公开(公告)号：US20150022227A1

公开(公告)日：2015-01-22

申请号：US14506146

申请日：2014-10-03

Applicant: MPI CORPORATION

Inventor： Chun-Chi WANG ,  Chia-Tai CHANG ,  Ya-Yun CHENG ,  Wei-Cheng KU ,  Chao-Ping HSIEH

IPC: G01R1/067 ,  G01R31/28 ,  G01R31/02

CPC classification number: G01R1/067 ,  G01R1/06772 ,  G01R31/02 ,  G01R31/2851 ,  G01R31/2889 ,  Y10T29/49218

Abstract: An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.

Abstract translation: 提供集成的高速探头系统。 集成高速探针系统包括用于将来自测试仪器的低频测试信号通过探针组件的第一探头传送到DUT的电路基板，以及用于将来自测试仪的高频测试信号传输到高速基板的高速基板 被测件。 高速基板从测试区域中的电路基板的上表面延伸到探针区域中的电路基板的下表面，用于邻近探针组件并电连接第二探针。 以这种方式，测试仪可以通过集成的高速探头系统传输不同频率的测试信号。