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公开(公告)号：US20210243887A1
公开(公告)日：2021-08-05
申请号：US17237594
申请日：2021-04-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hideki SHINKAI
IPC: H05K1/02 , H01L23/552 , H05K3/28 , H01L21/56
Abstract: An electronic component module includes a board, an electronic component, a sealing portion, a metal layer, and a magnetic layer. The board has a first main surface. The electronic component is provided on a first main surface of the board. The sealing portion seals the electronic component. The metal layer covers the sealing portion. The magnetic layer is provided between the sealing portion and the metal layer. The magnetic layer has a magnetic main body and a first cover sheet. The first cover sheet is provided between the magnetic main body and the metal layer. The first cover sheet has a first main surface and a second main surface. The first main surface faces the magnetic main body. The second main surface faces the metal layer. The second outer peripheral end of the second main surface is located inside the first outer peripheral end of the first main surface.
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公开(公告)号：US20170250061A1
公开(公告)日：2017-08-31
申请号：US15427721
申请日：2017-02-08
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Issei YAMAMOTO , Atsushi SHIMIZU , Yoichi TAKAGI , Hideo NAKAGOSHI , Toru KOMATSU , Hideki SHINKAI , Tetsuya ODA
Abstract: A vacuum device includes a processing target placement unit that is arranged inside a vacuum chamber and a vacuum evacuation unit that is connected to the vacuum chamber. The processing target placement unit has one main surface on which processing targets are placed and a side surface that is connected to the one main surface. The processing target placement unit is provided with a plurality of grooves that have openings at the one main surface. When the processing target placement unit is viewed from the one main surface side thereof, the smallest width of the opening of each groove in the one main surface is equal to or less than half the smallest width of the processing target.
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公开(公告)号：US20240276691A1
公开(公告)日：2024-08-15
申请号：US18643036
申请日：2024-04-23
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Akio KATSUBE , Hideki SHINKAI
IPC: H05K9/00
CPC classification number: H05K9/0084 , H05K9/0015
Abstract: A module includes a substrate, a first component, a sealing resin, and a shield film. The substrate is provided with a first surface. The first component is mounted on the first surface. The first component is sealed with the sealing resin at least from a lateral side. The first component is provided with an exposed surface. The exposed surface is exposed through the sealing resin on a side opposite to the substrate. The shield film is made of metal and covers the first component and the sealing resin. The shield film is provided with a first contact portion. The first contact portion is in contact with the exposed surface. The first contact portion includes a layer formed from a plurality of crystal grains. The plurality of crystal grains are different in longitudinal direction from one another when they are viewed from a direction orthogonal to the first surface.
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Patent Agency Ranking
公开(公告)号：US20210225779A1
公开(公告)日：2021-07-22
申请号：US17205052
申请日：2021-03-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoshihito OTSUBO , Hideki SHINKAI
IPC: H01L23/552 , H01L25/065 , H01L25/18 , H01L21/56
Abstract: A module (101) is provided with a substrate including a principal surface (1u), a plurality of electronic components (41, 42, and 43) arranged on the principal surface (1u), a sealing resin (3) covering the principal surface (1u), a ground electrode arranged on the principal surface (1u), a conductive layer (6) covering the sealing resin (3), and a magnetic member (5). The conductive layer (6) is electrically connected to the ground electrode by a plurality of connecting conductors (62) arranged so as to penetrate the sealing resin (3), and the magnetic member (5) includes a magnetic member plate-shaped portion arranged so as to cover the sealing resin (3) and a magnetic member wall-shaped portion (52) arranged in a wall shape in the sealing resin (3). The magnetic member wall-shaped portion (52) is longer than each of the connecting conductors (62).
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公开(公告)号：US20200258797A1
公开(公告)日：2020-08-13
申请号：US16864444
申请日：2020-05-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tadashi NOMURA , Tetsuya ODA , Hideki SHINKAI , Toru KOIDESAWA
IPC: H01L23/28 , H01L23/538 , H05K3/28 , H05K3/36
Abstract: A circuit module (100) includes: a substrate (10) including a plurality of inner conductors (2); a first electronic component arranged on one main surface (S1) of the substrate (10); a first resin layer (40) provided on the one main surface (S1) and configured to seal the first electronic component; a plurality of outer electrodes (B1) provided on another main surface (S2) of the substrate (10) and including a ground electrode; a conductor film (50) provided at least on an outer surface of the first resin layer (40) and a side surface (S3) of the substrate (10) and connected to the ground electrode with at least one of the plurality of inner conductors (2) interposed therebetween; and a resin film (60).
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公开(公告)号：US20240266240A1
公开(公告)日：2024-08-08
申请号：US18640076
申请日：2024-04-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Akio KATSUBE , Hideki SHINKAI
IPC: H01L23/31 , H01L21/56 , H01L23/00 , H01L23/544 , H01L23/552 , H01L25/065 , H01L25/16 , H03H3/02 , H03H3/08 , H03H9/02 , H03H9/05 , H03H9/08 , H03H9/10
CPC classification number: H01L23/3185 , H01L21/561 , H01L23/552 , H03H3/02 , H03H3/08 , H03H9/02086 , H03H9/02913 , H03H9/0523 , H03H9/0542 , H03H9/059 , H03H9/08 , H03H9/1042 , H03H9/1085 , H01L23/544 , H01L24/16 , H01L25/0655 , H01L25/16 , H01L2223/54486 , H01L2224/16227
Abstract: A module includes a substrate, a first component, and a sealing resin. The substrate is provided with a first surface. The first component is mounted on the first surface. The first component is sealed with the sealing resin at least from a lateral side. The first component includes a projecting portion. The projecting portion projects from the sealing resin on a side opposite to a side of the substrate.
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公开(公告)号：US20220102255A1
公开(公告)日：2022-03-31
申请号：US17643672
申请日：2021-12-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hideki SHINKAI , Akio KATSUBE
IPC: H01L23/498 , H01L25/16 , H01L23/31 , H01L23/66
Abstract: An electronic component module includes a substrate, a connector, an electronic component, a conductor wall, an insulating resin, and a conductive shield film. The connector and the electronic component are mounted on a first main surface of the substrate. The conductor wall has a cylindrical shape, is mounted on the first main surface of the substrate, and includes an interior space in which the connector is disposed. The insulating resin is provided on the first main surface. The conductive shield film is provided on a surface of the insulating resin. The insulating resin covers the electronic component and is disposed outside the conductor wall except the interior space of the conductor wall.
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公开(公告)号：US20200260581A1
公开(公告)日：2020-08-13
申请号：US16860131
申请日：2020-04-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tadashi NOMURA , Masahiro INOUE , Tetsuya ODA , Hideki SHINKAI , Toru KOIDESAWA
Abstract: A circuit module (100) includes a substrate (10) having a plurality of internal conductors (2), a first electronic component disposed on one principal surface (S1) of the substrate (10), a first resin layer (40) provided on the one principal surface (S1) and sealing the first electronic component, a plurality of outer electrodes (B1) provided on the other principal surface (S2) of the substrate (10) and including a ground electrode, a conductor film (50) at least provided on an outer surface of the first resin layer (40) and a side surface (S3) of the substrate (10) and connected to the ground electrode via at least one of the plurality of internal conductors (2), and a resin film (60).
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