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    Electronic device
    1.
    发明授权
    Electronic device 有权

    公开(公告)号：US11380474B2

    公开(公告)日：2022-07-05

    申请号：US16205265

    申请日：2018-11-30

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Bunta Okamoto ,  Kuniaki Yosui

    IPC: H05K1/16 ,  H01F27/28 ,  H05K3/46 ,  H05K1/02 ,  H01F17/00 ,  H01F27/32 ,  H05K1/11 ,  H05K1/14

    Abstract: An electronic device includes an inductor bridge that connects first and second circuits. The inductor bridge includes an insulating base material and a conical coil in the insulating base material. The conical coil includes loop shaped conductors arranged in a winding axis direction. Inner and outer diameters of the loop shaped conductors change is one way in the winding axis direction. A large-diameter loop shaped conductor, which is one of the loop shaped conductors that has the largest inner and outer diameters, is disposed such that the inner and outer diameters thereof relatively extend along the insulating base material compared with the other loop shaped conductors when the inductor bridge is bent.

    Inductor bridge and electronic device
    3.
    发明授权
    Inductor bridge and electronic device 有权

    公开(公告)号：US11439005B2

    公开(公告)日：2022-09-06

    申请号：US16217096

    申请日：2018-12-12

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Isamu Morita ,  Bunta Okamoto

    IPC: H01F27/29 ,  H05K1/11 ,  H05K1/02 ,  H01F17/00 ,  H01F27/28 ,  H05K1/09 ,  H05K1/14 ,  H05K1/16

    Abstract: An inductor bridge includes an inductor in a flexible, flat plate-shaped element body including resin bases that are laminated, and a wiring unit connected in series to the inductor. The inductor includes wound conductor patterns, each with a winding axis in a laminating direction of the resin bases and respectively provided on each of the resin bases, and an interlayer connection conductor interlayer-connecting the wound conductor patterns. The wiring unit includes a wiring pattern at a layer between a first surface of the wound conductor pattern and a layer farthest from the first surface and interlayer connection conductors conducted to the wiring pattern.

    Crystal vibrating device and method for producing the same
    4.
    发明授权
    Crystal vibrating device and method for producing the same 有权

    公开(公告)号：US10097157B2

    公开(公告)日：2018-10-09

    申请号：US14920419

    申请日：2015-10-22

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Bunta Okamoto ,  Motoyoshi Sakai

    IPC: H01L41/053 ,  H03H9/10 ,  H03H9/05 ,  H03H3/02 ,  H03H9/17

    Abstract: A crystal vibrating device that includes a crystal resonator mounted on a substrate by a first conductive adhesive layer and a second conductive adhesive layer, and, when the first conductive adhesive layer and the second conductive adhesive layer are viewed in a plan view, the first conductive adhesive layer and the second conductive adhesive layer each have a) a planar shape in which two circles or ellipses are partly superimposed upon each other, b) two conductive adhesive layer portions that are separated from each other, or c) a length direction and an aspect ratio, which is a ratio between a maximum size in the length direction and a maximum size in a width direction that is orthogonal to the maximum size in the length direction, is in a range of 1.5 to 3.0.

    High-frequency signal transmission line and electronic device
    10.
    发明授权
    High-frequency signal transmission line and electronic device 有权
    高频信号传输线和电子设备

    公开(公告)号：US09019048B1

    公开(公告)日：2015-04-28

    申请号：US14587097

    申请日：2014-12-31

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kuniaki Yosui ,  Yuki Wakabayashi ,  Bunta Okamoto

    IPC: H03H7/38 ,  H01P3/08

    CPC classification number: H01P3/08 ,  H01P1/20363 ,  H01P3/081 ,  H01P3/085 ,  H01P5/028 ,  H03H7/38 ,  H05K1/0225 ,  H05K1/0253 ,  H05K2201/09272 ,  H05K2201/09618 ,  H05K2201/09727

    Abstract: A high-frequency signal transmission line includes a plate-shaped dielectric element assembly, a linear signal line, and a first ground conductor. The linear signal line is provided at the dielectric element assembly and includes a plurality of thick portions and a plurality of thin portions with a smaller width than the thick portions. The first ground conductor is provided at the dielectric element assembly and positioned on one side in a normal direction to the dielectric element assembly relative to the signal line. The first ground conductor includes a plurality of openings overlapping with the signal line and also includes bridge portions provided between the openings so as to cross the thin portions. The bridge portions cross the thin portion obliquely when viewed in a plan view in the normal direction to the dielectric element assembly.

    Abstract translation: 高频信号传输线包括板状电介质元件组件，线性信号线和第一接地导体。 线性信号线设置在电介质元件组件处，并且包括多个厚部分和多个具有比厚部分更小的宽度的薄部分。 第一接地导体设置在电介质元件组件处并且相对于信号线位于电介质元件组件的法向方向的一侧。 第一接地导体包括与信号线重叠的多个开口，并且还包括设置在开口之间以跨越薄部分的桥接部分。 当在与电介质元件组件的法线方向的平面图中观察时，桥接部分倾斜地交叉。

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