公开(公告)号：US20060022304A1

公开(公告)日：2006-02-02

申请号：US11191486

申请日：2005-07-28

Applicant: Maria Rzeznik

Inventor： Maria Rzeznik

IPC: H01L29/00 ,  H01L21/20

CPC classification number: H01G4/08 ,  H01G4/12 ,  H01G4/20 ,  H01L21/3115 ,  H01L28/82 ,  H05K1/162 ,  H05K3/181 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/09509

Abstract: Dielectric structures particularly suitable for use in capacitors having a layer of a dielectric material including a dopant that provides a positive topography are disclosed. Methods of forming such dielectric structures are also disclosed. Such dielectric structures show increased adhesion of subsequently applied conductive layers.

Abstract translation: 公开了特别适用于具有包括提供正形貌的掺杂剂的介电材料层的电容器中的电介质结构。 还公开了形成这种电介质结构的方法。 这种介电结构显示随后施加的导电层的附着力增加。

公开(公告)号：US20060079050A1

公开(公告)日：2006-04-13

申请号：US11243890

申请日：2005-10-05

Applicant: John Cahalen ,  Maria Rzeznik ,  John Schemenaur ,  Rajan Hariharan

Inventor： John Cahalen ,  Maria Rzeznik ,  John Schemenaur ,  Rajan Hariharan

IPC: H01L21/8242

CPC classification number: H05K1/162 ,  H01G4/005 ,  H01L28/75 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2203/0723

Abstract: Structures including a capacitor dielectric material disposed on the surface of an electrode suitable for use in forming capacitors are disclosed. Methods of forming such structures are also disclosed.

Abstract translation: 公开了包括设置在适合用于形成电容器的电极的表面上的电容器电介质材料的结构。 还公开了形成这种结构的方法。