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公开(公告)号：US20240244764A1
公开(公告)日：2024-07-18
申请号：US18617511
申请日：2024-03-26
Applicant: LongKai LI
Inventor： LongKai LI
CPC classification number: H05K3/4611 , H05K1/0216 , H05K1/028 , H05K2203/1105
Abstract: The present invention discloses a method for manufacturing a multi-layer flexible circuit board, comprising the steps of: (1) manufacturing a double-sided FPC flexible board; (2) manufacturing a novel material layer structure; (3) hot pressing at least one group of upper novel material layer structures on the circuits on the upper and/or lower surfaces of the double-sided FPC flexible board; forming a protective layer on the circuits of an outermost novel material layer structure and/or on exposed circuits of the double-sided FPC flexible board so as to obtain a multi-layer flexible circuit board. The present invention also discloses a multi-layer flexible circuit board manufactured by performing the above-mentioned method. The manufacturing process of the present invention is simplified, convenient and efficient; the multi-layer flexible circuit board not only greatly simplifies the novel material layer structure and reduces the overall thickness, but also has the function of high-speed transmission of high-frequency signals, especially suitable for new 5G technology products. It can protect and resist the migration of copper ions when it is energized between circuits so as to ensure the safety and normal operation of circuits.
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2.发明公开公开(公告)号：US20240244763A1
公开(公告)日：2024-07-18
申请号：US18617496
申请日：2024-03-26
Applicant: LongKai LI
Inventor： LongKai LI
CPC classification number: H05K3/44 , H05K1/0237 , H05K2203/11
Abstract: The present invention discloses a method for coating and forming a novel material layer structure of a high-frequency circuit board, comprising the steps of: (1) coating a synthetic liquid film on a copper foil; (2) delivering the same to a tunnel oven for roasting, and forming a cured film on the copper foil to obtain a single-sided board; (3) coating a layer of synthetic liquid high-frequency material on the cured film; and (4) delivering the same to the tunnel oven for roasting until the synthetic liquid high-frequency material layer becomes a semi-cured high-frequency material layer so as to obtain a novel material layer structure of a high-frequency circuit board. An article prepared by performing the above methods is also disclosed. The prepared novel material layer structure of the high-frequency circuit board has the performance of high-speed transmission of high-frequency signals, and can adapt to the current high-frequency and high-speed trend from wireless network to terminal applications, especially for new 5G technology products. It can be used as a circuit board preparation material to make a single-layer circuit board, a multi-layer flexible circuit board and a multi-layer soft-hard combined board, which brings great convenience to circuit board preparation and simplifies the process.
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3.发明公开公开(公告)号：US20240284599A1
公开(公告)日：2024-08-22
申请号：US18617514
申请日：2024-03-26
Applicant: LongKai LI
Inventor： LongKai LI
CPC classification number: H05K3/0011 , H05K1/056 , H05K2201/0112 , H05K2201/0129 , H05K2201/0141 , H05K2201/0145 , H05K2201/015 , H05K2201/0154 , H05K2203/1581
Abstract: The present invention discloses a method for preparing a novel material layer structure of a circuit board, comprising the steps of: (1) combining a film with a copper layer to form an FCCL single-sided board; (2) applying a semi-cured functional material layer on a back side of the film of the FCCL single-sided board, wherein the semi-cured functional material layer is an MPI film, an LCP film, a TFP film, a PTFE film, a copper ion migration resistant film, an LDK high-frequency functional adhesive, a copper ion migration resistant adhesive, or a mixture of the LDK high-frequency functional adhesive and the copper ion migration resistant adhesive to form a novel material layer structure for a circuit board. An article prepared by performing the above methods is also disclosed. The prepared novel material layer structure of the circuit board has high-frequency characteristics and/or copper ion migration resistance, and can be used as an integral structure. In the circuit board manufacturing process, it can be manufactured as the circuit board manufacturing material to be different circuit board structures, which brings great convenience for subsequent circuit board manufacturing and simplifies the manufacturing process.
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Patent Agency Ranking
4.发明公开公开(公告)号：US20240244757A1
公开(公告)日：2024-07-18
申请号：US18617516
申请日：2024-03-26
Applicant: LongKai LI
Inventor： LongKai LI
CPC classification number: H05K3/025 , H05K1/095 , H05K3/007 , H05K3/384 , H05K2201/0355
Abstract: The present invention discloses a method for preparing a novel material layer structure of a high-frequency circuit board, comprising the steps of: (1) coating a synthetic liquid TFP film on a cured PI film; (2) delivering the same to a tunnel oven for roasting in sections to form a semi-cured TFP film on a front surface of the cured PI film; and (3) hot pressing a copper foil on the semi-cured TFP film to obtain a novel single-sided material layer structure of a high-frequency circuit board. The present invention also discloses a novel material layer structure of a high-frequency circuit board prepared by performing the above-mentioned method. The prepared novel material layer structure of the high-frequency circuit board has the performance of high-speed transmission of high-frequency signals, and can adapt to the current high-frequency and high-speed trend from wireless network to terminal applications, especially for new 5G technology products. It can be used as a circuit board preparation material to manufacture a circuit board structure, such as a single-layer circuit board, a multi-layer flexible circuit board and a multi-layer soft-hard combined board, which brings great convenience to subsequent preparation for the circuit board and simplifies the process.
