公开(公告)号：US20200347227A1

公开(公告)日：2020-11-05

申请号：US16957592

申请日：2019-01-29

Applicant: NAMICS CORPORATION

Inventor： Nobuyuki ABE ,  Kazuki IWAYA

IPC: C08L81/02 ,  C09J181/02 ,  C08L33/10 ,  H01L23/29

Abstract: Provided is a resin composition that has high moisture resistance reliability after curing (particularly, high shear strength after a moisture resistance test), is curable at low temperature, and has light curing properties and heat curing properties. There are also provided an adhesive agent containing this resin composition, a cured product of the resin composition, a semiconductor device containing this cured product, and an electronic component containing the semiconductor device. The resin composition includes (A) a multifunctional (meth)acrylate resin, (B) a multifunctional thiol resin, and (C) a calcium carbonate filler having a purity of 99% or more. The component (B) preferably contains a multifunctional thiol resin having no ester bond in the molecule. The resin composition more preferably further contains talc.

公开(公告)号：US20180265756A1

公开(公告)日：2018-09-20

申请号：US15758342

申请日：2016-09-01

Applicant: NAMICS Corporation

Inventor： Fuminori ARAI ,  Kazuki IWAYA

IPC: C09J163/00 ,  C09J11/06 ,  C08K5/378 ,  C08K5/5419 ,  C08K5/3415 ,  C08K5/55 ,  C08K5/56

CPC classification number: C09J163/00 ,  C08G59/24 ,  C08G59/66 ,  C08K5/3415 ,  C08K5/378 ,  C08K5/5419 ,  C08K5/55 ,  C08K5/56 ,  C09J11/06 ,  C08L63/00

Abstract: The present invention provides a resin composition that is thermally curable at a temperature of approximately 80° C., excellent in PCT tolerance, and, therefore, suitable as a one-component adhesive to be used during manufacture of image sensor modules or electronic components. The resin composition contains (A) an epoxy resin; (B) a compound represented by formula (1) below; (C) a curing accelerator; and (D) a silane coupling agent. The compound of the (B) component has a content of 1:0.3 to 1:2.5, in terms of an equivalent ratio between epoxy groups in the epoxy resin of the (A) component and thiol groups in the compound of the (B) component, the silane coupling agent of the (D) component has a content of 0.2 parts by mass to 60 parts by mass with respect to 100 parts by mass in total of the (A) component, the (B) component, the (C) component, and the (D) component, and an equivalent ratio between thiol groups in the compound of the (B) component and Si in the silane coupling agent of the (D) is 1:0.002 to 1:1.

公开(公告)号：US20200283551A1

公开(公告)日：2020-09-10

申请号：US16759886

申请日：2018-10-30

Applicant: NAMICS CORPORATION

Inventor： Fuminori ARAI ,  Kazuki IWAYA

IPC: C08F22/10 ,  C09J4/00 ,  C09J11/06 ,  H01L27/146

Abstract: A resin composition contains a 2-methylene-1,3-dicarbonyl compound and an initiator. The 2-methylene-1,3-dicarbonyl compound has a molecular weight of 180 to 10,000, and the initiator contains a basic substance having a pKa of 8 or greater. The 2-methylene-1,3-dicarbonyl compound contains a structural unit represented by the following formula (I)

公开(公告)号：US20180051128A1

公开(公告)日：2018-02-22

申请号：US15556978

申请日：2016-03-10

Applicant: NAMICS Corporation

Inventor： Kazuki IWAYA ,  Fuminori ARAI ,  Akikazu MATSUDA ,  Naoto OKUMURA ,  Takeshi KUMANO

IPC: C08G59/66 ,  C08K3/34 ,  C08K5/37 ,  C08L63/00 ,  C09J163/00

CPC classification number: C08G59/66 ,  C08G59/686 ,  C08K3/34 ,  C08K5/37 ,  C08L63/00 ,  C09J163/00

Abstract: There is provided a resin composition which can be thermoset at a temperature of approximately 80° C., and has excellent PCT resistance and a long pot life. This resin composition is suitable as a one-component adhesive agent to be used during the manufacture of image sensor modules or electronic components. The resin composition according to the present invention is a resin composition having the following characteristics. The resin composition includes (A) a compound represented by formula (1) below, an oligomer having as its basic skeleton a structure represented by formula (2) below, (C) an epoxy resin, and (D) a curing accelerator. The mass ratio ((B)/(A)) between the compound of the (A) component and the oligomer of the (B) component is 5 to 25%. Furthermore, the total content of the compound of the (A) component and the oligomer of the (B) component is 0.5 equivalents to 2.5 equivalents in terms of the ratio of the thiol equivalent of the compound of the (A) component and the oligomer of the (B) component with respect to the epoxy equivalent of the (C) component. In addition, the chloride ion concentration in the resin composition is 230 ppm or less.

