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    MEMS CHIP ASSEMBLY HAVING MULTIPLE TRENCHES
    1.
    发明申请
    MEMS CHIP ASSEMBLY HAVING MULTIPLE TRENCHES 有权

    公开(公告)号：US20210061467A1

    公开(公告)日：2021-03-04

    申请号：US17096892

    申请日：2020-11-12

    Applicant: MEMJET TECHNOLOGY LIMITED

    Inventor： Elmer Dimaculangan Perez ,  Angus North ,  Graeme Lowe ,  See-Huat Tan ,  Christopher Barton

    IPC: B64C39/02 ,  G05D1/00

    Abstract: A MEMS chip assembly includes: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, the MEMS chip having an active surface including one or more rows of MEMS devices and a row of bond pads disposed alongside a connection edge of the MEMS chip and parallel with the rows of MEMS devices; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has a plurality of trenches defined in the active surface, the trenches extending parallel with the rows of MEMS devices and disposed between the bond pads and the MEMS devices. The encapsulant material does not encroach past the trenches towards the MEMS devices.

    Process for filling etched holes using first and second polymers
    3.
    发明授权
    Process for filling etched holes using first and second polymers 有权

    公开(公告)号：US10597290B2

    公开(公告)日：2020-03-24

    申请号：US16409687

    申请日：2019-05-10

    Applicant: Memjet Technology Limited

    Inventor： Angus North ,  Ronan O'Reilly ,  Gregory McAvoy

    IPC: B81C1/00 ,  B41J2/16

    Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole until the holes are overfilled with the first polymer; depositing a layer of a photoimageable second polymer different than the first polymer; selectively removing the second polymer from regions outside a periphery of the holes; exposing the wafer substrate to a controlled oxidative plasma so as to reveal the frontside surface of the wafer substrate; and planarizing the frontside surface to provide holes filled with a plug of the first polymer only, each plug having a respective upper surface coplanar with the frontside surface.

    INKJET NOZZLE DEVICE HAVING DUAL CHAMBER INLETS AND TWOFOLD SYMMETRY
    4.
    发明申请
    INKJET NOZZLE DEVICE HAVING DUAL CHAMBER INLETS AND TWOFOLD SYMMETRY 有权
    具有双室入口和双向对称的INKJET喷嘴装置

    公开(公告)号：US20150251421A1

    公开(公告)日：2015-09-10

    申请号：US14628186

    申请日：2015-02-20

    Applicant: MEMJET TECHNOLOGY LIMITED

    Inventor： Sam Mallinson ,  Philip Palma ,  David Secker ,  Paul Reichl ,  Glenn Horrocks ,  Angus North

    IPC: B41J2/14

    CPC classification number: B41J2/1412 ,  B41J2002/14467

    Abstract: An inkjet nozzle device includes: a nozzle chamber having a floor, a roof and perimeter sidewalls extending between the floor and the roof, wherein a nozzle aperture is defined in the roof; a heating element for generating gas bubbles in the nozzle chamber so as to eject ink through the nozzle aperture, wherein a centroid of the heating element is aligned with a centroid of the nozzle aperture; and a pair of chamber inlets defined in the floor of the nozzle chamber, the chamber inlets being symmetrically disposed about the centroid of the heating element. The inkjet nozzle device has a pair of orthogonal symmetry planes passing through the centroid of the nozzle aperture.

    Abstract translation: 喷墨喷嘴装置包括：喷嘴室，其具有在地板和屋顶之间延伸的地板，屋顶和周边侧壁，其中在屋顶中限定喷嘴孔; 用于在所述喷嘴室中产生气泡以便通过所述喷嘴孔喷射墨的加热元件，其中所述加热元件的质心与所述喷嘴孔的重心对准; 以及限定在喷嘴室的底板中的一对室入口，所述室入口围绕加热元件的重心对称地设置。 喷墨喷嘴装置具有穿过喷嘴孔的重心的一对正交对称平面。

