

申请号：US14779896

申请日：2014-03-25

Applicant: LG INNOTEK CO., LTD.

Inventor： In Yong PARK ,  Gun Kyo LEE ,  Jong Woo LEE ,  Ju Young LEE ,  Yun Min CHO

IPC: H01L33/50 ,  H01L33/62

CPC classification number: H01L33/50 ,  F21S43/14 ,  F21S43/195 ,  H01L25/0753 ,  H01L25/0756 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00011 ,  H01L2224/45099

Abstract: A light-emitting element package, according to one embodiment of the present invention, comprises: a circuit board including first and second regions having different heights; light-emitting elements respectively disposed in the first and second regions; and phosphor layers respectively disposed on the light-emitting elements, wherein the light-emitting elements are disposed within a 100-μm distance in the horizontal direction.

Abstract translation: 根据本发明的一个实施例的发光元件封装包括：包括具有不同高度的第一和第二区域的电路板; 分别设置在第一和第二区域中的发光元件; 以及分别设置在发光元件上的荧光体层，其中发光元件设置在水平方向上的100μm距离内。