公开(公告)号：US11122674B1

公开(公告)日：2021-09-14

申请号：US16946711

申请日：2020-07-01

Applicant: Multek Technologies Limited

Inventor： Pui Yin Yu ,  Xin Hua Zeng ,  Jian Ying Xue ,  Hong Tu Zhang

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/24

Abstract: A printed circuit board includes a first, second, and third conductive layer. The printed circuit boards also includes a first non-conductive layer between the first and second conductive layers and a second non-conductive layer between the second and third conductive layers. The printed circuit board further includes a dielectric layer between the second conductive layer and the second non-conductive layer and a coin for heat dispersion located underneath the dielectric layer. The printed circuit board also includes a cavity for receiving a component and a plating within the cavity to connect the coin with the second conductive layer. The plating extends less than 50 um above the second conductive layer.