公开(公告)号：US20200258797A1

公开(公告)日：2020-08-13

申请号：US16864444

申请日：2020-05-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi NOMURA ,  Tetsuya ODA ,  Hideki SHINKAI ,  Toru KOIDESAWA

IPC: H01L23/28 ,  H01L23/538 ,  H05K3/28 ,  H05K3/36

Abstract: A circuit module (100) includes: a substrate (10) including a plurality of inner conductors (2); a first electronic component arranged on one main surface (S1) of the substrate (10); a first resin layer (40) provided on the one main surface (S1) and configured to seal the first electronic component; a plurality of outer electrodes (B1) provided on another main surface (S2) of the substrate (10) and including a ground electrode; a conductor film (50) provided at least on an outer surface of the first resin layer (40) and a side surface (S3) of the substrate (10) and connected to the ground electrode with at least one of the plurality of inner conductors (2) interposed therebetween; and a resin film (60).

公开(公告)号：US20210210438A1

公开(公告)日：2021-07-08

申请号：US17210630

申请日：2021-03-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi NOMURA ,  Shin FURUYA ,  Toru KOIDESAWA ,  Motohiko KUSUNOKI ,  Tetsuya ODA

IPC: H01L23/552 ,  H01L23/29 ,  H05K9/00 ,  H05K1/18 ,  H05K3/28 ,  H01L21/56

Abstract: A module includes: a substrate having a main surface and a side surface; an electronic component mounted on the main surface; a sealing resin that covers the main surface and the electronic component; and a shield film that covers a surface of the sealing resin and the side surface of the substrate. The sealing resin includes: a resin component containing an organic resin as a main component; and a granular filler containing an inorganic oxide as a main component. On a surface of the sealing resin, which is in contact with the shield film, parts of some grains of the filler are exposed from the resin component, a surface of the resin component includes a nitrogen functional group, and the shield film is formed of a metal that is a passivation metal and a transition metal or an alloy containing the metal.

公开(公告)号：US20200260581A1

公开(公告)日：2020-08-13

申请号：US16860131

申请日：2020-04-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi NOMURA ,  Masahiro INOUE ,  Tetsuya ODA ,  Hideki SHINKAI ,  Toru KOIDESAWA

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/18

Abstract: A circuit module (100) includes a substrate (10) having a plurality of internal conductors (2), a first electronic component disposed on one principal surface (S1) of the substrate (10), a first resin layer (40) provided on the one principal surface (S1) and sealing the first electronic component, a plurality of outer electrodes (B1) provided on the other principal surface (S2) of the substrate (10) and including a ground electrode, a conductor film (50) at least provided on an outer surface of the first resin layer (40) and a side surface (S3) of the substrate (10) and connected to the ground electrode via at least one of the plurality of internal conductors (2), and a resin film (60).