公开(公告)号：US20150252217A1

公开(公告)日：2015-09-10

申请号：US14196581

申请日：2014-03-04

Applicant: NAMICS CORPORATION

Inventor： Pawel CZUBAROW ,  Toshiyuki SATO ,  Tsutomu MASUKO

IPC: C09D163/00 ,  H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  C08K3/28 ,  C08K3/04

CPC classification number: C09D163/00 ,  C08G59/5033 ,  C08K3/04 ,  C08K3/22 ,  C08K3/28 ,  C08K3/34 ,  C08K3/38 ,  C08K2003/282 ,  C08K2201/003 ,  C08L63/00 ,  H01L21/563 ,  H01L23/295 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0652 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2732 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29294 ,  H01L2224/29387 ,  H01L2224/29391 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/00 ,  H01L2924/05432 ,  H01L2924/0542 ,  H01L2924/0103 ,  H01L2924/0532 ,  H01L2924/01004 ,  H01L2924/05342 ,  H01L2924/01012 ,  H01L2924/0665 ,  H01L2924/0493 ,  H01L2924/01005 ,  H01L2924/05042 ,  H01L2924/05032 ,  H01L2924/014 ,  H01L2924/00014

Abstract: An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.

Abstract translation: 描述了用于封装粘合线的底部填充组合物和使用该底部填充剂组合物的方法。 有利地，所公开的处于未固化状态的底层填料组合物在约90℃的温度和粘合线厚度约为50微米或更小的温度下，在约2厘米的距离内具有小于约10分钟的流动性值，并且仍然具有 在固化状态下大体积热导率大于约0.8W / mK。