公开(公告)号：US20190160785A1

公开(公告)日：2019-05-30

申请号：US16312054

申请日：2017-06-26

Applicant: NAMICS CORPORATION

Inventor： Fumikazu KOMATSU ,  Issei AOKI ,  Junya SATO ,  Hiroshi TAKASUGI ,  Shin TERAKI

IPC: B32B15/092 ,  B32B27/20 ,  B32B27/26 ,  C08J5/18 ,  C08K3/22 ,  C08K3/38

Abstract: Provided is a resin composition for a film, which is used for producing the film having excellent insulating properties and thermal conductivity. The provided resin composition for the film contains a thermosetting resin (A) and hexagonal boron nitride secondary agglomerated particles (B). Here, the hexagonal boron nitride secondary agglomerated particles (B) contains hexagonal boron nitride secondary agglomerated particles (B-1) having a cohesive breaking strength of 7 MPa or more and hexagonal boron nitride secondary agglomerated particles (B-2) having a cohesive breaking strength of 3 MPa or more and less than 7 MPa.