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1.发明申请公开(公告)号：US20130240962A1
公开(公告)日：2013-09-19
申请号：US13836346
申请日：2013-03-15
Inventor： Zhiwei Wang , Jianhong Mao , Fengqin Han , Lei Zhang , Deming Tang
IPC: H01L31/02
CPC classification number: H01L31/02002 , H01L27/14627 , H01L27/1463 , H01L27/14632 , H01L27/14643 , H01L27/14665
Abstract: A photosensitive imaging device and a method for forming a semiconductor device are provided. The method includes: providing a first device layer formed on a first substrate, wherein a conductive top bonding pad layer is formed on the first device layer; providing a continuous second device layer formed on a second substrate, wherein a continuous conductive adhesion layer is formed on the continuous second device layer; bonding the first device layer with the second device layer, where the top bonding pad layer on the first device layer is directly connected with the conductive continuous adhesion layer on the continuous second device layer; removing the second substrate; selectively etching the continuous second device and the continuous conductive adhesion layer to form a groove array; and filling up the groove array with an insulation material to form a plurality of second devices. Alignment accuracy may be improved.
Abstract translation: 提供了一种光敏成像装置和用于形成半导体器件的方法。 该方法包括：提供形成在第一衬底上的第一器件层，其中在第一器件层上形成导电顶焊接层; 提供形成在第二基板上的连续的第二器件层，其中在所述连续的第二器件层上形成连续的导电粘附层; 将第一器件层与第二器件层接合，其中第一器件层上的顶部焊盘层与连续的第二器件层上的导电连续粘合层直接连接; 去除所述第二基板; 选择性地蚀刻连续的第二器件和连续导电粘合层以形成凹槽阵列; 并用绝缘材料填充凹槽阵列以形成多个第二装置。 可以提高对准精度。
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2.发明申请公开(公告)号：US20140139727A1
公开(公告)日：2014-05-22
申请号：US14086493
申请日：2013-11-21
Inventor： Jianhong Mao , Fengqin Han , Deming Tang , Lei Zhang
CPC classification number: H04N5/2254 , B81B7/02 , G02B5/005 , G03B9/02 , H04N5/2253 , H04N5/2353
Abstract: A micro-electro-mechanical system based device for adjusting aperture and a manufacturing method thereof are disclosed. The system includes: an opaque deformable aperture ring, multiple groups of conductive deformable crossbeams and conductive structs; and one or more fixed parts. In each group, each conductive deformable crossbeam corresponds to a conductive struct. The conductive deformable crossbeams and the conductive structs are arranged around the deformable aperture ring and spaced from each other. The conductive deformable crossbeams are suspended in the air, their inner edges are connected with an external edge of the deformable aperture ring, and their external edges are connected with the fixed parts. The conductive structs are connected with the fixed parts and remain stationary. Electrostatic force between the conductive deformable crossbeam and the conductive struct causes the deformable aperture ring to be stretched and rotate, so that area of an inner bore of the deformable aperture ring is changed.
Abstract translation: 公开了一种用于调节孔径的基于微机电系统的装置及其制造方法。 该系统包括：不透明的可变形孔环，多组导电可变形横梁和导电结构; 和一个或多个固定部件。 在每组中，每个导电可变形横梁对应于导电结构。 导电可变形横梁和导电结构体布置在可变形孔环周围并彼此间隔开。 导电可变形横梁悬挂在空气中，它们的内边缘与可变形孔环的外边缘连接，其外边缘与固定部分连接。 导电结构与固定部分连接并保持静止。 导电可变形横梁与导电结构之间的静电力使得可变形的孔环被拉伸和旋转，使得可变形孔环的内孔的面积改变。
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公开(公告)号：US20130285168A1
公开(公告)日：2013-10-31
申请号：US13870533
申请日：2013-04-25
Inventor： Zhiwei Wang , Deming Tang , Lei Zhang , Jianhong Mao , Fengqin Han
CPC classification number: B81C1/00134 , B81B3/0018 , B81B2201/025 , B81C1/00293 , B81C2203/0145 , G01C19/5783 , G01P15/125
Abstract: A MEMS inertial sensor and a method for manufacturing the same are provided. The method includes: depositing a first carbon layer on a semiconductor substrate; patterning the first carbon layer to form a fixed anchor bolt, an inertial anchor bolt and a bottom sealing ring; forming a contact plug in the fixed anchor bolt and a contact plug in the inertial anchor bolt; forming a first fixed electrode, an inertial electrode and a connection electrode on the first carbon layer, where the first fixed electrode and the inertial electrode constitute a capacitor; forming a second carbon layer on the first fixed electrode and the inertial electrode; and forming a sealing cap layer on the second carbon layer and the top sealing ring. Under an inertial force, only the inertial electrode may move, the fixed electrode will almost not move or vibrate, which improves the accuracy of the MEMS inertial sensor.
