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公开(公告)号：US11317521B2
公开(公告)日：2022-04-26
申请号：US16946712
申请日：2020-07-01
Applicant: Multek Technologies Limited
Inventor： Pui Yin Yu , Hong Tu Zhang , Xin Hua Zeng
Abstract: A printed circuit board includes a first and second core. The first core has a first conductive layer, a first non-conductive layer, a first copper layer and a first opening. The first core also has a first solder mask connected to the first copper layer and a first FR4 laminate bonded to the first solder mask. The second core has a second conductive layer, a second non-conductive layer, a second copper layer and a second opening. The second core also has a second solder mask connected to the second copper layer and a second FR4 laminate bonded to the second solder mask. A prepreg layer is between the first copper layer and the second copper layer but not between the first FR4 laminate and the second FR4 laminate.
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公开(公告)号：US20210385952A1
公开(公告)日：2021-12-09
申请号：US16946712
申请日：2020-07-01
Applicant: Multek Technologies Limited
Inventor： Pui Yin Yu , Hong Tu Zhang , Xin Hua Zeng
Abstract: A printed circuit board includes a first and second core. The first core has a first conductive layer, a first non-conductive layer, a first copper layer and a first opening. The first core also has a first solder mask connected to the first copper layer and a first FR4 laminate bonded to the first solder mask. The second core has a second conductive layer, a second non-conductive layer, a second copper layer and a second opening. The second core also has a second solder mask connected to the second copper layer and a second FR4 laminate bonded to the second solder mask. A prepreg layer is between the first copper layer and the second copper layer but not between the first FR4 laminate and the second FR4 laminate.
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公开(公告)号：US11122674B1
公开(公告)日：2021-09-14
申请号：US16946711
申请日：2020-07-01
Applicant: Multek Technologies Limited
Inventor： Pui Yin Yu , Xin Hua Zeng , Jian Ying Xue , Hong Tu Zhang
Abstract: A printed circuit board includes a first, second, and third conductive layer. The printed circuit boards also includes a first non-conductive layer between the first and second conductive layers and a second non-conductive layer between the second and third conductive layers. The printed circuit board further includes a dielectric layer between the second conductive layer and the second non-conductive layer and a coin for heat dispersion located underneath the dielectric layer. The printed circuit board also includes a cavity for receiving a component and a plating within the cavity to connect the coin with the second conductive layer. The plating extends less than 50 um above the second conductive layer.
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