公开(公告)号：US20210267051A1

公开(公告)日：2021-08-26

申请号：US17319396

申请日：2021-05-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke KAMITSUBO ,  Ryosuke TAKADA ,  Tsuyoshi KATSUBE ,  Yasuhiro KURATANI ,  Shigeru TAGO ,  Tomohiro FURUMURA

IPC: H05K1/03 ,  H05K1/14 ,  H05K1/11 ,  H05K3/42 ,  H05K3/00 ,  H05K3/46

Abstract: A resin multilayer substrate includes a multilayer body including resin layers and adhesive layers that are laminated, via conductors in the resin layers, and bonding portions in the adhesive layers. The bonding portion is connected to the via conductor. One of the resin layer and the adhesive layer is a gas high-permeable layer having a higher gas permeability than the other one. The bonding portion includes an organic substance, or has a higher void content rate per unit plane sectional area than the via conductor. At least a portion of each of the bonding portions contacts the gas high-permeable layers.

公开(公告)号：US20130264723A1

公开(公告)日：2013-10-10

申请号：US13630049

申请日：2012-09-28

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Yoichi MORIYA ,  Tsuyoshi KATSUBE ,  Yuki TAKEMORI ,  Tetsuo KANAMORI ,  Yasutaka SUGIMOTO ,  Takahiro TAKADA

IPC: H01L23/15 ,  H05K1/05

CPC classification number: H01L23/15 ,  B32B18/00 ,  C04B35/117 ,  C04B35/16 ,  C04B35/195 ,  C04B37/021 ,  C04B37/025 ,  C04B2235/3203 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3262 ,  C04B2235/3409 ,  C04B2235/365 ,  C04B2235/6025 ,  C04B2235/652 ,  C04B2235/656 ,  C04B2235/6582 ,  C04B2235/77 ,  C04B2237/10 ,  C04B2237/341 ,  C04B2237/407 ,  C04B2237/56 ,  C04B2237/60 ,  C04B2237/704 ,  C04B2237/708 ,  C23C24/082 ,  C23C28/04 ,  H01L23/142 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/15192 ,  H05K1/053 ,  Y10T156/10 ,  Y10T428/2495 ,  Y10T428/265

Abstract: In a metal base substrate with a low-temperature sintering ceramic layer located on a copper substrate, bonding reliability is increased between the copper substrate and the low-temperature sintering ceramic layer. A raw laminated body is prepared by stacking, on a surface of a copper substrate, a low-temperature sintering ceramic green layer including a low-temperature sintering ceramic material containing about 10 mol % to about 40 mol % of barium in terms of BaO and about 40 mol % to about 80 mol % of silicon in terms of SiO2, and this raw laminated body is subjected to firing at a temperature at which the low-temperature sintering ceramic green layer is sintered. In the thus obtained metal base substrate, a glass layer composed of Cu—Ba—Si based glass with a thickness of about 1 μm to about 5 μm is formed between the metal substrate and the low-temperature sintering ceramic layer.

Abstract translation: 在具有位于铜基板上的低温烧结陶瓷层的金属基底中，在铜基底和低温烧结陶瓷层之间的粘合可靠性提高。 通过在铜基材的表面上层叠包含以BaO换算含有约10mol％至约40mol％的钡的低温烧结陶瓷材料的低温烧结陶瓷生坯层来制备原料层压体，以及 约40mol％至约80mol％的SiO 2，并将该原料层压体在低温烧结陶瓷生坯层烧结的温度下进行烧制。 在这样得到的金属基底基板上，在金属基板和低温烧结陶瓷层之间形成由厚度约1μm〜5μm左右的Cu-Ba-Si系玻璃构成的玻璃层。

公开(公告)号：US20220377886A1

公开(公告)日：2022-11-24

申请号：US17881702

申请日：2022-08-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke KAMITSUBO ,  Tsuyoshi KATSUBE ,  Ryosuke TAKADA

IPC: H05K1/03 ,  H05K3/46 ,  H05K3/00 ,  H05K1/02

Abstract: A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.

公开(公告)号：US20210283890A1

公开(公告)日：2021-09-16

申请号：US17331744

申请日：2021-05-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke KAMITSUBO ,  Tsuyoshi KATSUBE ,  Ryosuke TAKADA

IPC: B32B27/08 ,  B32B27/30 ,  H05K3/40 ,  H05K3/42 ,  H05K3/32 ,  B32B37/10 ,  B32B3/26 ,  B32B27/18 ,  B32B15/08

Abstract: A resin multilayer substrate includes a laminate including resin layers including a first resin layer and a second resin layer that are laminated, a via conductor in the first resin layer, and a joint portion that includes at least a portion in the second resin layer and is joined to the via conductor. The joint portion is more brittle than the via conductor. A linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer.

公开(公告)号：US20210212203A1

公开(公告)日：2021-07-08

申请号：US17206303

申请日：2021-03-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke KAMITSUBO ,  Tsuyoshi KATSUBE ,  Ryosuke TAKADA

IPC: H05K1/03 ,  H05K3/46

Abstract: A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.

公开(公告)号：US20130266782A1

公开(公告)日：2013-10-10

申请号：US13630044

申请日：2012-09-28

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Yoichi MORIYA ,  Tsuyoshi KATSUBE ,  Yuki TAKEMORI ,  Yasutaka SUGIMOTO ,  Takahiro TAKADA

IPC: B32B7/02

CPC classification number: B32B7/02 ,  H01L23/142 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01047 ,  H01L2924/09701 ,  H01L2924/15192 ,  H05K3/0061 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2201/068 ,  H05K2203/049 ,  Y10T428/24942 ,  Y10T428/2495 ,  H01L2924/00 ,  H01L2924/00011

Abstract: In a metal base substrate with a low-temperature sintering ceramic layer provided on a metal substrate, while making it possible to make the metal substrate from copper, the low-temperature sintering ceramic layer is less likely to crack or peel at the interface with the metal substrate, and the anti-peeling strength of a surface conductor is improved. In the metal base substrate, the thermal expansion coefficient of the metal substrate is greater than the thermal expansion coefficient of the low-temperature sintering ceramic layer, the average difference in thermal expansion coefficients of the metal substrate and the low-temperature sintering ceramic layer at approximately 25° C. to 400° C. is about 4 ppm/° C. to about 9 ppm/° C., and the low-temperature sintering ceramic layer has a Young's modulus less than about 120 GPa, and a flexural strength of about 200 MPa or more.

Abstract translation: 在金属基板上设置有低温烧结陶瓷层的金属基底板中，由于能够将金属基板从铜制成，所以低温烧结陶瓷层在与金属基板的界面处不易发生裂纹或剥离 金属基材，表面导体的抗剥离强度提高。 在金属基底中，金属基板的热膨胀系数大于低温烧结陶瓷层的热膨胀系数，金属基板和低温烧结陶瓷层的热膨胀系数的平均差异 约25℃至400℃为约4ppm /℃至约9ppm /℃，低温烧结陶瓷层的杨氏模量小于约120GPa，弯曲强度为 约200MPa以上。