公开(公告)号：US20210267051A1

公开(公告)日：2021-08-26

申请号：US17319396

申请日：2021-05-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke KAMITSUBO ,  Ryosuke TAKADA ,  Tsuyoshi KATSUBE ,  Yasuhiro KURATANI ,  Shigeru TAGO ,  Tomohiro FURUMURA

IPC: H05K1/03 ,  H05K1/14 ,  H05K1/11 ,  H05K3/42 ,  H05K3/00 ,  H05K3/46

Abstract: A resin multilayer substrate includes a multilayer body including resin layers and adhesive layers that are laminated, via conductors in the resin layers, and bonding portions in the adhesive layers. The bonding portion is connected to the via conductor. One of the resin layer and the adhesive layer is a gas high-permeable layer having a higher gas permeability than the other one. The bonding portion includes an organic substance, or has a higher void content rate per unit plane sectional area than the via conductor. At least a portion of each of the bonding portions contacts the gas high-permeable layers.

公开(公告)号：US20210212203A1

公开(公告)日：2021-07-08

申请号：US17206303

申请日：2021-03-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke KAMITSUBO ,  Tsuyoshi KATSUBE ,  Ryosuke TAKADA

IPC: H05K1/03 ,  H05K3/46

Abstract: A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.

公开(公告)号：US20200091104A1

公开(公告)日：2020-03-19

申请号：US16694053

申请日：2019-11-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryosuke TAKADA ,  Toshitaka HAYASHI ,  Hiromasa KOYAMA

IPC: H01L23/00 ,  H05K1/11 ,  H05K1/02

Abstract: A multilayer wiring board includes a first insulating layer, a second insulating layer stacked on the first insulating layer, a via conductor inside each of the first insulating layer and the second insulating layer, and a conductive bonding layer that bonds the via conductors to each other. The first insulating layer is directly bonded to the second insulating layer, and a relationship a1>b1 is satisfied, where a1 is a maximum diameter of the bonding layer and b1 is a maximum diameter of the via conductor at an interface with the bonding layer.

公开(公告)号：US20190269010A1

公开(公告)日：2019-08-29

申请号：US16412489

申请日：2019-05-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinichi ARAKI ,  Hideyuki TAGUCHI ,  Hayato NOMA ,  Ryosuke TAKADA

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/28 ,  H05K3/46

Abstract: A plate-shaped multilayer wiring substrate includes at least two resin layers stacked on top of each other and each including an insulating base and a conductive pattern provided on the insulating base, and a front surface layer joined onto the resin layers stacked. The front surface layer has a higher elastic modulus than an elastic modulus of the insulating bases. A joint interface between the resin layers and the front surface layer includes projections and depressions. Also, a method for manufacturing the plate-shaped multilayer wiring substrate includes a step of stacking, on top of resin layers, a front surface layer having a higher elastic modulus than an elastic modulus of the resin layers, and a step of performing pressing under pressure from above the front surface layer by using a flat surface in a heated state to join the resin layers and the front surface layer.

公开(公告)号：US20240206060A1

公开(公告)日：2024-06-20

申请号：US18586832

申请日：2024-02-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryosuke TAKADA ,  Michiharu NISHIMURA

IPC: H05K1/03 ,  B32B3/26 ,  B32B27/08 ,  C08J5/04 ,  C08J5/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/0346 ,  B32B3/263 ,  B32B27/08 ,  C08J5/04 ,  C08J5/18 ,  H05K1/0271 ,  H05K1/034 ,  H05K1/0353 ,  H05K1/0373 ,  H05K3/4626 ,  C08J2325/04 ,  C08J2327/12 ,  C08J2365/00 ,  H05K1/118 ,  H05K2201/0141 ,  H05K2201/068 ,  H05K2203/065

Abstract: A resin sheet that contains one or more kinds of resin materials and a liquid crystal polymer, wherein a weight of the liquid crystal polymer is less than a total weight of the one or more kinds of resin materials. The resin sheet has a thermal expansion coefficient in a plane direction smaller than a thermal expansion coefficient in the plane direction of a comparative resin sheet containing the one or more kinds of resin materials and not containing the liquid crystal polymer.

公开(公告)号：US20220377886A1

公开(公告)日：2022-11-24

申请号：US17881702

申请日：2022-08-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke KAMITSUBO ,  Tsuyoshi KATSUBE ,  Ryosuke TAKADA

IPC: H05K1/03 ,  H05K3/46 ,  H05K3/00 ,  H05K1/02

Abstract: A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.

公开(公告)号：US20220151066A1

公开(公告)日：2022-05-12

申请号：US17584589

申请日：2022-01-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryosuke TAKADA ,  Michiharu NISHIMURA

IPC: H05K1/03 ,  H05K3/46

Abstract: A resin multilayer substrate that includes a substrate having a plurality of laminated resin layers containing a norbornene-based polymer. A resin layer has an altered portion altered by a surface treatment and formed at an interface with a resin layer adjacent thereto in a lamination direction. An adhesion at an interface having the altered portion is greater than an adhesion at an interface with a non-altered portion.

公开(公告)号：US20210283890A1

公开(公告)日：2021-09-16

申请号：US17331744

申请日：2021-05-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke KAMITSUBO ,  Tsuyoshi KATSUBE ,  Ryosuke TAKADA

IPC: B32B27/08 ,  B32B27/30 ,  H05K3/40 ,  H05K3/42 ,  H05K3/32 ,  B32B37/10 ,  B32B3/26 ,  B32B27/18 ,  B32B15/08

Abstract: A resin multilayer substrate includes a laminate including resin layers including a first resin layer and a second resin layer that are laminated, a via conductor in the first resin layer, and a joint portion that includes at least a portion in the second resin layer and is joined to the via conductor. The joint portion is more brittle than the via conductor. A linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer.

公开(公告)号：US20210345487A1

公开(公告)日：2021-11-04

申请号：US17368912

申请日：2021-07-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiromasa KOYAMA ,  Ryosuke TAKADA ,  Atsushi KASUYA

IPC: H05K1/11 ,  H05K3/46 ,  H05K1/02 ,  H05K1/18

Abstract: A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.

公开(公告)号：US20200245460A1

公开(公告)日：2020-07-30

申请号：US16850174

申请日：2020-04-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiromasa KOYAMA ,  Ryosuke TAKADA ,  Atsushi KASUYA

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46

Abstract: A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.