Abstract translation: 提供了MEMS惯性传感器及其制造方法。 该方法包括：在半导体衬底上沉积第一碳层; 图案化第一碳层以形成固定的锚定螺栓，惯性锚定螺栓和底部密封环; 在固定的锚栓中形成接触塞，并在惯性锚栓中形成接触塞; 在第一碳层上形成第一固定电极，惯性电极和连接电极，其中第一固定电极和惯性电极构成电容器; 在所述第一固定电极和所述惯性电极上形成第二碳层; 以及在所述第二碳层和所述顶部密封环上形成密封盖层。 在惯性力下，只有惯性电极可以移动，固定电极几乎不会移动或振动，这提高了MEMS惯性传感器的精度。
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Patent Agency Ranking
4.发明授权公开(公告)号：US09491340B2
公开(公告)日：2016-11-08
申请号：US14086493
申请日：2013-11-21
Inventor： Jianhong Mao , Fengqin Han , Deming Tang , Lei Zhang
CPC classification number: H04N5/2254 , B81B7/02 , G02B5/005 , G03B9/02 , H04N5/2253 , H04N5/2353
Abstract: A micro-electro-mechanical system based device for adjusting aperture and a manufacturing method thereof are disclosed. The system includes: an opaque deformable aperture ring, multiple groups of conductive deformable crossbeams and conductive structs; and one or more fixed parts. In each group, each conductive deformable crossbeam corresponds to a conductive struct. The conductive deformable crossbeams and the conductive structs are arranged around the deformable aperture ring and spaced from each other. The conductive deformable crossbeams are suspended in the air, their inner edges are connected with an external edge of the deformable aperture ring, and their external edges are connected with the fixed parts. The conductive structs are connected with the fixed parts and remain stationary. Electrostatic force between the conductive deformable crossbeam and the conductive struct causes the deformable aperture ring to be stretched and rotate, so that area of an inner bore of the deformable aperture ring is changed.
Abstract translation: 公开了一种用于调节孔径的基于微机电系统的装置及其制造方法。 该系统包括：不透明的可变形孔环，多组导电可变形横梁和导电结构; 和一个或多个固定部件。 在每组中，每个导电可变形横梁对应于导电结构。 导电可变形横梁和导电结构体布置在可变形孔环周围并彼此间隔开。 导电可变形横梁悬挂在空气中，它们的内边缘与可变形孔环的外边缘连接，其外边缘与固定部分连接。 导电结构与固定部分连接并保持静止。 导电可变形横梁与导电结构之间的静电力使得可变形的孔环被拉伸和旋转，使得可变形孔环的内孔的面积改变。
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5.发明授权Micro-electro-mechanical system based focusing device and manufacturing method thereof 有权基于微电子机械系统的聚焦装置及其制造方法公开(公告)号：US09145293B2
公开(公告)日：2015-09-29
申请号：US14086321
申请日：2013-11-21
Inventor： Jianhong Mao , Fengqin Han , Deming Tang , Lei Zhang
CPC classification number: B81C1/00539 , G02B7/08 , G02B26/00
Abstract: A micro-electro-mechanical system based focusing device and manufacturing method thereof are disclosed. The system includes: a deformable lens, multiple groups of conductive deformable crossbeams and conductive structs; and one or more fixed parts. In each group, each conductive deformable crossbeam corresponds to a conductive struct. The conductive deformable crossbeams and the conductive structs are arranged around the deformable lens and spaced from each other. The conductive deformable crossbeams are suspended in the air, their inner edges are connected with an external edge of the deformable lens and their external edges are connected with the fixed parts. The conductive structs are fixedly connected with the fixed parts and remain stationary. Electrostatic force between the conductive deformable crossbeam and the conductive struct causes the deformable lens to be stretched and rotate, thus, surface curvature and focal length are changed. The device has a small size, low power consumption and low manufacturing cost.
Abstract translation: 公开了一种基于微电子机械系统的聚焦装置及其制造方法。 该系统包括：可变形透镜，多组导电可变形横梁和导电结构; 和一个或多个固定部件。 在每组中，每个导电可变形横梁对应于导电结构。 导电可变形横梁和导电结构体布置在可变形透镜周围并彼此间隔开。 导电可变形横梁悬挂在空气中，它们的内边缘与可变形透镜的外边缘连接，其外边缘与固定部分连接。 导电结构与固定部分固定连接并保持静止。 导电可变形横梁和导电结构之间的静电力使可变形透镜被拉伸和旋转，因此表面曲率和焦距被改变。 该装置体积小，功耗低，制造成本低。
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6.发明授权公开(公告)号：US08945967B2
公开(公告)日：2015-02-03
申请号：US13836346
申请日：2013-03-15
Inventor： Zhiwei Wang , Jianhong Mao , Fengqin Han , Lei Zhang , Deming Tang
IPC: H01L21/00 , H01L31/02 , H01L27/146
CPC classification number: H01L31/02002 , H01L27/14627 , H01L27/1463 , H01L27/14632 , H01L27/14643 , H01L27/14665
Abstract: A photosensitive imaging device and a method for forming a semiconductor device are provided. The method includes: providing a first device layer formed on a first substrate, wherein a conductive top bonding pad layer is formed on the first device layer; providing a continuous second device layer formed on a second substrate, wherein a continuous conductive adhesion layer is formed on the continuous second device layer; bonding the first device layer with the second device layer, where the top bonding pad layer on the first device layer is directly connected with the conductive continuous adhesion layer on the continuous second device layer; removing the second substrate; selectively etching the continuous second device and the continuous conductive adhesion layer to form a groove array; and filling up the groove array with an insulation material to form a plurality of second devices. Alignment accuracy may be improved.
