Abstract:
A MEMS chip assembly including: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, each MEMS chip having an active surface including one or more MEMS devices and a plurality of bond pads disposed alongside a connection edge of the MEMS chip; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has encapsulant-retaining trenches defined in the active surface extending alongside the connection edge, each encapsulant-retaining trench being disposed between the bond pads and the MEMS devices.
Abstract:
An inkjet ink for improving printhead lifetimes includes: an aqueous-based ink vehicle; a colorant; an anti-kogation additive; and an anti-corrosion additive having at least one acetylenic group, the acetylenic group being absent any tertiary or quaternary α-carbon atoms.
Abstract:
An inkjet nozzle device includes: a firing chamber having a nozzle aperture; and a heating element for generating gas bubbles in the firing chamber so as to eject ink through the nozzle aperture. A non-heating stabilizing bar extends across the nozzle aperture.
Abstract:
An inkjet nozzle device includes: a firing chamber having a nozzle aperture; and a heating element for generating gas bubbles in the firing chamber so as to eject ink through the nozzle aperture. A non-heating stabilizing bar extends across the nozzle aperture.
Abstract:
A MEMS chip assembly includes: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, the MEMS chip having an active surface including one or more rows of MEMS devices and a row of bond pads disposed alongside a connection edge of the MEMS chip and parallel with the rows of MEMS devices; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has a plurality of trenches defined in the active surface, the trenches extending parallel with the rows of MEMS devices and disposed between the bond pads and the MEMS devices. The encapsulant material does not encroach past the trenches towards the MEMS devices.
Abstract:
An inkjet printhead includes: an elongate support having a printhead mounting surface; a plurality of butting printhead chips mounted on the printhead mounting surface, each printhead chip having an ink ejection surface including one or more nozzle rows; and a grout material disposed between butting edges of each butting pair of printhead chips. Each printhead chip has a grouting trench defined in the ink ejection surface, the grouting trench extending alongside at least one butting edge and the grouting trench being disposed between an endmost nozzle of each nozzle row and the butting edge.
Abstract:
A method of printing from an inkjet nozzle device having a thermal actuator. The method includes the steps of supplying a fluid to the inkjet nozzle device, the fluid comprising an acetylenic compound; and repeatedly actuating the thermal actuator so as to eject fluid droplets from a nozzle opening of the inkjet nozzle device. The acetylenic compound is present in an amount sufficient to increase the lifetime of the inkjet nozzle device.
Abstract:
An inkjet ink for improving printhead lifetimes includes: an aqueous-based ink vehicle; a colorant; an anti-kogation additive; and an anti-corrosion additive having at least one acetylenic group, the acetylenic group being absent any tertiary or quaternary α-carbon atoms.
Abstract:
A MEMS chip assembly includes: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, the MEMS chip having an active surface including one or more rows of MEMS devices and a row of bond pads disposed alongside a connection edge of the MEMS chip and parallel with the rows of MEMS devices; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has a plurality of trenches defined in the active surface, the trenches extending parallel with the rows of MEMS devices and disposed between the bond pads and the MEMS devices. The encapsulant material does not encroach past the trenches towards the MEMS devices.
Abstract:
An inkjet printhead includes: an elongate support having a printhead mounting surface; a plurality of butting printhead chips mounted on the printhead mounting surface, each printhead chip having an ink ejection surface including one or more nozzle rows; and a grout material disposed between butting edges of each butting pair of printhead chips. Each printhead chip has a grouting trench defined in the ink ejection surface, the grouting trench extending alongside at least one butting edge and the grouting trench being disposed between an endmost nozzle of each nozzle row and the butting edge.