    INKJET PRINTHEAD WITH ENCAPSULANT-RETAINING FEATURES
    6.
    发明申请
    INKJET PRINTHEAD WITH ENCAPSULANT-RETAINING FEATURES 审中-公开

    公开(公告)号：US20190337291A1

    公开(公告)日：2019-11-07

    申请号：US16400949

    申请日：2019-05-01

    Applicant: MEMJET TECHNOLOGY LIMITED

    Inventor： Elmer Dimaculangan Perez ,  Angus North ,  Graeme Lowe ,  See-Huat Tan ,  Christopher Barton

    IPC: B41J2/045 ,  B81B7/00 ,  B41J2/16

    Abstract: A MEMS chip assembly including: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, each MEMS chip having an active surface including one or more MEMS devices and a plurality of bond pads disposed alongside a connection edge of the MEMS chip; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has encapsulant-retaining trenches defined in the active surface extending alongside the connection edge, each encapsulant-retaining trench being disposed between the bond pads and the MEMS devices.

    PROCESS FOR FILLING ETCHED HOLES USING FIRST AND SECOND POLYMERS
    7.
    发明申请
    PROCESS FOR FILLING ETCHED HOLES USING FIRST AND SECOND POLYMERS 审中-公开

    公开(公告)号：US20190263657A1

    公开(公告)日：2019-08-29

    申请号：US16409687

    申请日：2019-05-10

    Applicant: Memjet Technology Limited

    Inventor： Angus North ,  Ronan O'Reilly ,  Gregory McAvoy

    IPC: B81C1/00 ,  B41J2/16

    Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole until the holes are overfilled with the first polymer; depositing a layer of a photoimageable second polymer different than the first polymer; selectively removing the second polymer from regions outside a periphery of the holes; exposing the wafer substrate to a controlled oxidative plasma so as to reveal the frontside surface of the wafer substrate; and planarizing the frontside surface to provide holes filled with a plug of the first polymer only, each plug having a respective upper surface coplanar with the frontside surface.

    PROCESS FOR HANDLING MEMS WAFERS
    9.
    发明申请
    PROCESS FOR HANDLING MEMS WAFERS 审中-公开

    公开(公告)号：US20200381284A1

    公开(公告)日：2020-12-03

    申请号：US16889734

    申请日：2020-06-01

    Applicant: MEMJET TECHNOLOGY LIMITED

    Inventor： Nicolas Arnal ,  Troy Pasiola Quimpo ,  Angus North

    IPC: H01L21/683

    Abstract: A process for handling MEMS wafers includes the steps of: (i) attaching a first carrier substrate to a first side of a MEMS wafer, the first carrier substrate being attached via a first wafer bonding tape and a silicone-free peel tape, the peel tape contacting the first side of the MEMS wafer; (ii) performing wafer processing steps on an opposite second side of the MEMS wafer; (iii) releasing the first carrier substrate from the first side of the MEMS wafer via exposure to an energy source, the energy source selectively releasing the wafer bonding tape from the first side of the MEMS wafer; and (iv) peeling the peel tape away from the first side of the MEMS wafer.

    INKJET PRINTHEAD WITH GROUT RETAINING FEATURES
    10.
    发明申请
    INKJET PRINTHEAD WITH GROUT RETAINING FEATURES 审中-公开

    公开(公告)号：US20190337292A1

    公开(公告)日：2019-11-07

    申请号：US16400958

    申请日：2019-05-01

    Applicant: MEMJET TECHNOLOGY LIMITED

    Inventor： Elmer Dimaculangan Perez ,  Angus North ,  Graeme Lowe ,  See-Huat Tan ,  Christopher Barton

    IPC: B41J2/145

    Abstract: An inkjet printhead includes: an elongate support having a printhead mounting surface; a plurality of butting printhead chips mounted on the printhead mounting surface, each printhead chip having an ink ejection surface including one or more nozzle rows; and a grout material disposed between butting edges of each butting pair of printhead chips. Each printhead chip has a grouting trench defined in the ink ejection surface, the grouting trench extending alongside at least one butting edge and the grouting trench being disposed between an endmost nozzle of each nozzle row and the butting edge.

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