公开(公告)号：US20170073459A1

公开(公告)日：2017-03-16

申请号：US15125433

申请日：2015-02-16

Applicant: NAMICS CORPORATION

Inventor： Kazuki IWAYA ,  Fuminori ARAI

IPC: C08G59/66 ,  C08K5/5435 ,  C08K5/55 ,  C08K3/22 ,  C08K5/06 ,  C08K5/3462 ,  C08K3/36 ,  C08G59/56 ,  C09J163/00

CPC classification number: C08G59/66 ,  C08G59/56 ,  C08K3/22 ,  C08K3/36 ,  C08K5/005 ,  C08K5/06 ,  C08K5/3462 ,  C08K5/37 ,  C08K5/5435 ,  C08K5/55 ,  C08K2003/2227 ,  C08L63/00 ,  C09J163/00 ,  C09J2203/326

Abstract: A resin composition containing (A) an epoxy resin; (B) a compound represented by formula (1) below; (C) a curing accelerator; and (D) a silane coupling agent is provided. The compound of the (B) component has a content of 1:0.5 to 1:2.5, in terms of an equivalent ratio between epoxy groups in the epoxy resin of the (A) component and thiol groups in the compound of the (B) component, the silane coupling agent of the (D) component has a content of 0.2 parts by mass to 50 parts by mass with respect to 100 parts by mass in total of the (A) component, the (B) component, the (C) component, and the (D) component, and an equivalent ratio between thiol groups in the compound of the (B) component and Si in the silane coupling agent of the (D) is 1:0.002 to 1:1.

Abstract translation: 提供一种树脂组合物，其适合作为在制造图像传感器模块和电子部件期间使用的单组分粘合剂，这是由于在约80℃的温度下可热固化并具有特殊的PCT耐性。 该树脂组合物的特征在于，含有（A）环氧树脂，（B）式（1）所示的化合物，（C）固化促进剂，（D）硅烷偶联剂， （B）中的组分（A）的环氧树脂中的环氧基和组分（B）的化合物中的硫醇基的当量比为1:0.5至1:2.5，组分（B）的硅烷偶联剂的含量 D）相对于100质量份成分（A），成分（B），成分（C）和成分（D）为0.2〜50质量份，成分化合物中的硫醇基的当量比 （B）和硅烷偶联剂（D）中的Si为1：0.002〜1：1。

公开(公告)号：US20220177639A1

公开(公告)日：2022-06-09

申请号：US17609365

申请日：2020-04-24

Applicant: NAMICS CORPORATION

Inventor： Osamu SHIMOMURA ,  Kazuki IWAYA

IPC: C08G59/68 ,  B01J27/18 ,  B01J35/02 ,  C08G59/40

Abstract: A latent curing catalyst includes zirconium phosphate fine particles containing a curing accelerator. The zirconium phosphate fine particles containing the curing accelerator do not have a sharp crystalline peak at a diffraction angle (2θ) in a range of 10° to 40° in powder X-ray diffraction and have a broad halo pattern.

公开(公告)号：US20210108025A1

公开(公告)日：2021-04-15

申请号：US16970419

申请日：2019-02-20

Applicant: NAMICS CORPORATION

Inventor： Yohei UESUGI ,  Kazuki IWAYA

IPC: C08G59/68 ,  C09J163/00 ,  C08L63/00 ,  C08G59/66 ,  C08G59/22

Abstract: An epoxy resin composition includes at least one thiol-based curing agent, a main epoxy resin, and a curing catalyst. The at least one thiol-based curing agent includes a non-hydrolyzable polyfunctional thiol compound having at least one hydroxyl group and/or urea bond. The main epoxy resin is at least one main aliphatic polyfunctional epoxy resin selected from a polyethylene glycol diglycidyl ether, a cyclohexane-based diglycidyl ether, and a dicyclopentadiene-based diglycidyl ether. The epoxy resin composition has a viscosity at 25° C. of 0.05 Pa·s or higher and 3 Pa·s or lower

公开(公告)号：US20200148922A1

公开(公告)日：2020-05-14

申请号：US16614351

申请日：2018-05-18

Applicant: NAMICS CORPORATION

Inventor： Fuminori ARAI ,  Kazuki IWAYA

IPC: C09J129/12 ,  H01L23/10 ,  C08J5/24 ,  C08J5/18 ,  C08K3/013 ,  C08K5/00 ,  C08K5/17

Abstract: A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below.

公开(公告)号：US20180044478A1

公开(公告)日：2018-02-15

申请号：US15556955

申请日：2016-03-08

Applicant: NAMICS CORPORATION

Inventor： Kazuki IWAYA ,  Fuminori ARAI

IPC: C08G75/045 ,  C09J181/02

CPC classification number: C08G75/045 ,  C08G75/0222 ,  C08L63/08 ,  C09J11/06 ,  C09J133/00 ,  C09J133/06 ,  C09J133/08 ,  C09J163/08 ,  C09J181/02 ,  C08K5/378 ,  C08L33/068 ,  C08L2312/00

Abstract: There is provided a photocurable and thermosetting resin composition which suppresses decrease of adhesive strength in a moisture resistance test of the cured resin composition, and has a sufficiently long pot life. The resin composition includes (A) an acrylic resin, (B) a multifunctional nitrogen-containing heterocyclic compound represented by a specific chemical formula, (C) a latent curing agent, (D) a radical polymerization inhibitor, and (E) an anionic polymerization retarder. The resin composition preferably further includes (F) a compound having a glycidyl group, other than the acrylic resin.