POWER MODULE WITH STACKED STRUCTURE

    公开(公告)号:US20250096210A1

    公开(公告)日:2025-03-20

    申请号:US18661267

    申请日:2024-05-10

    Abstract: A power module has an inductor assembly and a device substrate. The inductor assembly comprises a magnetic core, a first winding and a second winding. Each of the first winding and the second winding has a first end and a second end exposed at the second surface of the inductor assembly. The device substrate has a first power device chip and a second power device chip at least partially embedded within the device substrate. The device substrate further has a first top heat layer at least partially covering the first power device chip and a second top heat layer at least partially covering the second power device chip. The first end of the first winding is electrically connected to the first top heat layer, and the first end of the second winding is electrically connected to the second top heat layer.

    Voltage regulation at load transients

    公开(公告)号:US12040711B2

    公开(公告)日:2024-07-16

    申请号:US17737755

    申请日:2022-05-05

    CPC classification number: H02M3/158 H02M1/0009

    Abstract: A multiphase converter provides an output voltage to a load. The multiphase converter receives a load event signal from the load and turns ON at a same time the phases of the multiphase converter to increase the output voltage in response to the load event signal indicating that a load current drawn by the load from the multiphase converter is about to increase. The multiphase converter increases an impedance of low-side switches of the multiphase converter in response to the load event signal indicating that the load current is about to decrease.

    POWER MODULE WITH METALLIC HEAT SPREADER
    3.
    发明公开

    公开(公告)号:US20240145334A1

    公开(公告)日:2024-05-02

    申请号:US18408958

    申请日:2024-01-10

    CPC classification number: H01L23/3675 H05K7/209 H01L25/16

    Abstract: A power module has a substrate, a magnetic component disposed on the substrate, a plurality of power integrated circuits (ICs), and a heat spreader. The heat spreader and at least a part of the plurality of power ICs are disposed on a top surface of the substrate. The heat spreader is fixed on the substrate through a structural adhesive, covering top surfaces of the part of the plurality of power ICs on the top surface of the substrate, and is in contact with the top surfaces of the part of the plurality of power ICs on the top surface of the substrate through a thermal conductive adhesive. A difference between a height measured from a topmost surface of the magnetic component to the top surface of the substrate and a height measured from a topmost surface of the heat spreader to the top surface of the substrate is within 300 um.

    VOLTAGE REGULATOR WITH NONLINEAR ADAPTIVE VOLTAGE POSITION AND CONTROL METHOD THEREOF

    公开(公告)号:US20190305674A1

    公开(公告)日:2019-10-03

    申请号:US16367179

    申请日:2019-03-27

    Abstract: A voltage regulator has a switching circuit and a control circuit. The switching circuit provides an output voltage and an output current. The control circuit provides a switching control signal to the switching circuit to adjust the output voltage, such that the output voltage decreases with a first slope as the output current increases when the output current is less than a predetermined current, the output voltage decreases with a second slope as the output current increases when the output current is larger than the predetermined current.

    INDUCTOR ASSEMBLY AND POWER MODULE USING THE SAME

    公开(公告)号:US20250095902A1

    公开(公告)日:2025-03-20

    申请号:US18469847

    申请日:2023-09-19

    Abstract: A power module having a bottom substrate, a device substrate arranged on the bottom substrate and an inductor assembly arranged on the device substrate. The inductor assembly has a first winding, a second winding, a first magnetic core part and a second magnetic core part. The first magnetic core part has a first portion disposed on a first horizontal level and a second portion disposed on a second horizontal level. The second magnetic core part has a first portion disposed on the second horizontal level and a second portion disposed on the first horizontal level. The first and second magnetic core parts are assembled to accommodate the first winding between the first portions of the first and second magnetic core part, and to accommodate the second winding between the second portions of the first and second magnetic core part.

    Resonant converter with multiple resonant tank circuits

    公开(公告)号:US12088195B2

    公开(公告)日:2024-09-10

    申请号:US18502971

    申请日:2023-11-06

    Abstract: A resonant converter has a primary resonant tank circuit and a secondary resonant tank circuit. An inverter circuit converts an input DC voltage received by the resonant converter at an input voltage node to a pulsating signal that is fed to the primary resonant tank circuit to generate a resonant tank current that flows through a primary winding of a transformer. The resonant tank current induces current in a secondary winding of the transformer. The induced current is rectified by a rectifier and the rectified signal is filtered to generate an output DC voltage at an output voltage node. The secondary resonant tank circuit is disposed between the secondary winding of the transformer and the output voltage node, and a tank node of the secondary resonant tank is connected to the primary resonant tank circuit through the inverter circuit.

    SANDWICH STRUCTURE POWER SUPPLY MODULE

    公开(公告)号:US20220295639A1

    公开(公告)日:2022-09-15

    申请号:US17589277

    申请日:2022-01-31

    Abstract: A sandwich structure power supply module, having: an inductor pack having at least one inductor; a top PCB (Printed Circuit Board) on top of the inductor pack; and at least one power device chip on top of the top PCB, wherein each one of the power device chips has at least one pin connected to an associated inductor via the top PCB; wherein the inductor pack is wrapped with metal layers, wherein each two metal layers are lied against to a same surface of the inductor pack, with an isolation layer in between, and wherein the two metal layers are connected to different potentials.

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