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公开(公告)号：US20230069492A1
公开(公告)日：2023-03-02
申请号：US18047309
申请日：2022-10-18
Applicant: LG INNOTEK CO., LTD.
Inventor： Kap Jin LEE , Yong Nam CHOI , Do Yoon KIM , Min Soo KIM , Jung Hwan KIM , Tae Young KIM
Abstract: The present embodiment relates to a dual lens drive device that comprises: a housing; a first bobbin which is disposed to move in a first direction inside the housing; a second bobbin which is disposed to move in the first direction inside housing and is spaced apart from the first bobbin; a first coil which is disposed on the first bobbin; a second coil which is disposed on the second bobbin; a magnet which is disposed in the housing and faces the first coil and the second coil; a base which is disposed below the housing; a substrate which comprises a circuit member having a third coil disposed to face the magnet between the housing and the base; and a support member which movably supports the housing with respect to the substrate, wherein the housing is integrally formed.
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Patent Agency Ranking
公开(公告)号：US20240160033A1
公开(公告)日：2024-05-16
申请号：US18414898
申请日：2024-01-17
Applicant: LG INNOTEK CO., LTD.
Inventor： Kap Jin LEE , Yong Nam CHOI , Do Yoon KIM , Min Soo KIM , Jung Hwan KIM , Tae Young KIM
CPC classification number: G02B27/646 , G03B11/04 , H01F7/16 , H04N23/68 , H01F7/08
Abstract: The present embodiment relates to a dual lens drive device that comprises: a housing; a first bobbin which is disposed to move in a first direction inside the housing; a second bobbin which is disposed to move in the first direction inside housing and is spaced apart from the first bobbin; a first coil which is disposed on the first bobbin; a second coil which is disposed on the second bobbin; a magnet which is disposed in the housing and faces the first coil and the second coil; a base which is disposed below the housing; a substrate which comprises a circuit member having a third coil disposed to face the magnet between the housing and the base; and a support member which movably supports the housing with respect to the substrate, wherein the housing is integrally formed.
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公开(公告)号：US20240064394A1
公开(公告)日：2024-02-22
申请号：US18259525
申请日：2021-12-28
Applicant: LG INNOTEK CO., LTD.
Inventor： Won Seob SHIN , Tae Young KIM
Abstract: A camera module according to an embodiment includes a circuit board including a cavity; a reinforcing plate including a first region corresponding to the cavity and a second region in which the circuit board is disposed; a wire part disposed in the first region of the reinforcing plate; and an image sensor disposed on the wire part, wherein a lower surface of the image sensor is in direct contact with the wire part, and wherein the wire part and the image sensor are electrically separated from each other.
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公开(公告)号：US20230319382A1
公开(公告)日：2023-10-05
申请号：US18023163
申请日：2021-08-26
Applicant: LG INNOTEK CO., LTD.
Inventor： Won Seob SHIN , Tae Young KIM , Woong HWANG
IPC: H04N23/54
Abstract: A camera module according to an embodiment includes a circuit board; a protrusion disposed on the circuit board; an adhesive member disposed on the circuit board and including an opening vertically overlapping the protrusion; and a sensor base disposed on the adhesive member and including a concave portion vertically overlapping the protrusion, wherein the protrusion is inserted into the concave portion of the sensor base, and wherein the adhesive member has a closed loop shape surrounding an edge region of an upper surface of the circuit board.
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5.发明申请公开(公告)号：US20230070041A1
公开(公告)日：2023-03-09
申请号：US18050291
申请日：2022-10-27
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang Ok PARK , Tae Young KIM , Hyun Ah OH , Youn Baek JEONG
IPC: G03B17/12 , H01F7/16 , H04N5/225 , H04N5/232 , H04N5/247 , H04N5/335 , G03B17/02 , G03B19/22 , H01F7/08
Abstract: The present embodiment relates to a dual camera module comprising: a rigid first substrate having a first image sensor arranged thereon; a rigid second substrate spaced apart from the first substrate and having a second image sensor arranged thereon; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit for connecting the first substrate to the second substrate, wherein the first substrate includes a first side surface, the second substrate includes a second side surface facing the first side surface, and the connection unit connects the first side surface of the first substrate to the second side surface of the second substrate.
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6.发明申请公开(公告)号：US20210191234A1
公开(公告)日：2021-06-24
申请号：US17195035
申请日：2021-03-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang Ok PARK , Tae Young KIM , Hyun Ah OH , Youn Baek JEONG
IPC: G03B17/12 , H01F7/16 , H04N5/225 , H04N5/232 , H04N5/247 , H04N5/335 , G03B17/02 , G03B19/22 , H01F7/08
Abstract: The present embodiment relates to a dual camera module comprising: a rigid first substrate having a first image sensor arranged thereon; a rigid second substrate spaced apart from the first substrate and having a second image sensor arranged thereon; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit for connecting the first substrate to the second substrate, wherein the first substrate includes a first side surface, the second substrate includes a second side surface facing the first side surface, and the connection unit connects the first side surface of the first substrate to the second side surface of the second substrate.
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