公开(公告)号：US4727456A

公开(公告)日：1988-02-23

申请号：US860246

申请日：1986-05-06

Applicant: Mahendra C. Mehta ,  Dirk J. Van Dalen

Inventor： Mahendra C. Mehta ,  Dirk J. Van Dalen

IPC: H05K3/30 ,  H05K3/34 ,  H05K7/10 ,  H05K7/04

CPC classification number: H05K7/1076 ,  H05K3/301 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10568 ,  Y02P70/613 ,  Y10S439/931

Abstract: A carrier for leadless electrical and electronic components has a plurality of recesses, for reception of components. Electrically conductive paths formed on surfaces in the recesses make contact with contacts on the components. The conductive paths extend onto a bottom surface of the carrier and over protrusions or feet on the bottom surface. The protrusions make contact with contact pads on a circuit pattern on a circuit board. The carrier holds components which otherwise could be as readily mounted to the surface of a circuit board as can the carrier. A high number of components per unit surface area of a circuit board can be mounted via the carrier. The carrier can be positioned by an automated apparatus.

Abstract translation: 用于无引线电气和电子部件的载体具有用于接收部件的多个凹部。 形成在凹部中的表面上的导电路径与部件上的触点接触。 导电路径延伸到载体的底表面和底表面上的突起或脚上。 突起与电路板上的电路图案上的接触焊盘接触。 载体保持其它可以如载体那样容易地安装到电路板的表面的部件。 电路板每单位表面积的大量部件可通过载体安装。 载体可以通过自动化装置定位。

公开(公告)号：US4814295A

公开(公告)日：1989-03-21

申请号：US935198

申请日：1986-11-26

Applicant: Mahendra C. Mehta

Inventor： Mahendra C. Mehta

IPC: H01L21/60 ,  H01L23/13 ,  H05K1/00 ,  H05K1/11 ,  H05K3/34 ,  H01L3/00

CPC classification number: H01L24/81 ,  H01L23/13 ,  H05K3/3442 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0284 ,  H05K1/119 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10568 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53174

Abstract: A semiconductor chip mounting is provided by molding a substrate of heat resistant synthetic resin, forming contact pads, which may be protrusions or recesses, on a surface of the substrate as it is molded. A circuit pattern extends to the contact pads which have a conductive surface. The chip is directly mounted on the substrate by soldering contact areas on the chip to the contact pads on the substrate, thus avoiding wire bonding.

Abstract translation: 通过模制耐热合成树脂的基板，在模制成型时在基板的表面上形成可以是突起或凹部的接触垫来提供半导体芯片安装。 电路图形延伸到具有导电表面的接触焊盘。 芯片通过将芯片上的接触区域焊接到基板上的接触焊盘上直接安装在基板上，从而避免引线接合。

公开(公告)号：US4769902A

公开(公告)日：1988-09-13

申请号：US59817

申请日：1987-06-09

Applicant: Mahendra C. Mehta ,  Wen J. Chen

Inventor： Mahendra C. Mehta ,  Wen J. Chen

IPC: H01H37/76 ,  H01H69/02

CPC classification number: H01H69/02 ,  H01H37/761 ,  Y10T29/49107 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: A thermal fuse is formed by a conductive path formed in a ceramic body, the path being of a fusible alloy. A ceramic substrate and a ceramic cover, both in green form, are fused together with defined channels. The channels can be defined by a material which is burnt out, preferably when the ceramic members are fused together. The channels can be defined in other ways. The channels are filled with a fusible alloy leaving an air layer, end contacts being provided. Several channels can be formed in one assembly. The assembly can then be cut into separate fuses, each with one channel.

Abstract translation: 热熔丝由形成在陶瓷体中的导电路径形成，该路径是可熔合金。 绿色形式的陶瓷衬底和陶瓷罩与限定的通道熔合在一起。 通道可以由烧制的材料限定，优选当陶瓷构件熔合在一起时。 通道可以以其他方式定义。 通道填充有可熔合金，留下空气层，提供端接触。 一个组件可以形成多个通道。 然后将组件切割成单独的保险丝，每个保险丝都有一个通道。

公开(公告)号：US4758459A

公开(公告)日：1988-07-19

申请号：US7640

申请日：1987-01-28

Applicant: Mahendra C. Mehta

Inventor： Mahendra C. Mehta

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  B32B3/10 ,  C04B35/00 ,  H01K3/22 ,  H05K7/10

CPC classification number: H05K3/366 ,  H05K1/119 ,  H05K1/183 ,  H05K3/326 ,  H05K1/0284 ,  H05K1/117 ,  H05K1/18 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09118 ,  H05K2201/09472 ,  H05K2201/1059 ,  H05K3/3442 ,  Y10S428/901 ,  Y10T29/49158 ,  Y10T428/24273 ,  Y10T428/24917

Abstract: A circuit board is molded of a heat resistant synthetic resin. Component mounting positions are formed at the time of molding, the mounting positions comprising formations, such as recesses or protrusions, on at least one surface. A circuit pattern is formed on at least one surface and the circuit pattern extends to and over a surface of each formation. A circuit board can be planar or non-planar and be of any desired shape, not necessarily rectangular.

Abstract translation: 电路板由耐热合成树脂模制而成。 在成型时形成组件安装位置，在至少一个表面上的安装位置包括诸如凹槽或突起的地层。 电路图案形成在至少一个表面上，并且电路图案延伸到每个结构的表面上和上方。 电路板可以是平面的或非平面的，并且具有任何期望的形状，不一定是矩形的。