Abstract translation: 提供了一种光敏成像装置和用于形成半导体器件的方法。 该方法包括：提供形成在第一衬底上的第一器件层，其中在第一器件层上形成导电顶焊接层; 提供形成在第二基板上的连续的第二器件层，其中在所述连续的第二器件层上形成连续的导电粘附层; 将第一器件层与第二器件层接合，其中第一器件层上的顶部焊盘层与连续的第二器件层上的导电连续粘合层直接连接; 去除所述第二基板; 选择性地蚀刻连续的第二器件和连续导电粘合层以形成凹槽阵列; 并用绝缘材料填充凹槽阵列以形成多个第二装置。 可以提高对准精度。
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公开(公告)号：US08907434B2
公开(公告)日：2014-12-09
申请号：US13870533
申请日：2013-04-25
Inventor： Zhiwei Wang , Deming Tang , Lei Zhang , Jianhong Mao , Fengqin Han
IPC: H01L29/84 , H01L21/00 , B81C1/00 , B81B3/00 , G01P15/125 , G01C19/5783
CPC classification number: B81C1/00134 , B81B3/0018 , B81B2201/025 , B81C1/00293 , B81C2203/0145 , G01C19/5783 , G01P15/125
Abstract: A MEMS inertial sensor and a method for manufacturing the same are provided. The method includes: depositing a first carbon layer on a semiconductor substrate; patterning the first carbon layer to form a fixed anchor bolt, an inertial anchor bolt and a bottom sealing ring; forming a contact plug in the fixed anchor bolt and a contact plug in the inertial anchor bolt; forming a first fixed electrode, an inertial electrode and a connection electrode on the first carbon layer, where the first fixed electrode and the inertial electrode constitute a capacitor; forming a second carbon layer on the first fixed electrode and the inertial electrode; and forming a sealing cap layer on the second carbon layer and the top sealing ring. Under an inertial force, only the inertial electrode may move, the fixed electrode will almost not move or vibrate, which improves the accuracy of the MEMS inertial sensor.
Abstract translation: 提供了MEMS惯性传感器及其制造方法。 该方法包括：在半导体衬底上沉积第一碳层; 图案化第一碳层以形成固定的锚定螺栓，惯性锚定螺栓和底部密封环; 在固定的锚栓中形成接触塞，并在惯性锚栓中形成接触塞; 在第一碳层上形成第一固定电极，惯性电极和连接电极，其中第一固定电极和惯性电极构成电容器; 在所述第一固定电极和所述惯性电极上形成第二碳层; 以及在所述第二碳层和所述顶部密封环上形成密封盖层。 在惯性力下，只有惯性电极可以移动，固定电极几乎不会移动或振动，这提高了MEMS惯性传感器的精度。
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8.发明申请MICRO-ELECTRO-MECHANICAL SYSTEM BASED FOCUSING DEVICE AND MANUFACTURING METHOD THEREOF 有权基于微电子机械系统的聚焦装置及其制造方法公开(公告)号：US20140139937A1
公开(公告)日：2014-05-22
申请号：US14086321
申请日：2013-11-21
Inventor： Jianhong Mao , Fengqin Han , Deming Tang , Lei Zhang
CPC classification number: B81C1/00539 , G02B7/08 , G02B26/00
Abstract: A micro-electro-mechanical system based focusing device and manufacturing method thereof are disclosed. The system includes: a deformable lens, multiple groups of conductive deformable crossbeams and conductive structs; and one or more fixed parts. In each group, each conductive deformable crossbeam corresponds to a conductive struct. The conductive deformable crossbeams and the conductive structs are arranged around the deformable lens and spaced from each other. The conductive deformable crossbeams are suspended in the air, their inner edges are connected with an external edge of the deformable lens and their external edges are connected with the fixed parts. The conductive structs are fixedly connected with the fixed parts and remain stationary. Electrostatic force between the conductive deformable crossbeam and the conductive struct causes the deformable lens to be stretched and rotate, thus, surface curvature and focal length are changed. The device has a small size, low power consumption and low manufacturing cost.
Abstract translation: 公开了一种基于微电子机械系统的聚焦装置及其制造方法。 该系统包括：可变形透镜，多组导电可变形横梁和导电结构; 和一个或多个固定部件。 在每组中，每个导电可变形横梁对应于导电结构。 导电可变形横梁和导电结构体布置在可变形透镜周围并彼此间隔开。 导电可变形横梁悬挂在空气中，它们的内边缘与可变形透镜的外边缘连接，其外边缘与固定部分连接。 导电结构与固定部分固定连接并保持静止。 导电可变形横梁和导电结构之间的静电力使可变形透镜被拉伸和旋转，因此表面曲率和焦距被改变。 该装置体积小，功耗低，制造成本低。
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