公开(公告)号：US20240162396A1

公开(公告)日：2024-05-16

申请号：US18509229

申请日：2023-11-14

Applicant: LITE-ON TECHNOLOGY CORPORATION

Inventor： CHENG-HONG SU ,  CHIH-LI YU ,  CHENG-HAN WANG

IPC: H01L33/58

CPC classification number: H01L33/58

Abstract: A light-emitting package includes a light-transmitting carrier and a light-emitting element. The light-transmitting carrier has a carrying surface, and the light-transmitting carrier contains a base resin and a first phosphorescent powder. The light-emitting element is disposed on the carrying surface. A light-emitting module that contains a phosphorescent powder is also provided.

公开(公告)号：US20210364687A1

公开(公告)日：2021-11-25

申请号：US17323051

申请日：2021-05-18

Applicant: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD. ,  LITE-ON TECHNOLOGY CORPORATION

Inventor： CHENG-HAN WANG ,  SZU-TSUNG KAO ,  CHIH-LI YU ,  CHENG-HONG SU ,  CHUN-WEI HUANG ,  CHEN-HSIU LIN

IPC: F21V8/00

Abstract: A light-emitting device and a light emitting module are provided. The light emitting module includes a housing, at least one light guide element, and at least one light emitting element. The housing includes at least one passage passing through its a first surface and a second surface, and a coupling portion formed on an inner surface adjacent to the second surface. The light guide element arranged in the at least one passage has a light emergent surface exposed at one end of the at least one passage and a light incident surface exposed at the other end of the at least one passage. The light emitting element is coupled to the housing by the coupling portion. The light emitting element includes a light emitting surface facing to the light incident surface of the light guide element and a soldering portion exposed from the housing.

公开(公告)号：US20250143046A1

公开(公告)日：2025-05-01

申请号：US18926327

申请日：2024-10-25

Applicant: LITE-ON TECHNOLOGY CORPORATION

Inventor： HSIN-HUI LIANG ,  CHENG-HONG SU ,  CHEN-HSIU LIN ,  CHIH-LI YU ,  CHENG-HAN WANG ,  SHENG-YUN WANG

IPC: H01L33/62 ,  H01L33/52

Abstract: A light emitting diode package structure includes one or more lead frame units, a light emitting element, and an encapsulation unit that completely covers the light emitting element and partially covers the lead frame units. Each lead frame unit includes a chip-mounted portion, a first electrode portion, and a second electrode portion. The first and the second electrode portion extend along a first direction, and are disposed on two sides of the chip-mounted portion. Each lead frame unit further includes multiple first connecting portions extending from the chip-mounted portion along the first direction, and multiple second connecting portions formed by extension of the first and the second electrode portion along a second direction. The light emitting element is fixed to the chip-mounted portion and electrically connected to the electrode portions. A lead frame that includes the at least one lead frame unit is also provided.

公开(公告)号：US20220404548A1

公开(公告)日：2022-12-22

申请号：US17841122

申请日：2022-06-15

Applicant: LITE-ON TECHNOLOGY CORPORATION

Inventor： CHENG-HAN WANG ,  CHENG-HONG SU ,  CHIH-LI YU

IPC: G02B6/12 ,  H01L25/16 ,  H01L31/0203 ,  H01L31/0232

Abstract: A package structure is provided. The package structure includes at least one optoelectronic device, a lead frame, and an encapsulant. The optoelectronic device is disposed on the lead frame. The lead frame includes at least one lead unit that includes a first lead and a second lead. The first lead has a first bonding part and a first pin. The first bonding part has a first inclined sidewall at an upper end of one side away from the second lead. The second lead has a second pin and a carrying part, of which an upper end has a die-attaching region for carrying the optoelectronic device. The encapsulant covers at least the optoelectronic device, the first bonding part, and the carrying part.