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公开(公告)号：US20220330437A1
公开(公告)日：2022-10-13
申请号：US17753111
申请日：2019-10-23
Applicant: LongKai LI
Inventor： LongKai LI
Abstract: The present invention discloses a method for manufacturing a multi-layer flexible circuit board, comprising the steps of: (1) manufacturing a double-sided FPC flexible board; (2) manufacturing a novel material layer structure; (3) hot pressing at least one group of upeer novel material layer structures on the circuits on the upper and/or lower surfaces of the double-sided FPC flexible board; forming a protective layer on the circuits of an outermost novel material layer structure and/or on exposed circuits of the double-sided FPC flexible board so as to obtain a multi-layer flexible circuit board. The present invention also discloses a multi-layer flexible circuit board manufactured by performing the above-mentioned method. The manufacturing process of the present invention is simplified, convenient and efficient; the multi-layer flexible circuit board not only greatly simplifies the novel material layer structure and reduces the overall thickness, but also has the function of high-speed transmission of high-frequency signals, especially suitable for new 5G technology products. It can protect and resist the migration of copper ions when it is energized between circuits so as to ensure the safety and normal operation of circuits.
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公开(公告)号：US20220304165A1
公开(公告)日：2022-09-22
申请号：US17753128
申请日：2019-10-23
Applicant: LongKai LI
Inventor： LongKai LI
Abstract: The present invention discloses a method for coating and forming a novel material layer structure of a high-frequency circuit board, comprising the steps of: (1) coating a synthetic liquid film on a copper foil; (2) delivering the same to a tunnel oven for roasting, and forming a cured film on the copper foil to obtain a single-sided board; (3) coating a layer of synthetic liquid high-frequency material on the cured film; and (4) delivering the same to the tunnel oven for roasting until the synthetic liquid high-frequency material layer becomes a semi-cured high-frequency material layer so as to obtain a novel material layer structure of a high-frequency circuit board. An article prepared by performing the above methods is also disclosed. The prepared novel material layer structure of the high-frequency circuit board has the performance of high-speed transmission of high-frequency signals, and can adapt to the current high-frequency and high-speed trend from wireless network to terminal applications, especially for new 5G technology products. It can be used as a circuit board preparation material to make a single-layer circuit board, a multi-layer flexible circuit board and a multi-layer soft-hard combined board, which brings great convenience to circuit board preparation and simplifies the process.
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公开(公告)号：US20220304161A1
公开(公告)日：2022-09-22
申请号：US17753127
申请日：2019-10-23
Applicant: LongKai LI
Inventor： LongKai LI
Abstract: The present invention discloses a method for preparing a novel material layer structure of a high-frequency circuit board, comprising the steps of: (1) coating a synthetic liquid TFP film on a cured PI film; (2) delivering the same to a tunnel oven for roasting in sections to form a semi-cured TFP film on a front surface of the cured PI film; and (3) hot pressing a copper foil on the semi-cured TFP film to obtain a novel single-sided material layer structure of a high-frequency circuit board. The present invention also discloses a novel material layer structure of a high-frequency circuit board prepared by performing the above-mentioned method. The prepared novel material layer structure of the high-frequency circuit board has the performance of high-speed transmission of high-frequency signals, and can adapt to the current high-frequency and high-speed trend from wireless network to terminal applications, especially for new 5G technology products. It can be used as a circuit board preparation material to manufacture a circuit board structure, such as a single-layer circuit board, a multi-layer flexible circuit board and a multi-layer soft-hard combined board, which brings great convenience to subsequent preparation for the circuit board and simplifies the process.
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公开(公告)号：US20220272845A1
公开(公告)日：2022-08-25
申请号：US17753107
申请日：2019-10-23
Applicant: LongKai LI
Inventor： LongKai LI
Abstract: The present invention discloses a method for preparing a novel material layer structure of a circuit board, comprising the steps of: (1) combining a film with a copper layer to form an FCCL single-sided board; (2) applying a semi-cured functional material layer on a back side of the film of the FCCL single-sided board, wherein the semi-cured functional material layer is an MPI film, an LCP film, a TFP film, a PTFE film, a copper ion migration resistant film, an LDK high-frequency functional adhesive, a copper ion migration resistant adhesive, or a mixture of the LDK high-frequency functional adhesive and the copper ion migration resistant adhesive to form a novel material layer structure for a circuit board. An article prepared by performing the above methods is also disclosed. The prepared novel material layer structure of the circuit board has high-frequency characteristics and/or copper ion migration resistance, and can be used as an integral structure. In the circuit board manufacturing process, it can be manufactured as the circuit board manufacturing material to be different circuit board structures, which brings great convenience for subsequent circuit board manufacturing and simplifies the manufacturing process.
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