公开(公告)号：US20230314663A1

公开(公告)日：2023-10-05

申请号：US18023125

申请日：2021-08-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Ga Young HONG ,  Dae Hee LEE ,  Won Seob SHIN

IPC: G02B1/14

CPC classification number: G02B1/14

Abstract: A protective sheet according to an embodiment includes an optical film layer; and an adhesive layer disposed on one surface of the optical film layer and including a first open region; wherein an outer width of the optical film layer is greater than an outer width of the adhesive layer, wherein a central region of the one surface of the optical film layer is exposed through the first open region of the adhesive layer, and an outer region of the one surface of the optical film layer is exposed by a difference from the outer width of the adhesive layer.

公开(公告)号：US20240064393A1

公开(公告)日：2024-02-22

申请号：US18259713

申请日：2021-12-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Seob SHIN

IPC: H04N23/52 ,  H04N23/63 ,  H04N25/702 ,  H04N23/54

CPC classification number: H04N23/52 ,  H04N23/63 ,  H04N25/702 ,  H04N23/54

Abstract: A camera module according to an embodiment includes a circuit board; and an image sensor disposed on the circuit board; wherein the circuit board includes: an insulating layer; a pad disposed on the insulating layer; a terminal disposed on the insulating layer and spaced apart from the pad; a protective layer disposed on the insulating layer and including an opening exposing the pad and the terminal; a wire part disposed on the pad; and a connecting wire connecting the image sensor and the terminal, wherein a lower surface of the image sensor is in direct contact with the wire part, and wherein the wire part and the image sensor are electrically separated from each other.

公开(公告)号：US20230371170A1

公开(公告)日：2023-11-16

申请号：US18246612

申请日：2021-09-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Seob SHIN

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0224 ,  H05K1/0271 ,  H05K1/0274 ,  H05K9/0022 ,  H05K2201/10121 ,  H05K2201/09063 ,  H05K2201/2081

Abstract: A camera module according to an embodiment includes a reinforcing plate; a substrate disposed on the reinforcing plate; a lens driving unit disposed on the substrate; and an adhesive layer disposed between the reinforcing plate and the substrate, wherein the substrate includes a first cover layer including a plurality of holes; and a circuit pattern layer disposed on the first cover layer; wherein the adhesive layer is adhered contacts the circuit pattern layer through the plurality of holes.

公开(公告)号：US20240089570A1

公开(公告)日：2024-03-14

申请号：US18262847

申请日：2022-01-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Seob SHIN

IPC: H04N23/52 ,  H04N23/54 ,  H04N25/77 ,  H05K1/02

CPC classification number: H04N23/52 ,  H04N23/54 ,  H04N25/77 ,  H05K1/0271 ,  H05K2201/10151 ,  H05K2201/10287

Abstract: A camera module according to an embodiment includes a reinforcing plate; a bump part disposed on the reinforcing plate; a substrate disposed on the reinforcing plate and including a cavity vertically overlapping the bump part; and an image sensor disposed on the bump part, wherein the bump part includes a first bump disposed on the reinforcing plate and having a first height; and a second bump disposed on the first bump and having a second height different from the first height; and wherein an upper surface of the second bump is in direct contact with a lower surface of the image sensor.

公开(公告)号：US20240064394A1

公开(公告)日：2024-02-22

申请号：US18259525

申请日：2021-12-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Seob SHIN ,  Tae Young KIM

IPC: H04N23/54 ,  H04N23/51

CPC classification number: H04N23/54 ,  H04N23/51 ,  H04N23/57

Abstract: A camera module according to an embodiment includes a circuit board including a cavity; a reinforcing plate including a first region corresponding to the cavity and a second region in which the circuit board is disposed; a wire part disposed in the first region of the reinforcing plate; and an image sensor disposed on the wire part, wherein a lower surface of the image sensor is in direct contact with the wire part, and wherein the wire part and the image sensor are electrically separated from each other.

公开(公告)号：US20230319382A1

公开(公告)日：2023-10-05

申请号：US18023163

申请日：2021-08-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Seob SHIN ,  Tae Young KIM ,  Woong HWANG

IPC: H04N23/54

CPC classification number: H04N23/54 ,  G03B30/00

Abstract: A camera module according to an embodiment includes a circuit board; a protrusion disposed on the circuit board; an adhesive member disposed on the circuit board and including an opening vertically overlapping the protrusion; and a sensor base disposed on the adhesive member and including a concave portion vertically overlapping the protrusion, wherein the protrusion is inserted into the concave portion of the sensor base, and wherein the adhesive member has a closed loop shape surrounding an edge region of an upper surface of the circuit board.