公开(公告)号：US3909680A

公开(公告)日：1975-09-30

申请号：US47280274

申请日：1974-05-23

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： TSUNASHIMA EIICHI

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/00 ,  H05K3/28 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H01C13/00 ,  H02B9/00

CPC classification number: H05K3/28 ,  H05K1/0366 ,  H05K1/095 ,  H05K1/167 ,  H05K3/0094 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/0769 ,  H05K2201/09581 ,  H05K2203/122 ,  H05K2203/1461

Abstract: In a printed circuit board, on which there are formed printed components such as resistors and capacitors and printed conductors, which comprise silver or silver powder and resin, such as an electrode of a component and a connecting conductor, there are provided under coating layer and/or an over coating layer comprising insulating resin and an organic inhibitor so as to prevent migration of silver from the conductor of a higher potential to the conductor of a lower potential.

Abstract translation: 在印刷电路板中，在其上形成诸如电阻器和电容器的印刷部件和印刷导体，其包括银或银粉末和树脂，例如部件的电极和连接导体，设置在涂层和 /或包含绝缘树脂和有机抑制剂的覆盖层，以防止银从较高电位的导体迁移到较低电位的导体。