公开(公告)号：US07680321B2

公开(公告)日：2010-03-16

申请号：US12101260

申请日：2008-04-11

Applicant: David Dixon ,  Lloyd Lee

Inventor： David Dixon ,  Lloyd Lee

IPC: G06K9/00

CPC classification number: G01N21/95607 ,  G01N21/278 ,  G01N21/93 ,  G01N21/9501 ,  G01N2021/8416 ,  G01N2201/0695 ,  G01N2201/12753

Abstract: An after develop inspection tool considers tool-to-tool variability when determining confidence score for wafers under inspection. A golden wafer is used to calculate a RGB signature as well as the slope of the individual RGB curves for different lamp intensities. These slopes are normalized in order to generate a compensation factor for red values and blue values within a signature. When a wafer is subsequently inspected at an ADI station using a different lamp, the test wafer RGB signature is likely captured at a different lamp intensity. Consequently, when comparing the signatures, the golden wafer RGB signature is adjusted by the compensation factors, based on the different lamp's intensity setting, and this adjusted RGB signature is then used to determine whether a defect exists on the test wafer.

Abstract translation: 在确定检查中的晶片的置信度得分后，开发后的检查工具会考虑刀具对刀具的变异性。 使用金色晶片来计算RGB特征以及不同灯泡强度的各个RGB曲线的斜率。 这些斜率被归一化以便在签名中产生红色值和蓝色值的补偿因子。 当使用不同的灯随后在ADI站检查晶片时，可能以不同的灯强度捕获测试晶片RGB特征。 因此，当比较签名时，基于不同的灯的强度设置，通过补偿因子来调整金色晶片RGB签名，然后使用该调整的RGB签名来确定在测试晶片上是否存在缺陷。

公开(公告)号：US20050146716A1

公开(公告)日：2005-07-07

申请号：US10749887

申请日：2003-12-31

Applicant: David Dixon ,  Lloyd Lee

Inventor： David Dixon ,  Lloyd Lee

IPC: G01N21/27 ,  G01N21/93 ,  G01N21/95 ,  G01N21/956 ,  G01N21/00

CPC classification number: G01N21/95607 ,  G01N21/278 ,  G01N21/93 ,  G01N21/9501 ,  G01N2021/8416 ,  G01N2201/0695 ,  G01N2201/12753

Abstract: An after develop inspection tool considers tool-to-tool variability when determining confidence score for wafers under inspection. A golden wafer is used to calculate a RGB signature as well as the slope of the individual RGB curves for different lamp intensities. These slopes are normalized in order to generate a compensation factor for red values and blue values within a signature. When a wafer is subsequently inspected at an ADI station using a different lamp, the test wafer RGB signature is likely captured at a different lamp intensity. Consequently, when comparing the signatures, the golden wafer RGB signature is adjusted by the compensation factors, based on the different lamp's intensity setting, and this adjusted RGB signature is then used to determine whether a defect exists on the test wafer.

Abstract translation: 在确定检查中的晶片的置信度得分后，开发后的检查工具会考虑刀具对刀具的变异性。 使用金色晶片来计算RGB特征以及不同灯泡强度的各个RGB曲线的斜率。 这些斜率被归一化以便在签名中产生红色值和蓝色值的补偿因子。 当使用不同的灯随后在ADI站检查晶片时，可能以不同的灯强度捕获测试晶片RGB特征。 因此，当比较签名时，基于不同的灯的强度设置，通过补偿因子来调整金色晶片RGB签名，然后使用该调整的RGB签名来确定在测试晶片上是否存在缺陷。

公开(公告)号：US3937850A

公开(公告)日：1976-02-10

申请号：US403575

申请日：1973-10-04

Applicant: Bahia Rashid Farha ,  Lloyd Lee

Inventor： Bahia Rashid Farha ,  Lloyd Lee

IPC: A23N4/12 ,  A23P1/00

CPC classification number: A23N4/12

Abstract: Method for hollowing out an article of food such as a fruit or vegetable so that a shell of substantially uniform predetermined thickness is formed. A rotating knife is rotated about its axis, while an end area of an article of food is guided with a curved guide member against the rotating knife. The guide member loosely supports the food for rotation and translation about its longitudinal axis while maintaining the knife a predetermined distance from the surface of the food. The distance between the guide and the blade is adjustable to control the thickness of the shell.

公开(公告)号：US07625680B2

公开(公告)日：2009-12-01

申请号：US11536991

申请日：2006-09-29

Applicant: Lloyd Lee

Inventor： Lloyd Lee

IPC: G03C5/00 ,  H05B3/68

CPC classification number: G01N21/4788

Abstract: A method of real time dynamic CD control in a system for heat-treating resist coated wafers on a hotplate. The method includes establishing a temperature profile for a hotplate surface, where the hotplate surface is divided into a plurality of temperature control zones, and sequentially heat-treating the resist coated wafers on the hotplate. The method further includes obtaining CD metrology data from test areas on the heat-treated wafers, where different groups of test areas are selected for two or more of the heat-treated wafers. A CD metrology data map is constructed using the CD metrology data and an adjusted temperature profile is established for the hotplate surface using the CD metrology data. Additional wafers are then heat-treated on the hotplate. The method also may be applied to heat-treating resist coated wafers on a plurality of hotplates.

