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1.发明公开公开(公告)号：US20240251499A1
公开(公告)日：2024-07-25
申请号：US18158085
申请日：2023-01-23
Applicant: Meta Platforms Technologies, LLC
Inventor： Qiuming Li , Colden Niles Eldridge , Ming Lei , Yibo Liu , Md Rashidul Islam , Sung Hoon Oh
IPC: H05K1/02
CPC classification number: H05K1/0215 , H05K1/0237 , H05K1/0271 , H05K2201/10098 , H05K2201/10401 , H05K2201/10409
Abstract: A circuit package may comprise (1) a substrate, (2) at least one radio frequency (RF) circuit disposed on the substrate, and (3) a plurality of screw holes that are incorporated into the substrate and configured to support mounting the substrate to an enclosure, wherein at least one of the screw holes is further configured to provide at least one supplemental function in connection with the RF circuit. Various other apparatuses, systems, and methods are also disclosed.
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Patent Agency Ranking
公开(公告)号：US20240266731A1
公开(公告)日：2024-08-08
申请号：US18636892
申请日：2024-04-16
Applicant: Meta Platforms Technologies, LLC
Inventor： Sung Hoon Oh , Yonghua Wei , Md Rashidul Islam , Qian Qiao , Ulf Jan-Ove Mattsson , Geng Ye , Bruno Cendon Martin
Abstract: The disclosed system may include an enclosure that is configured to house internal electrical components disposed on a printed circuit board (PCB). The system may also include a first antenna feed that is electrically connected to the PCB, to the enclosure, and to a radiating coupling arm configured for wireless communication in a first wireless communication band. The system may further include a second antenna feed that is electrically connected to the PCB and to an antenna configured for wireless communication in a second, different wireless communication band. The system may also include a first grounding leg that forms an electrical ground between the PCB and the enclosure, and a second, switchable grounding leg positioned away from the first grounding leg. This switchable grounding leg may provide a controllable electrical ground between the PCB and the enclosure. Various other methods and apparatuses are also disclosed.
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公开(公告)号：US11990689B2
公开(公告)日：2024-05-21
申请号：US17550963
申请日：2021-12-14
Applicant: META PLATFORMS TECHNOLOGIES, LLC
Inventor： Sung Hoon Oh , Yonghua Wei , Md Rashidul Islam , Qian Qiao , Ulf Jan-Ove Mattsson , Geng Ye , Bruno Cendon Martin
Abstract: The disclosed system may include an enclosure that is configured to house internal electrical components disposed on a printed circuit board (PCB). The system may also include a first antenna feed that is electrically connected to the PCB, to the enclosure, and to a radiating coupling arm configured for wireless communication in a first wireless communication band. The system may further include a second antenna feed that is electrically connected to the PCB and to an antenna configured for wireless communication in a second, different wireless communication band. The system may also include a first grounding leg that forms an electrical ground between the PCB and the enclosure, and a second, switchable grounding leg positioned away from the first grounding leg. This switchable grounding leg may provide a controllable electrical ground between the PCB and the enclosure. Various other methods and apparatuses are also disclosed.
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公开(公告)号：US20220393352A1
公开(公告)日：2022-12-08
申请号：US17550963
申请日：2021-12-14
Applicant: META PLATFORMS TECHNOLOGIES, LLC
Inventor： Sung Hoon Oh , Yonghua Wei , Md Rashidul Islam , Qian Qiao , Ulf Jan-Ove Mattsson , Geng Ye , Bruno Cendon Martin
Abstract: The disclosed system may include an enclosure that is configured to house internal electrical components disposed on a printed circuit board (PCB). The system may also include a first antenna feed that is electrically connected to the PCB, to the enclosure, and to a radiating coupling arm configured for wireless communication in a first wireless communication band. The system may further include a second antenna feed that is electrically connected to the PCB and to an antenna configured for wireless communication in a second, different wireless communication band. The system may also include a first grounding leg that forms an electrical ground between the PCB and the enclosure, and a second, switchable grounding leg positioned away from the first grounding leg. This switchable grounding leg may provide a controllable electrical ground between the PCB and the enclosure. Various other methods and apparatuses are also disclosed.
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公开(公告)号：US12213241B2
公开(公告)日：2025-01-28
申请号：US18158085
申请日：2023-01-23
Applicant: Meta Platforms Technologies, LLC
Inventor： Qiuming Li , Colden Niles Eldridge , Ming Lei , Yibo Liu , Md Rashidul Islam , Sung Hoon Oh
IPC: H05K1/02
Abstract: A circuit package may comprise (1) a substrate, (2) at least one radio frequency (RF) circuit disposed on the substrate, and (3) a plurality of screw holes that are incorporated into the substrate and configured to support mounting the substrate to an enclosure, wherein at least one of the screw holes is further configured to provide at least one supplemental function in connection with the RF circuit. Various other apparatuses, systems, and methods are also disclosed.
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公开(公告)号：US20220407220A1
公开(公告)日：2022-12-22
申请号：US17550968
申请日：2021-12-14
Applicant: META PLATFORMS TECHNOLOGIES, LLC
Inventor： Md Rashidul Islam , Ulf Jan-Ove Mattsson , Yonghua Wei , Sung Hoon Oh , Qian Qiao , Geng Ye , Bruno Cendon Martin
Abstract: The disclosed system may include an enclosure that is configured to house a printed circuit board (PCB). The PCB may have various internal electrical components mounted thereto. The system may also include a radiating component mounted to an opposite side of the PCB. Still further, the system may include a unified grounding structure that couples the PCB to the enclosure in multiple locations. As such, the radiating component may be grounded to the unified grounding structure at the multiple different locations. Various other methods, systems, and computer-readable media are also disclosed, including methods of manufacturing mobile electronic devices.
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