公开(公告)号：US10101362B2

公开(公告)日：2018-10-16

申请号：US14553590

申请日：2014-11-25

Applicant: MPI CORPORATION

Inventor： Wei-Cheng Ku ,  Hao Wei ,  Yu-Hao Chen ,  Chih-Hao Ho

IPC: G01R1/067

Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.

公开(公告)号：US11346860B2

公开(公告)日：2022-05-31

申请号：US16990612

申请日：2020-08-11

Applicant: MPI CORPORATION

Inventor： Chin-Tien Yang ,  Hui-Pin Yang ,  Shang-Jung Hsieh ,  Tsung-Yi Chen ,  Yu-Hao Chen ,  Jhin-Ying Lyu

IPC: G01R1/067 ,  G01R1/073

Abstract: A probe head includes a probe seat having upper, middle and lower dies, an electrically conductive layer inside the probe seat, a first spring probe penetrating through the probe seat, and at least two shorter second spring probes penetrating through the lower die in a way that top ends of the second spring probes are located inside the probe seat and abutted against the electrically conductive layer. Another probe head includes the aforesaid probe seat, an electrically conductive layer partially inside the probe seat and partially outside the probe seat, a first spring probe penetrating through the probe seat, and a shorter second spring probe penetrating through the lower die in a way that a top end of the second spring probe is located inside the probe seat and abutted against the electrically conductive layer. As such, fine pitch requirement and different high frequency testing requirements are fulfilled.

公开(公告)号：US11774468B2

公开(公告)日：2023-10-03

申请号：US17858424

申请日：2022-07-06

Applicant: MPI CORPORATION

Inventor： Chin-Tien Yang ,  Yang-Hung Cheng ,  Yu-Hao Chen ,  Chin-Yi Tsai ,  Hui-Pin Yang ,  Horng-Chuan Sun

IPC: G01R1/073

CPC classification number: G01R1/07314 ,  G01R1/07357

Abstract: A vertical probe head includes upper and lower die units having upper and lower through holes, and probes each including a body portion between the die units, tail and head portion installation parts in the upper and lower through holes respectively, and a head portion contact part for electrically contacting a device under test. The probes include a pair of signal probes including at least one distinctive probe, for which, the body portion is smaller in width than the head portion installation part, and a body portion center line is deviated from a head portion installation part center line toward the probe paired thereto. For the paired probes, a head portion contact part pitch is larger than a body portion pitch for matching a large-pitch high-speed differential pair of the device under test, great impedance matching effect, and consistent contact force and stable elasticity of the probes in operation.

公开(公告)号：US10753960B2

公开(公告)日：2020-08-25

申请号：US16157911

申请日：2018-10-11

Applicant: MPI Corporation

Inventor： Hao Wei ,  Chia-Nan Chou ,  Chien-Chiao Chen ,  Chia-An Yu ,  Yu-Hao Chen

IPC: G01R1/073 ,  H05K1/18 ,  H05K1/11 ,  G01R1/067 ,  G01R31/28

Abstract: A probe card includes a printed circuit board (PCB), a connection substrate electrically connected with the PCB, a probe head, and a signal path switching module disposed on a lateral periphery surface or a bottom surface of the connection substrate, electrically connected with probe needles of the probe head and the connection substrate and including first and second circuit lines with first and second inductors respectively, and a capacitor electrically connected between the first and second circuit lines. A test signal from a tester is transmitted between the tester and a device under test (DUT) via the PCB, the connection substrate, the first and second circuit lines and the probe needles. A loopback test signal from the DUT is transmitted back to the DUT via the probe needles, parts of the first and second circuit lines and the capacitor.

公开(公告)号：US20240077519A1

公开(公告)日：2024-03-07

申请号：US18242586

申请日：2023-09-06

Applicant: MPI CORPORATION

Inventor： Yang-Hung Cheng ,  Yu-Hao Chen ,  Jhin-Ying Lyu ,  Hao Wei

IPC: G01R1/073 ,  G01R1/067 ,  G01R31/28

CPC classification number: G01R1/07342 ,  G01R1/06772 ,  G01R31/2886

Abstract: A probe card, a method for designing the probe card, a method for producing a tested semiconductor device, a method for testing an unpackaged semiconductor by the probe card, a device under test, and a probe system are provided. The probe card includes a wiring substrate, a connection carrier board, and a probe device. At least two probes form a differential pair electrically connected to a loopback line of the connection carrier board to form a test signal loopback path. The probe device has a probe device impedance on the test signal loopback path. The loopback line has a loopback line impedance on the test signal loopback path. A difference between the probe device impedance on the test signal loopback path and the loopback line impedance on the test signal loopback path is in an impedance range.