公开(公告)号：US20100071942A1

公开(公告)日：2010-03-25

申请号：US12327950

申请日：2008-12-04

Applicant: MING-FENG LEE

Inventor： MING-FENG LEE

IPC: H05K1/18

CPC classification number: H05K1/0216 ,  H05K1/0243 ,  H05K2201/09318 ,  H05K2201/09972 ,  H05K2201/10083 ,  H05K2201/10371

Abstract: A circuit board includes an analog area and a digital area. The analog area includes an analog ground layer and an analog wiring layer formed on the analog ground layer. The digital area includes a digital ground layer and a digital wiring layer formed on the digital ground layer. The digital ground layer is connected with the analog ground layer to form a main ground layer. The digital wiring layer is separate from the analog wiring layer.

Abstract translation: 电路板包括模拟区域和数字区域。 模拟区域包括形成在模拟地层上的模拟接地层和模拟布线层。 数字区域包括形成在数字地层上的数字接地层和数字布线层。 数字接地层与模拟接地层连接形成主接地层。 数字布线层与模拟布线层分开。