公开(公告)号：US20240107687A1

公开(公告)日：2024-03-28

申请号：US18254328

申请日：2021-11-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Kun Yong SONG ,  Dong Joon KIM

IPC: H05K5/00 ,  H05K1/02 ,  H05K1/14 ,  H05K5/02

CPC classification number: H05K5/003 ,  H05K1/0233 ,  H05K1/145 ,  H05K5/0247 ,  H05K2201/10303 ,  H05K2201/10409

Abstract: The electronic control device includes: a housing; a first plate disposed in the housing; a second plate disposed in the housing and having an inner surface facing the inner surface of the first plate; a first control module disposed in the housing; and a second control module disposed in the housing, wherein the first control module includes: a first printed circuit board having an inner surface coupled to one side of the first plate and one side of the second plate; a first power supply substrate disposed on an outer surface of the second plate; and a first EMI filter disposed between the first plate and the second plate, an inner surface of which is opposite to an inner surface of the first printed circuit board, and wherein the second control module includes: a second printed circuit board having an inner surface coupled to the other side surface of the first plate and the other side surface of the second plate; a second power supply substrate disposed on an outer surface of the first plate; and a second EMI filter disposed between the first plate and the second plate, an inner surface thereof faces an inner surface of the second printed circuit board.

公开(公告)号：US20230098103A1

公开(公告)日：2023-03-30

申请号：US18074626

申请日：2022-12-05

Applicant: LG INNOTEK CO., LTD.

Inventor： Chan Seok KIM ,  Kun Yong SONG ,  Duck Hyun SONG

IPC: H02K11/33 ,  H02K5/06 ,  H02K5/22 ,  H05K7/20

Abstract: A controller including a first housing; a first cover disposed on an opening of the first housing; filter units disposed above the first cover; a power module unit disposed below the first cover; and a substrate disposed below the power module unit; wherein the power module unit includes a bracket; and a power module disposed between the bracket and the first cover, and wherein the power module includes a power module body; a plurality of first pins arranged to protrude downward from one side of the power module body; and five terminal pins arranged to protrude downward from the other side of the power module body, wherein an end portion of the first pin is coupled to the substrate.

公开(公告)号：US20240275230A1

公开(公告)日：2024-08-15

申请号：US18681744

申请日：2022-07-05

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Hyeong LEE ,  Jae Bin AN ,  Kun Yong SONG

IPC: H02K3/52 ,  H02K11/33

CPC classification number: H02K3/522 ,  H02K11/33 ,  H02K2203/09 ,  H02K2211/03

Abstract: A motor comprises: a body; a busbar coupled to the body; and a heat transfer member disposed on the body, wherein the body includes a first open area for exposing the busbar in the axial direction, and a second open area, the second open area includes a first unit open area and a second unit open area, and the heat transfer member is in contact with the busbar in the first open area and is disposed between the first unit open area and the second unit open area.

公开(公告)号：US20240223037A1

公开(公告)日：2024-07-04

申请号：US18570826

申请日：2022-06-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Jae In JEONG ,  Kun Yong SONG

IPC: H02K3/28 ,  H02K3/52

CPC classification number: H02K3/28 ,  H02K3/522

Abstract: A motor comprises: a base; a first bus bar coupled to the base and comprising a first body and a first coupling portion extending from the first body; a second bus bar disposed outside the first bus bar and comprising a second body and a second coupling portion extending from the second body; and a third bus bar disposed outside the second bus bar and comprising a third body and a third coupling portion extending from the third body, wherein the first coupling portion does not overlap the second body and the third body in the axial direction, and the second coupling portion does not overlap the third body in the axial direction.

公开(公告)号：US20200274423A1

公开(公告)日：2020-08-27

申请号：US16647813

申请日：2018-07-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Chan Seok KIM ,  Kun Yong SONG ,  Duck Hyun SONG

IPC: H02K11/33 ,  H02K5/22 ,  H02K5/06 ,  H05K7/20

Abstract: An embodiment relates to a controller and a motor assembly comprising same, the controller comprising: a substrate; a controller housing disposed on the substrate; a CM filter unit disposed between the substrate and the controller housing; a DM filter unit disposed under the CM filter unit; a controller cover disposed between the substrate and the DM filter unit; a power module unit disposed between the substrate and the controller cover; and a connector unit coupled to the substrate, wherein the power module unit comprises a power module and a mold unit surrounding the power module. Accordingly, the heat generating problem of the power module unit can be resolved.