公开(公告)号：US20170363958A1

公开(公告)日：2017-12-21

申请号：US15185841

申请日：2016-06-17

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Cheng-Chung LEE ,  Yeong-Tong HWANG ,  Shih-Hung HSU ,  Shao-En HWANG

IPC: G03F7/031 ,  H05K1/02 ,  H05K1/03 ,  G03F7/038

CPC classification number: G03F7/031 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/038 ,  G03F7/0385 ,  G03F7/0388 ,  H05K3/3452

Abstract: A low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition having excellent photo and thermocurability, and high developability resolution with an alkaline aqueous solution, wherein the dielectric constant is below 3.20 (1 GHz), and the dissipation factor is less than 0.015 (1 GHz); and wherein the composition comprises (A) a photopolymerizable prepolymer; (B) a photopolymerizable vinyl monomer; (C) an epoxy compound; (D) a photopolymerization initiator; (E) an inorganic filler; (F) a catalyst; and (G) an organic solvent.