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公开(公告)号：US20230319382A1
公开(公告)日：2023-10-05
申请号：US18023163
申请日：2021-08-26
Applicant: LG INNOTEK CO., LTD.
Inventor： Won Seob SHIN , Tae Young KIM , Woong HWANG
IPC: H04N23/54
Abstract: A camera module according to an embodiment includes a circuit board; a protrusion disposed on the circuit board; an adhesive member disposed on the circuit board and including an opening vertically overlapping the protrusion; and a sensor base disposed on the adhesive member and including a concave portion vertically overlapping the protrusion, wherein the protrusion is inserted into the concave portion of the sensor base, and wherein the adhesive member has a closed loop shape surrounding an edge region of an upper surface of the circuit board.
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