-
公开(公告)号：US20200148922A1
公开(公告)日：2020-05-14
申请号：US16614351
申请日：2018-05-18
Applicant: NAMICS CORPORATION
Inventor： Fuminori ARAI , Kazuki IWAYA
Abstract: A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below.
-
公开(公告)号：US20180044478A1
公开(公告)日：2018-02-15
申请号：US15556955
申请日：2016-03-08
Applicant: NAMICS CORPORATION
Inventor： Kazuki IWAYA , Fuminori ARAI
IPC: C08G75/045 , C09J181/02
CPC classification number: C08G75/045 , C08G75/0222 , C08L63/08 , C09J11/06 , C09J133/00 , C09J133/06 , C09J133/08 , C09J163/08 , C09J181/02 , C08K5/378 , C08L33/068 , C08L2312/00
Abstract: There is provided a photocurable and thermosetting resin composition which suppresses decrease of adhesive strength in a moisture resistance test of the cured resin composition, and has a sufficiently long pot life. The resin composition includes (A) an acrylic resin, (B) a multifunctional nitrogen-containing heterocyclic compound represented by a specific chemical formula, (C) a latent curing agent, (D) a radical polymerization inhibitor, and (E) an anionic polymerization retarder. The resin composition preferably further includes (F) a compound having a glycidyl group, other than the acrylic resin.
-
公开(公告)号：US20210380851A1
公开(公告)日：2021-12-09
申请号：US17282696
申请日：2019-10-04
Applicant: NAMICS CORPORATION
Inventor： Ayako SATO , Fuminori ARAI
IPC: C09J135/02 , C08F122/14 , C09J4/00
Abstract: A resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) an initiator comprising at least one basic substance, and (c) an anionic polymerization inhibitor including at least one borate ester compound.
-
公开(公告)号：US20180265756A1
公开(公告)日：2018-09-20
申请号：US15758342
申请日：2016-09-01
Applicant: NAMICS Corporation
Inventor： Fuminori ARAI , Kazuki IWAYA
IPC: C09J163/00 , C09J11/06 , C08K5/378 , C08K5/5419 , C08K5/3415 , C08K5/55 , C08K5/56
CPC classification number: C09J163/00 , C08G59/24 , C08G59/66 , C08K5/3415 , C08K5/378 , C08K5/5419 , C08K5/55 , C08K5/56 , C09J11/06 , C08L63/00
Abstract: The present invention provides a resin composition that is thermally curable at a temperature of approximately 80° C., excellent in PCT tolerance, and, therefore, suitable as a one-component adhesive to be used during manufacture of image sensor modules or electronic components. The resin composition contains (A) an epoxy resin; (B) a compound represented by formula (1) below; (C) a curing accelerator; and (D) a silane coupling agent. The compound of the (B) component has a content of 1:0.3 to 1:2.5, in terms of an equivalent ratio between epoxy groups in the epoxy resin of the (A) component and thiol groups in the compound of the (B) component, the silane coupling agent of the (D) component has a content of 0.2 parts by mass to 60 parts by mass with respect to 100 parts by mass in total of the (A) component, the (B) component, the (C) component, and the (D) component, and an equivalent ratio between thiol groups in the compound of the (B) component and Si in the silane coupling agent of the (D) is 1:0.002 to 1:1.
-
Patent Agency Ranking
公开(公告)号：US20210388128A1
公开(公告)日：2021-12-16
申请号：US17283540
申请日：2019-10-08
Applicant: NAMICS CORPORATION
Inventor： Fuminori ARAI
Abstract: A curing agent composition is capable of curing a base resin containing a 2-methylene-1,3-dicarbonyl compound. The curing agent composition contains a specific 2-methylene-1,3-dicarbonyl compound and an initiator. A two-part mixing adhesive contains the curing agent composition and a base resin containing another specific 2-methylene-1,3-dicarbonyl compound.
-
公开(公告)号：US20180051127A1
公开(公告)日：2018-02-22
申请号：US15556964
申请日：2016-03-09
Applicant: NAMICS CORPORATION
Inventor： Fuminori ARAI
CPC classification number: C08G59/66 , C08G59/184 , C08G59/56 , C08G59/621 , C08G59/686 , C08K3/36 , C08K5/005 , C08K5/06 , C08K5/378 , C09J11/06 , C09J133/06 , C09J163/00 , G02B7/021 , G02B7/08 , G02B19/0076 , H01L27/14 , H01L27/146 , H01L27/14618 , H01L27/14625
Abstract: The present invention is intended to provide a semiconductor device including adherends bonded with a cured product of an adhesive, the semiconductor device being configured such that a decrease in bonding strength after curing in a moisture resistance test is suppressed. In this semiconductor device, at least two adherends 20 and 70, 70 and 60, 70 and 50 made of at least one material selected from the group consisting of engineering plastic, ceramics, and metal are bonded with a cured product 10 of an adhesive containing (A) thermosetting resin, (B) a particular thiol compound, and (C) a latent curing agent.
