SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
    1.
    发明公开

    公开(公告)号:US20230307303A1

    公开(公告)日:2023-09-28

    申请号:US18205583

    申请日:2023-06-05

    Abstract: A semiconductor device includes a detector assembly mounted on a base substrate and including a detector to detect pressure, a resin package on the base substrate, and a tube supported by the resin package. The resin package includes a base portion on the base substrate and in which the detector assembly is embedded, and a projecting portion including an exposed hole that exposes the detector and projects from the base portion into the tube. The tube includes a tubular body portion and a lower flange portion supported by the base portion. The lower flange portion is inside an outer edge portion of the base portion in plan view. An outer side surface of the projecting portion is bonded to an inner circumferential surface of the tube.

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