公开(公告)号：US20250143046A1

公开(公告)日：2025-05-01

申请号：US18926327

申请日：2024-10-25

Applicant: LITE-ON TECHNOLOGY CORPORATION

Inventor： HSIN-HUI LIANG ,  CHENG-HONG SU ,  CHEN-HSIU LIN ,  CHIH-LI YU ,  CHENG-HAN WANG ,  SHENG-YUN WANG

IPC: H01L33/62 ,  H01L33/52

Abstract: A light emitting diode package structure includes one or more lead frame units, a light emitting element, and an encapsulation unit that completely covers the light emitting element and partially covers the lead frame units. Each lead frame unit includes a chip-mounted portion, a first electrode portion, and a second electrode portion. The first and the second electrode portion extend along a first direction, and are disposed on two sides of the chip-mounted portion. Each lead frame unit further includes multiple first connecting portions extending from the chip-mounted portion along the first direction, and multiple second connecting portions formed by extension of the first and the second electrode portion along a second direction. The light emitting element is fixed to the chip-mounted portion and electrically connected to the electrode portions. A lead frame that includes the at least one lead frame unit is also provided.