公开(公告)号：US20180208710A1

公开(公告)日：2018-07-26

申请号：US15414582

申请日：2017-01-24

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Cheng-Chung LEE ,  Chen-Hua WU ,  Jaou-Shain YU

IPC: C08G59/06 ,  C09D163/08 ,  C09D5/18 ,  C09D7/00

CPC classification number: C08G59/063 ,  C08G59/08 ,  C09D5/18 ,  C09D7/20 ,  C09D163/04 ,  C09D163/08

Abstract: This invention provides a new dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin with excellent heat resistance, low dielectric constant Dk, low dissipation factor Df having the formula 1. Preparation of dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin in two steps: Step 1, reacting (a1) dicyclopentadiene phenol resin represented by formula 2 with (a2) 2,6-dimethyl phenol in the presence of acid catalyst by (a3) aldehyde compounds to synthesize dicyclopentadiene phenol-2,6-dimethyl phenol copolymer, and Step 2, reacting dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer with excess epichlorhydrin under NaOH condition to prepare dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin. When this dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin according to the present invention is substituted into compositions for laminate, they have low dielectric constant, low dissipation factor, and no delamination after longer than 10 minutes 288° C. soldering test and 2 hours pressure cooking test.

公开(公告)号：US20170363958A1

公开(公告)日：2017-12-21

申请号：US15185841

申请日：2016-06-17

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Cheng-Chung LEE ,  Yeong-Tong HWANG ,  Shih-Hung HSU ,  Shao-En HWANG

IPC: G03F7/031 ,  H05K1/02 ,  H05K1/03 ,  G03F7/038

CPC classification number: G03F7/031 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/038 ,  G03F7/0385 ,  G03F7/0388 ,  H05K3/3452

Abstract: A low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition having excellent photo and thermocurability, and high developability resolution with an alkaline aqueous solution, wherein the dielectric constant is below 3.20 (1 GHz), and the dissipation factor is less than 0.015 (1 GHz); and wherein the composition comprises (A) a photopolymerizable prepolymer; (B) a photopolymerizable vinyl monomer; (C) an epoxy compound; (D) a photopolymerization initiator; (E) an inorganic filler; (F) a catalyst; and (G) an organic solvent.

公开(公告)号：US20170088658A1

公开(公告)日：2017-03-30

申请号：US14869512

申请日：2015-09-29

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Cheng-Chung LEE ,  Chen-Hua WU

IPC: C08G8/32 ,  C08G59/40 ,  C08L63/00

CPC classification number: C08G59/4071 ,  B32B27/38 ,  B32B27/42 ,  C08G8/28 ,  C08G59/621 ,  C08K3/36 ,  C08K7/14 ,  C08L61/06 ,  C08L61/14 ,  C08L63/04 ,  C08L63/08

Abstract: A Formula of a phosphorous fire-retardant hardener having fire-retardant and heat-resistant properties as well as a low-dielectric constant. With a preparation of glass-fiber laminated board, the hardener meets UL-94V fire-retardant requirements and has a dielectric constant of 4.0 (1 GHz).

公开(公告)号：US20190092797A1

公开(公告)日：2019-03-28

申请号：US16137400

申请日：2018-09-20

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Cheng-Chung LEE ,  Chen-Hua WU

IPC: C07F9/6571 ,  C08L63/00 ,  C08G59/40 ,  C08G59/62 ,  C08G59/24 ,  C08K5/5313 ,  C08K5/19 ,  C08K3/36

Abstract: A Formula of a phosphorous fire-retardant hardener having fire-retardant and heat-resistant properties as well as a low-dielectric constant. With a preparation of glass-fiber laminated board, the hardener meets UL-94V fire-retardant requirements and has a dielectric constant 5 of 4.0 (1 GHz).

公开(公告)号：US20170267807A1

公开(公告)日：2017-09-21

申请号：US15071733

申请日：2016-03-16

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Cheng-Chung LEE ,  Yeong-Tong HWANG ,  Chen-Hua WU ,  Jaou-Shain YU

IPC: C08G59/14 ,  H05K1/03 ,  C09D163/00

CPC classification number: H05K1/0373 ,  C08G59/02 ,  C08G65/485 ,  C09D163/00 ,  H05K1/0237 ,  H05K1/0366 ,  H05K2201/012

Abstract: The invention provides a polyphenylene ether modified phenol-benzaldehyde multifunctional epoxy resin with formula (I). whereinA is: PPE are: Z are: Y are: Their manufactured is following steps: polyphenylene ether 100 parts is dissolved in solvent, then phenol-benzaldehyde multifunctional epoxy resin 100˜450 parts and catalyst 0.01˜5 parts are added, stirred and mixed at 90˜180□, for 1˜4 hour, to obtain formula (I) solution. Said product is formulated with compositions for laminate, having excellent electrical properties and heat resistance. The dielectric constant is 4.03 (1 GHz), dissipation factor is 0.0046 (1 GHz) and no delamination longer than 60 minutes dipping in 288 soldering test after 2 hours pressure cooking test. Application is insulating materials for highly reliable electronic components such as EMC, PCB substrates, laminate and insulating plates.