Abstract translation: 一种用于在电热板上热处理抗蚀涂层晶片的系统中的实时动态CD控制的方法。 该方法包括建立用于加热板表面的温度分布，其中将热板表面分成多个温度控制区，并依次热处理加热板上的抗蚀剂涂覆的晶片。 该方法还包括从经热处理的晶片上的测试区域获得CD测量数据，其中为两个或更多个经热处理的晶片选择不同组的测试区域。 使用CD测量数据构建CD测量数据图，并使用CD测量数据为热板表面建立调整的温度曲线。 然后在电热板上对另外的晶片进行热处理。 该方法还可以应用于在多个电镀板上热处理抗蚀剂涂覆的晶片。

公开(公告)号：US20080218745A1

公开(公告)日：2008-09-11

申请号：US12101260

申请日：2008-04-11

Applicant: David Dixon ,  Lloyd Lee

Inventor： David Dixon ,  Lloyd Lee

IPC: G01N21/00

CPC classification number: G01N21/95607 ,  G01N21/278 ,  G01N21/93 ,  G01N21/9501 ,  G01N2021/8416 ,  G01N2201/0695 ,  G01N2201/12753

Abstract: An after develop inspection tool considers tool-to-tool variability when determining confidence score for wafers under inspection. A golden wafer is used to calculate a RGB signature as well as the slope of the individual RGB curves for different lamp intensities. These slopes are normalized in order to generate a compensation factor for red values and blue values within a signature. When a wafer is subsequently inspected at an ADI station using a different lamp, the test wafer RGB signature is likely captured at a different lamp intensity. Consequently, when comparing the signatures, the golden wafer RGB signature is adjusted by the compensation factors, based on the different lamp's intensity setting, and this adjusted RGB signature is then used to determine whether a defect exists on the test wafer.

Abstract translation: 在确定检查中的晶片的置信度得分后，开发后的检查工具会考虑刀具对刀具的变异性。 使用金色晶片来计算RGB特征以及不同灯泡强度的各个RGB曲线的斜率。 这些斜率被归一化以便在签名中产生红色值和蓝色值的补偿因子。 当使用不同的灯随后在ADI站检查晶片时，可能以不同的灯强度捕获测试晶片RGB特征。 因此，当比较签名时，基于不同的灯的强度设置，通过补偿因子来调整金色晶片RGB签名，然后使用该调整的RGB签名来确定在测试晶片上是否存在缺陷。

公开(公告)号：US07359545B2

公开(公告)日：2008-04-15

申请号：US10749887

申请日：2003-12-31

Applicant: David Dixon ,  Lloyd Lee

Inventor： David Dixon ,  Lloyd Lee

IPC: G06K9/00

CPC classification number: G01N21/95607 ,  G01N21/278 ,  G01N21/93 ,  G01N21/9501 ,  G01N2021/8416 ,  G01N2201/0695 ,  G01N2201/12753

Abstract: An after develop inspection tool considers tool-to-tool variability when determining confidence score for wafers under inspection. A golden wafer is used to calculate a RGB signature as well as the slope of the individual RGB curves for different lamp intensities. These slopes are normalized in order to generate a compensation factor for red values and blue values within a signature. When a wafer is subsequently inspected at an ADI station using a different lamp, the test wafer RGB signature is likely captured at a different lamp intensity. Consequently, when comparing the signatures, the golden wafer RGB signature is adjusted by the compensation factors, based on the different lamp's intensity setting, and this adjusted RGB signature is then used to determine whether a defect exists on the test wafer.

Abstract translation: 在确定检查中的晶片的置信度得分后，开发后的检查工具会考虑刀具对刀具的变异性。 使用金色晶片来计算RGB特征以及不同灯泡强度的各个RGB曲线的斜率。 这些斜率被归一化以便在签名中产生红色值和蓝色值的补偿因子。 当使用不同的灯随后在ADI站检查晶片时，可能以不同的灯强度捕获测试晶片RGB特征。 因此，当比较签名时，基于不同的灯的强度设置，通过补偿因子来调整金色晶片RGB签名，然后使用该调整的RGB签名来确定在测试晶片上是否存在缺陷。

公开(公告)号：US20080081271A1

公开(公告)日：2008-04-03

申请号：US11536991

申请日：2006-09-29

Applicant: Lloyd Lee

Inventor： Lloyd Lee

IPC: G03F7/26

CPC classification number: G01N21/4788

Abstract: A method of real time dynamic CD control in a system for heat-treating resist coated wafers on a hotplate. The method includes establishing a temperature profile for a hotplate surface, where the hotplate surface is divided into a plurality of temperature control zones, and sequentially heat-treating the resist coated wafers on the hotplate. The method further includes obtaining CD metrology data from test areas on the heat-treated wafers, where different groups of test areas are selected for two or more of the heat-treated wafers. A CD metrology data map is constructed using the CD metrology data and an adjusted temperature profile is established for the hotplate surface using the CD metrology data. Additional wafers are then heat-treated on the hotplate. The method also may be applied to heat-treating resist coated wafers on a plurality of hotplates.

Abstract translation: 一种用于在电热板上热处理抗蚀涂层晶片的系统中的实时动态CD控制的方法。 该方法包括建立用于加热板表面的温度分布，其中将热板表面分成多个温度控制区，并且依次热处理加热板上的抗蚀剂涂覆的晶片。 该方法还包括从经热处理的晶片上的测试区域获得CD测量数据，其中为两个或更多个经热处理的晶片选择不同组的测试区域。 使用CD测量数据构建CD测量数据图，并使用CD测量数据为热板表面建立调整的温度曲线。 然后在电热板上对另外的晶片进行热处理。 该方法还可以应用于在多个电镀板上热处理抗蚀剂涂覆的晶片。