公开(公告)号：US20240260184A1

公开(公告)日：2024-08-01

申请号：US18560741

申请日：2022-06-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Hyeong LEE ,  Dong Joon KIM

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/11 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/032

Abstract: The printed circuit board module comprises: a printed circuit board including a first area and a second area; an electronic component disposed in the first area; and a partition line disposed between the first area and the second area, wherein the partition line is disposed to be stepped with respect to a surface of the printed circuit board.

公开(公告)号：US20240275230A1

公开(公告)日：2024-08-15

申请号：US18681744

申请日：2022-07-05

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Hyeong LEE ,  Jae Bin AN ,  Kun Yong SONG

IPC: H02K3/52 ,  H02K11/33

CPC classification number: H02K3/522 ,  H02K11/33 ,  H02K2203/09 ,  H02K2211/03

Abstract: A motor comprises: a body; a busbar coupled to the body; and a heat transfer member disposed on the body, wherein the body includes a first open area for exposing the busbar in the axial direction, and a second open area, the second open area includes a first unit open area and a second unit open area, and the heat transfer member is in contact with the busbar in the first open area and is disposed between the first unit open area and the second unit open area.