公开(公告)号：US08618807B2

公开(公告)日：2013-12-31

申请号：US12826568

申请日：2010-06-29

Applicant: Luc Albarede ,  Vijayakumar C Venugopal

Inventor： Luc Albarede ,  Vijayakumar C Venugopal

IPC: G01R31/00

CPC classification number: H01J37/32935 ,  G05B2219/31202

Abstract: A method for detecting an in-situ fast transient event within a processing chamber during substrate processing is provided. The method includes a set of sensors comparing a data set to a set of criteria (in-situ fast transient events) to determine if the first data set includes a potential in-situ fast transient event. If the first data set includes the potential in-situ fast transient event, the method also includes saving an electrical signature that occurs in a time period during which the potential in-situ fast transient event occurs. The method further includes comparing the electrical signature against a set of stored arc signatures. If a match is determined, the method yet also includes classifying the electrical signature as a first in-situ fast transient event and determining a severity level for the first in-situ fast transient event based on a predefined set of threshold ranges.

Abstract translation: 提供了一种用于在衬底处理期间检测处理室内的原位快速瞬变事件的方法。 该方法包括将数据集与一组标准（原位快速瞬变事件）进行比较的一组传感器，以确定第一数据集是否包括潜在的原位快速瞬变事件。 如果第一数据集包括潜在的原位快速瞬变事件，则该方法还包括保存在潜在的原位快速瞬变事件发生的时间段内发生的电特征。 该方法还包括将电特征与一组存储的电弧特征进行比较。 如果确定匹配，则该方法还包括将电特征分类为第一原位快速瞬时事件，并且基于预定义的一组阈值范围来确定第一原位快速瞬变事件的严重性级别。

公开(公告)号：US08473089B2

公开(公告)日：2013-06-25

申请号：US12826575

申请日：2010-06-29

Applicant: Luc Albarede ,  Eric Pape ,  Vijayakumar C Venugopal ,  Brian D Choi

Inventor： Luc Albarede ,  Eric Pape ,  Vijayakumar C Venugopal ,  Brian D Choi

IPC: G06F19/00

CPC classification number: H01J37/32935 ,  H01J37/32477

Abstract: A method for assessing health status of a processing chamber is provided. The method includes executing a recipe. The method also includes receiving processing data from a set of sensors during execution of the recipe. The method further includes analyzing the processing data utilizing a set of multi-variate predictive models. The method yet also includes generating a set of component wear data values. The method yet further includes comparing the set of component wear data values against a set of useful life threshold ranges. The method moreover includes generating a warning if the set of component wear data values is outside of the set of useful life threshold ranges.

Abstract translation: 提供了一种用于评估处理室的健康状况的方法。 该方法包括执行食谱。 该方法还包括在执行配方期间从一组传感器接收处理数据。 该方法还包括利用一组多变量预测模型分析处理数据。 该方法还包括生成一组组件磨损数据值。 该方法还包括将组件磨损数据值集合与一组使用寿命阈值范围进行比较。 该方法还包括如果组件磨损数据值的集合超出了使用寿命阈值范围的集合，则产生警告。

公开(公告)号：US08295966B2

公开(公告)日：2012-10-23

申请号：US12826562

申请日：2010-06-29

Applicant: Brian D Choi ,  Gunsu Yun ,  Vijayakumar C Venugopal

Inventor： Brian D Choi ,  Gunsu Yun ,  Vijayakumar C Venugopal

IPC: G06F19/00 ,  H01L21/00 ,  C23C16/00

CPC classification number: G05B23/0254 ,  G05B2219/37224

Abstract: A method for predicting etch rate uniformity for qualifying health status of a processing chamber during substrate processing of substrates is provided. The method includes executing a recipe and receiving processing data from a first set of sensors. The method further includes analyzing the processing data utilizing a subsystem health check predictive model to determine calculated data, which includes at least one of etch rate data and uniformity data. The subsystem health check predictive model is constructed by correlating measurement data from a set of film substrates with processing data collected during analogous processing of a set of non-film substrates. The method yet also includes performing a comparison of the calculated data against a set of control limits as defined by the subsystem health check predictive model. The method yet further includes generating a warning if the calculated data is outside of the set of control limits.

Abstract translation: 提供了一种用于在衬底的衬底处理期间预测用于限定处理室的健康状况的蚀刻速率均匀性的方法。 该方法包括执行食谱并从第一组传感器接收处理数据。 该方法还包括利用子系统健康检查预测模型来分析处理数据，以确定计算出的数据，其包括蚀刻速率数据和均匀性数据中的至少一个。 通过将来自一组膜基底的测量数据与在一组非膜基底的类似处理期间收集的处理数据相关联来构建子系统健康检查预测模型。 该方法还包括执行计算数据与由子系统健康检查预测模型定义的一组控制限制的比较。 该方法还包括如果所计算的数据超出该组控制限制，则产生警告。

公开(公告)号：US08538572B2

公开(公告)日：2013-09-17

申请号：US12826564

申请日：2010-06-29

Applicant: Jiangxin Wang ,  Andrew James Perry ,  Vijayakumar C Venugopal

Inventor： Jiangxin Wang ,  Andrew James Perry ,  Vijayakumar C Venugopal

IPC: G06F19/00 ,  G05B13/02 ,  H01L21/00 ,  G06F15/00

CPC classification number: H01J37/32963 ,  H01J37/32935

Abstract: A method for automatically identifying an optimal endpoint algorithm for qualifying a process endpoint during substrate processing within a plasma processing system is provided. The method includes receiving sensor data from a plurality of sensors during substrate processing of at least one substrate within the plasma processing system, wherein the sensor data includes a plurality of signal streams from a plurality of sensor channels. The method also includes identifying an endpoint domain, wherein the endpoint domain is an approximate period within which the process endpoint is expected to occur. The method further includes analyzing the sensor data to generate a set of potential endpoint signatures. The method yet also includes converting the set of potential endpoint signatures into a set of optimal endpoint algorithms. The method yet further includes importing one optimal endpoint algorithm of the set of optimal endpoint algorithms into production environment.

Abstract translation: 提供了一种用于在等离子体处理系统内的衬底处理期间自动识别用于限定过程端点的最佳端点算法的方法。 该方法包括在等离子体处理系统内至少一个衬底的衬底处理期间从多个传感器接收传感器数据，其中传感器数据包括来自多个传感器通道的多个信号流。 该方法还包括识别端点域，其中端点域是期望发生过程端点的近似周期。 该方法还包括分析传感器数据以产生一组潜在的端点签名。 该方法还包括将潜在端点签名的集合转换成一组最优端点算法。 该方法还包括将一组最优端点算法的一个最优端点算法导入到生产环境中。