公开(公告)号：US20160105970A1

公开(公告)日：2016-04-14

申请号：US14511549

申请日：2014-10-10

Applicant: Lockheed Martin Corporation

Inventor： Stephen Gonya ,  James Sean Eiche ,  James Patterson ,  Kenneth R. Twigg

IPC: H05K3/02 ,  H05K3/28 ,  H05K1/11 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K1/0284 ,  H05K3/06 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/09872

Abstract: A method of producing a non-planar conforming circuit on a non-planar surface includes creating a first set of conforming layers. The first set of conforming layers is created by applying an oxide dielectric layer to the surface, applying a conductive material layer to the oxide dielectric layer, applying a resist layer to the conductive material layer, patterning the resist layer according to a desired circuit layout, etching the surface to remove exposed conductive material, and stripping the resist layer. The process may be repeated to form multiple layers of conforming circuits with electrical connections between layers formed by blind microvias. The resulting set of conforming layers can be sealed.

公开(公告)号：US10123410B2

公开(公告)日：2018-11-06

申请号：US14511549

申请日：2014-10-10

Applicant: Lockheed Martin Corporation

Inventor： Stephen Gonya ,  James Sean Eiche ,  James Patterson ,  Kenneth R. Twigg

IPC: H05K1/11 ,  H05K1/05 ,  H05K1/09 ,  H05K13/00 ,  H05K1/02 ,  H05K3/06

Abstract: A method of producing a non-planar conforming circuit on a non-planar surface includes creating a first set of conforming layers. The first set of conforming layers is created by applying an oxide dielectric layer to the surface, applying a conductive material layer to the oxide dielectric layer, applying a resist layer to the conductive material layer, patterning the resist layer according to a desired circuit layout, etching the surface to remove exposed conductive material, and stripping the resist layer. The process may be repeated to form multiple layers of conforming circuits with electrical connections between layers formed by blind microvias. The resulting set of conforming layers can be sealed.

公开(公告)号：US10154584B2

公开(公告)日：2018-12-11

申请号：US15222333

申请日：2016-07-28

Applicant: Lockheed Martin Corporation

Inventor： Stephen Gonya ,  James Sean Eiche ,  James Patterson ,  Kenneth R. Twigg

IPC: H05K1/02 ,  H05K3/06

Abstract: A method of producing a non-planar conforming circuit on a non-planar surface includes creating a first set of conforming layers. The first set of conforming layers is created by applying an oxide dielectric layer to the surface, applying a conductive material layer to the oxide dielectric layer, applying a resist layer to the conductive material layer, patterning the resist layer according to a desired circuit layout, etching the surface to remove exposed conductive material, and stripping the resist layer. The process may be repeated to form multiple layers of conforming circuits with electrical connections between layers formed by blind microvias. The resulting set of conforming layers can be sealed.