MULTILAYER CIRCUIT BOARD
    1.
    发明申请
    MULTILAYER CIRCUIT BOARD 有权
    多层电路板

    公开(公告)号:US20150014046A1

    公开(公告)日:2015-01-15

    申请号:US14332269

    申请日:2014-07-15

    CPC classification number: H05K1/116 H05K1/0298 H05K3/429 H05K2201/09845

    Abstract: A multilayer circuit board includes a plurality of stacked substrates, a plurality of first conductive lands, and a plurality of second conductive lands. A surface at a side of each of the substrates has an exposed portion which is not covered by the neighboring substrate, wherein each of the first conductive lands is respectively provided on each of the exposed portions. Each of the second conductive lands is provided on the exposed portion of the outermost substrate, wherein each of the substrates has a conductor pattern to be electrically connected to one of the first conductive lands and to one of the second conductive lands.

    Abstract translation: 多层电路板包括多个堆叠的衬底,多个第一导电焊盘和多个第二导电焊盘。 每个基板的一侧的表面具有未被相邻基板覆盖的暴露部分,其中每个第一导电焊盘分别设置在每个暴露部分上。 每个第二导电焊盘设置在最外基板的暴露部分上,其中每个基板具有导电图案,以将其电连接到第一导电焊盘之一和第二导电焊盘之一。

    INTEGRATED HIGH-SPEED PROBE SYSTEM
    2.
    发明申请
    INTEGRATED HIGH-SPEED PROBE SYSTEM 审中-公开
    集成高速探头系统

    公开(公告)号:US20150022227A1

    公开(公告)日:2015-01-22

    申请号:US14506146

    申请日:2014-10-03

    Abstract: An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.

    Abstract translation: 提供集成的高速探头系统。 集成高速探针系统包括用于将来自测试仪器的低频测试信号通过探针组件的第一探头传送到DUT的电路基板,以及用于将来自测试仪的高频测试信号传输到高速基板的高速基板 被测件。 高速基板从测试区域中的电路基板的上表面延伸到探针区域中的电路基板的下表面,用于邻近探针组件并电连接第二探针。 以这种方式,测试仪可以通过集成的高速探头系统传输不同频率的测试信号。

    PROBE CARD CAPABLE OF TRANSMITTING HIGH-FREQUENCY SIGNALS
    3.
    发明申请
    PROBE CARD CAPABLE OF TRANSMITTING HIGH-FREQUENCY SIGNALS 审中-公开
    可传送高频信号的探头卡

    公开(公告)号:US20170059613A1

    公开(公告)日:2017-03-02

    申请号:US15347581

    申请日:2016-11-09

    CPC classification number: G01R1/06772 G01R1/04

    Abstract: A probe card which is capable of transmitting high-frequency signals provided by a DUT, and the DUT includes an output pin group and an input pin group for sending and receiving the high-frequency signals respectively. The probe card includes a first signal pin group, a second signal pin group, and a band circuit. The first signal pin group is made of a conductive material, and is used to contact the output pin group; the second signal pin group is made of a conductive material too, and is used to contact the input pin group; the band circuit is electrically connected to the first signal pin group and the second signal pin group to allow signals within a first bandwidth and a second bandwidth to pass therethrough.

    Abstract translation: 能够发送由DUT提供的高频信号的探针卡,DUT包括分别发送和接收高频信号的输出引脚组和输入引脚组。 探针卡包括第一信号引脚组,第二信号引脚组和频带电路。 第一个信号引脚组由导电材料制成,用于接触输出引脚组; 第二信号引脚组也由导电材料制成,用于接触输入引脚组; 带电路电连接到第一信号引脚组和第二信号引脚组,以允许第一带宽和第二带宽内的信号通过。

    Probe card of low power loss
    4.
    发明申请
    Probe card of low power loss 有权
    低功耗探头卡

    公开(公告)号:US20140232421A1

    公开(公告)日:2014-08-21

    申请号:US14076379

    申请日:2013-11-11

    CPC classification number: G01R31/2889 G01R31/31721

    Abstract: A probe card, which is used to transmit power signals and test signals from a tester to a DUT, includes a pin base, a plurality of signal pins, a signal conducting circuit and at least one power conducting circuit. The signal pins are made of conductive materials, and each contacts the DUT with an end thereof; the signal conducting circuit has a first resistance, and electrically connects the tester and the other end of one of the signal pin to transmit the test signals to the DUT; the power conducting circuit has a second resistance which is much less than the first resistance, and electrically connects the tester and the other end of one of the signal pin which is not connected with the signal conducting circuit to transmit the power signals to the DUT.

    Abstract translation: 用于将功率信号和测试信号从测试仪传送到DUT的探针卡包括一个引脚基座,多个信号引脚,一个信号传导电路和至少一个功率传导电路。 信号引脚由导电材料制成,并且每个与其端部接触DUT; 所述信号导通电路具有第一电阻,并将所述测试器和所述信号引脚之一的另一端电连接以将所述测试信号传输到所述DUT; 电力导通电路具有比第一电阻小得多的第二电阻,并且将测试器与未与信号导通电路连接的信号引脚的另一端电连接以将功率信号传输到DUT。

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