-
公开(公告)号：US20200283551A1
公开(公告)日：2020-09-10
申请号：US16759886
申请日：2018-10-30
Applicant: NAMICS CORPORATION
Inventor： Fuminori ARAI , Kazuki IWAYA
IPC: C08F22/10 , C09J4/00 , C09J11/06 , H01L27/146
Abstract: A resin composition contains a 2-methylene-1,3-dicarbonyl compound and an initiator. The 2-methylene-1,3-dicarbonyl compound has a molecular weight of 180 to 10,000, and the initiator contains a basic substance having a pKa of 8 or greater. The 2-methylene-1,3-dicarbonyl compound contains a structural unit represented by the following formula (I)
-
公开(公告)号：US20180051128A1
公开(公告)日：2018-02-22
申请号：US15556978
申请日：2016-03-10
Applicant: NAMICS Corporation
Inventor： Kazuki IWAYA , Fuminori ARAI , Akikazu MATSUDA , Naoto OKUMURA , Takeshi KUMANO
IPC: C08G59/66 , C08K3/34 , C08K5/37 , C08L63/00 , C09J163/00
CPC classification number: C08G59/66 , C08G59/686 , C08K3/34 , C08K5/37 , C08L63/00 , C09J163/00
Abstract: There is provided a resin composition which can be thermoset at a temperature of approximately 80° C., and has excellent PCT resistance and a long pot life. This resin composition is suitable as a one-component adhesive agent to be used during the manufacture of image sensor modules or electronic components. The resin composition according to the present invention is a resin composition having the following characteristics. The resin composition includes (A) a compound represented by formula (1) below, an oligomer having as its basic skeleton a structure represented by formula (2) below, (C) an epoxy resin, and (D) a curing accelerator. The mass ratio ((B)/(A)) between the compound of the (A) component and the oligomer of the (B) component is 5 to 25%. Furthermore, the total content of the compound of the (A) component and the oligomer of the (B) component is 0.5 equivalents to 2.5 equivalents in terms of the ratio of the thiol equivalent of the compound of the (A) component and the oligomer of the (B) component with respect to the epoxy equivalent of the (C) component. In addition, the chloride ion concentration in the resin composition is 230 ppm or less.
-
公开(公告)号：US20170073459A1
公开(公告)日：2017-03-16
申请号：US15125433
申请日：2015-02-16
Applicant: NAMICS CORPORATION
Inventor： Kazuki IWAYA , Fuminori ARAI
IPC: C08G59/66 , C08K5/5435 , C08K5/55 , C08K3/22 , C08K5/06 , C08K5/3462 , C08K3/36 , C08G59/56 , C09J163/00
CPC classification number: C08G59/66 , C08G59/56 , C08K3/22 , C08K3/36 , C08K5/005 , C08K5/06 , C08K5/3462 , C08K5/37 , C08K5/5435 , C08K5/55 , C08K2003/2227 , C08L63/00 , C09J163/00 , C09J2203/326
Abstract: A resin composition containing (A) an epoxy resin; (B) a compound represented by formula (1) below; (C) a curing accelerator; and (D) a silane coupling agent is provided. The compound of the (B) component has a content of 1:0.5 to 1:2.5, in terms of an equivalent ratio between epoxy groups in the epoxy resin of the (A) component and thiol groups in the compound of the (B) component, the silane coupling agent of the (D) component has a content of 0.2 parts by mass to 50 parts by mass with respect to 100 parts by mass in total of the (A) component, the (B) component, the (C) component, and the (D) component, and an equivalent ratio between thiol groups in the compound of the (B) component and Si in the silane coupling agent of the (D) is 1:0.002 to 1:1.
Abstract translation: 提供一种树脂组合物，其适合作为在制造图像传感器模块和电子部件期间使用的单组分粘合剂，这是由于在约80℃的温度下可热固化并具有特殊的PCT耐性。 该树脂组合物的特征在于，含有（A）环氧树脂，（B）式（1）所示的化合物，（C）固化促进剂，（D）硅烷偶联剂， （B）中的组分（A）的环氧树脂中的环氧基和组分（B）的化合物中的硫醇基的当量比为1:0.5至1:2.5，组分（B）的硅烷偶联剂的含量 D）相对于100质量份成分（A），成分（B），成分（C）和成分（D）为0.2〜50质量份，成分化合物中的硫醇基的当量比 （B）和硅烷偶联剂（D）中的Si为1：0.002〜1：1。
-
-
-
-
-
-
-
-
Search Results
9
records
(took 0.011 seconds)
