公开(公告)号：US20210133948A1

公开(公告)日：2021-05-06

申请号：US17079030

申请日：2020-10-23

Applicant: MPI Corporation

Inventor： Chien-Yu Chen ,  Han-Yu Chuang ,  Po-Han Peng

IPC: G06T7/00

Abstract: A wafer testing method adapted to test a thin wafer. The thin wafer is combined with a vacuum-release substrate to form a wafer-assembly, and the wafer-assembly is placed in a wafer cassette. The vacuum-release substrate is attached to a front surface of the wafer with an attaching force which is sensitive to air pressure. The method includes the following steps. First, taking out the wafer-assembly from the wafer cassette, then transferring the wafer-assembly to a warpage-detection-device and placing the wafer-assembly on a first stage of the warpage-detection-device. Then, detecting warpage of the wafer. If the warpage of the wafer is less than a warpage threshold, the wafer-assembly is taken out from the first stage, and the wafer-assembly is turned over to place the wafer-assembly on a second stage. Then, applying negative pressure to the vacuum-release substrate to eliminate the attaching force. Then, removing the vacuum-release substrate.

公开(公告)号：US11906571B2

公开(公告)日：2024-02-20

申请号：US17700441

申请日：2022-03-21

Applicant: MPI CORPORATION

Inventor： Chien-Yu Chen ,  Po-Han Peng

IPC: G01R31/26 ,  G02B5/00 ,  H01S5/02212 ,  H01S5/00

CPC classification number: G01R31/2635 ,  G02B5/005 ,  H01S5/0085 ,  H01S5/02212

Abstract: An optical detection system and a laser providing module without using an optical fiber thereof are provided. The optical detection system includes a carrier module, a laser light providing module, and an electrical detection module. The carrier module is configured to carry a plurality of photodiodes. The laser light providing module is disposed above the carrier module. The electrical detection module is adjacent to the carrier module. The laser light providing module is configured to convert a laser light source into a plurality of laser light beams, thereby simultaneously and respectively exciting two corresponding ones of the photodiodes. The electrical detection module is configured to simultaneously and electrically contact the corresponding photodiodes so as to obtain an electrical signal generated by each of the photodiodes.

公开(公告)号：US11348221B2

公开(公告)日：2022-05-31

申请号：US17079030

申请日：2020-10-23

Applicant: MPI Corporation

Inventor： Chien-Yu Chen ,  Han-Yu Chuang ,  Po-Han Peng

IPC: G01N21/95 ,  G06T7/00

Abstract: A wafer testing method adapted to test a thin wafer. The thin wafer is combined with a vacuum-release substrate to form a wafer-assembly, and the wafer-assembly is placed in a wafer cassette. The vacuum-release substrate is attached to a front surface of the wafer with an attaching force which is sensitive to air pressure. The method includes the following steps. First, taking out the wafer-assembly from the wafer cassette, then transferring the wafer-assembly to a warpage-detection-device and placing the wafer-assembly on a first stage of the warpage-detection-device. Then, detecting warpage of the wafer. If the warpage of the wafer is less than a warpage threshold, the wafer-assembly is taken out from the first stage, and the wafer-assembly is turned over to place the wafer-assembly on a second stage. Then, applying negative pressure to the vacuum-release substrate to eliminate the attaching force. Then, removing the vacuum-release substrate.