公开(公告)号：US20140110161A1

公开(公告)日：2014-04-24

申请号：US14050842

申请日：2013-10-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO ,  Norio SHIROIWA

IPC: H05K1/02 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3415 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10545 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913

Abstract: A method of manufacturing a mounting substrate in which a pair of monolithic ceramic capacitors each of which includes a multilayer body in which a plurality of dielectric ceramic sheets and a plurality of substantially planar inner electrodes are stacked on top of one another and at least a pair of outer electrodes electrically connected to the inner electrodes and provided on a surface of the multilayer body are mounted on a circuit board includes a process of joining the outer electrodes to lands formed on the front rear surfaces of the circuit board, the lands formed on the front surface being formed at positions that are plane-symmetrical to positions of the corresponding lands formed on the rear surface while being electrically connected to the corresponding lands formed on the rear surface, such that surface directions of planes of the inner electrodes match each other.

Abstract translation: 一种制造安装基板的方法，其中，一对叠层陶瓷电容器包括多层体，其中多个介电陶瓷片和多个基本上平面的内电极彼此堆叠并且至少一对 电连接到内部电极并设置在多层体的表面上的外部电极安装在电路板上，包括将外部电极连接到形成在电路板的前后表面上的平台， 前表面形成在与形成在后表面上的相应焊盘的位置平面对称的位置处，同时电连接到形成在后表面上的相应焊盘，使得内电极的平面的表面方向彼此匹配。