Infrared Sensor Package
    1.
    发明申请
    Infrared Sensor Package 有权
    红外传感器封装

    公开(公告)号:US20150308899A1

    公开(公告)日:2015-10-29

    申请号:US14699112

    申请日:2015-04-29

    Abstract: The present invention relates to an integrated infrared sensor device, comprising a sensor substrate and a filter substrate. The sensor substrate has a back surface and a front surface opposite the back surface, in which the back surface has a cavity defined therein and the front surface has at least one infrared sensing element formed therein or arranged thereon, covered with a cap for protecting the at least one sensing element, e.g. against mechanical damage and dust, and/or against stray radiation. The filter substrate is arranged on the back surface of the sensor substrate such that the filter substrate at least partially covers the cavity. The filter substrate is adapted in shape and composition to transmit infrared radiation and to attenuate radiation in at least part of the visible light spectrum.

    Abstract translation: 本发明涉及一种集成红外线传感器装置,其包括传感器基板和滤波器基板。 传感器基板具有后表面和与背面相对的前表面,其中后表面具有限定在其中的空腔,并且前表面具有形成在其中或布置在其中的至少一个红外感测元件,覆盖有用于保护 至少一个感测元件,例如 防止机械损伤和灰尘,和/或抵抗杂散辐射。 过滤器基板布置在传感器基板的后表面上,使得过滤器基板至少部分地覆盖空腔。 过滤器基板适于透射红外辐射的形状和组成,并在至少部分可见光光谱中衰减辐射。

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